IP Library Granted Patent US 12,446,176
Granted Patent B2
US 12,446,176 · App. 18/350,436 · Granted Oct 14, 2025

Electronic device housing

Inventors: Shinichiro Akieda (Tokyo, JP); Takuro Tanabe (Tokyo, JP); Tamotsu Koike (Tokyo, JP)
Assignee: FCL Components Limited
H05K5/061H05K5/069F16J15/104
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,446,176
App. No.
18/350,436
Granted
Oct 14, 2025
Kind
B2
Abstract

A housing for housing an electronic device according to an aspect of the present disclosure includes an upper case and a lower case which are formed so as to mate with each other, a gasket arranged between the upper case and the lower case, an elastically deformable cantilever which is formed on one of the upper case and the lower case and which has a hook, and an engagement portion formed on the other of the upper case and the lower case, wherein when an operation to mate the upper case and the lower case is performed, before the cantilever is completely engaged with the engagement portion, a gap between the upper case and the lower case is sealed by the gasket.

Claims (32)

1. A housing for housing an electronic device, the housing comprising:

an upper case and a lower case which are formed so as to mate with each other,

a gasket arranged between the upper case and the lower case,

an elastically deformable cantilever which is formed on one of the upper case and the lower case and which has a hook, and

an engagement portion formed on the other of the upper case and the lower case,

wherein the upper case and the lower case each have a peripheral wall,

wherein the gasket is arranged between the peripheral walls of the upper case and the lower case,

wherein the cantilever is formed so as to protrude from a distal end of the peripheral wall of the one of the upper case and the lower case,

wherein when an operation to mate the upper case and the lower case is performed, before the cantilever is completely engaged with the engagement portion, a gap between the upper case and the lower case is sealed by the gasket.

2. The housing according to claim 1 ,

wherein the engagement portion is formed as an engagement hole in a rim portion positioned further outside of the peripheral wall of the other of the upper case and the lower case.

3. