Light-emitting module emitting color light and method for manufacturing the same, display panel, and electronic device
A light-emitting module includes a carrier circuit board, a light-blocking wall, a light conversion medium layer, and multiple light-emitting chips. The multiple light-emitting chips are packaged on the carrier circuit board, and each light-emitting chip is configured to emit first color light. The light-blocking wall is on the carrier circuit board and surrounds the multiple light-emitting chips. The light conversion medium layer covers the multiple light-emitting chips and part of the carrier circuit board in a space enclosed by the light-blocking wall. The light conversion medium layer is configured to convert the first color light emitted by the light-emitting chips into second color light. One side of the light conversion medium layer away from the carrier circuit board exceeds one side of the light-blocking wall away from the carrier circuit board, and an edge of the light conversion medium layer exceeding the light-blocking wall covers a surface of the light-blocking wall away from the carrier circuit board.
1 . A light-emitting backlight source, comprising:
a carrier circuit board;
a plurality of light-emitting chips packaged on the carrier circuit board, wherein each light-emitting chip is configured to emit first color light;
a light-blocking wall on the carrier circuit board and surrounding the plurality of light-emitting chips; and
a light conversion medium layer covering the plurality of light-emitting chips and part of the carrier circuit board in a space enclosed by the light-blocking wall, wherein the light conversion medium layer is configured to convert the first color light emitted by the light-emitting chips into second color light, one side of the light conversion medium layer away from the carrier circuit board exceeds one side of the light-blocking wall away from the carrier circuit board, and an edge of the light conversion medium layer exceeding the light-blocking wall covers a surface of the light-blocking wall away from the carrier circuit board,
wherein the light-blocking wall has a same color as the second color light at least on an outer surface of the light-blocking wall away from the light-emitting chips.
2 . The light-emitting backlight source of claim 1 , further comprising a decorative film covering the light conversion medium layer, wherein the decorative film comprises a film body and a decorative layer on the film body, the decorative layer comprises at least one of a semitransparent colored ink layer, a texture layer, or a light diffusing ink layer, and the texture layer is transparent or semitransparent; and wherein the semitransparent colored ink layer is configured to make the decorative film present a same color as the semitransparent colored ink layer when the light-emitting chips emit no light, the texture layer is configured to make the decorative film present at least one appearance effect of a pattern effect, a dazzle effect, a matt effect, or a discoloration effect when the light-emitting chips emit no light, and the light diffusing ink layer is configured to evenly disperse light passing through the light diffusing ink layer when the light-emitting chips emit light,
wherein the decorative layer comprises a first texture layer and a second texture layer, the second texture layer comprises a plurality of micro-structures on a surface of the film body away from the light conversion medium layer and a brightness enhancement film covering the plurality of micro-structures, each of the microstructures has at least one reflective surface, and an angle between a reflective surface and the film body is greater than 90°, and the second texture layer is configured to present the dazzle effect; and wherein
the first texture layer is on a surface of the brightness enhancement film away from the film body, the first texture layer has at least one stripe texture of a linear texture, a coil texture, or a wave texture, and the first texture layer is configured to present the pattern effect.
3 . The light-emitting backlight source of claim 2 , wherein the decorative layer further comprises the semitransparent colored ink layer on a surface of the film body close to the light conversion medium layer and the light diffusing ink layer on a surface of the semitransparent colored ink layer close to the light conversion medium layer.
4 . The light-emitting backlight source according to claim 1 , wherein the carrier circuit board is a flexible circuit board (FCB) or a printed circuit board (PCB), or the plurality of light-emitting chips comprise at least one of a light-emitting diode (LED), a mini LED, and a micro LED, or the light-blocking wall is a dam adhesive on the carrier circuit board, or the light conversion medium layer is a fluorescent adhesive layer or a quantum-dot (QD) adhesive layer.
5 . The light-emitting backlight source according to claim 2 , wherein the carrier circuit board is a flexible circuit board (FCB) or a printed circuit board (PCB), or the plurality of light-emitting chips comprise at least one of a light-emitting diode (LED), a mini LED, and a micro LED, or the light-blocking wall is a dam adhesive on the carrier circuit board, or the light conversion medium layer is a fluorescent adhesive layer or a quantum-dot (QD) adhesive layer.
6 . The light-emitting backlight source according to claim 3 , wherein the carrier circuit board is a flexible circuit board (FCB) or a printed circuit board (PCB), or the plurality of light-emitting chips comprise at least one of a light-emitting diode (LED), a mini LED, and a micro LED, or the light-blocking wall is a dam adhesive on the carrier circuit board, or the light conversion medium layer is a fluorescent adhesive layer or a quantum-dot (QD) adhesive layer.
7 . A method for manufacturing a light-emitting backlight source, comprising:
providing a carrier circuit board,
packaging a plurality of light-emitting chips on the carrier circuit board;
forming a light-blocking wall on the carrier circuit board, wherein the light-blocking wall surrounds the plurality of light-emitting chips; and
forming a light conversion medium layer, wherein the light conversion medium layer covers the plurality of light-emitting chips and part of the carrier circuit board in a space enclosed by the light-blocking wall, the light conversion medium layer is configured to convert first color light emitted by the light-emitting chips into second color light, one side of the light conversion medium layer away from the carrier circuit board exceeds one side of the light-blocking wall away from the carrier circuit board, and an edge of the light conversion medium layer exceeding the light-blocking wall covers a surface of the light-blocking wall away from the carrier circuit board,
wherein the light-blocking wall has a same color as the second color light at least on an outer surface of the light-blocking wall away from the light-emitting chips.
8 . The method for manufacturing the light-emitting backlight source of claim 7 , wherein forming the light conversion medium layer comprises:
laying a liquid light conversion medium on the carrier circuit board to make the liquid light conversion medium cover the plurality of light-emitting chips and the light-blocking wall;
covering the liquid light conversion medium with a decorative film;
placing a semi-finished assembly formed by the carrier circuit board, the plurality of light-emitting chips, the light-blocking wall, the liquid light conversion medium, and the decorative film into a molding device, and molding the semi-finished assembly with the molding device until the semi-finished assembly has a preset thickness; and
baking the molded semi-finished assembly, to form the light conversion medium layer after the liquid light conversion medium is cured, and to adhere and cover the decorative film on a surface of the light conversion medium layer away from the carrier circuit board by molding.
9 . The method for manufacturing the light-emitting backlight source of claim 7 , further comprising after the formed light conversion medium layer is in a solid state and the light conversion medium layer is formed:
covering a decorative film on the light conversion medium layer in the solid state, wherein the decorative film is adhesively fixed to a surface of the light conversion medium layer away from the carrier circuit board.
10 . The method for manufacturing the light-emitting backlight source of claim 8 , wherein the decorative film comprises a film body and a decorative layer on the film body, the decorative layer comprises at least one of a semitransparent colored ink layer, a texture layer, or a light diffusing ink layer, and the texture layer is transparent or semitransparent; and wherein
the semitransparent colored ink layer is configured to make the decorative film present a same color as the semitransparent colored ink layer when the light-emitting chips emit no light, the texture layer is configured to make the decorative film present at least one appearance effect of a pattern effect, a dazzle effect, a matt effect, or a discoloration effect when the light-emitting chips emit no light, and the light diffusing ink layer is configured to evenly disperse light passing through the light diffusing ink layer when the light-emitting chips emit light.
11 . The method for manufacturing the light-emitting backlight source of claim 9 , wherein the decorative film comprises a film body and a decorative layer on the film body, the decorative layer comprises at least one of a semitransparent colored ink layer, a texture layer, or a light diffusing ink layer, and the texture layer is transparent or semitransparent; and wherein
the semitransparent colored ink layer is configured to make the decorative film present a same color as the semitransparent colored ink layer when the light-emitting chips emit no light, the texture layer is configured to make the decorative film present at least one appearance effect of a pattern effect, a dazzle effect, a matt effect, or a discoloration effect when the light-emitting chips emit no light, and the light diffusing ink layer is configured to evenly disperse light passing through the light diffusing ink layer when the light-emitting chips emit light.
12 . The method for manufacturing the light-emitting backlight source of claim 8 , further comprising:
cutting down from a surface of the decorative film away from the carrier circuit board along an edge of the light-blocking wall until the carrier circuit board is cut off, to obtain a light-emitting backlight source with a preset shape, wherein a cutting surface generated in cutting is located between an outer side of the light-blocking wall and an inner side of the light-blocking wall.
13 . The method for manufacturing the light-emitting backlight source of claim 9 , further comprising:
cutting down from a surface of the decorative film away from the carrier circuit board along an edge of the light-blocking wall until the carrier circuit board is cut off, to obtain a light-emitting backlight source with a preset shape, wherein a cutting surface generated in cutting is located between an outer side of the light-blocking wall and an inner side of the light-blocking wall.
14 . A display panel, comprising a display screen and the light-emitting backlight source of claim 1 , wherein the light-emitting backlight source is at a non-display side of the display screen.
15 . An electronic device, comprising a housing and a display panel on the housing, wherein the display panel comprises a display screen and the light-emitting backlight source of claim 1 , and the light-emitting backlight source is at a non-display side of the display screen.
16 . The electronic device of claim 15 , wherein the housing has a transparent region, the light-emitting backlight source is at an inner side of the housing, and the light-emitting backlight source is visible on the housing through the transparent region.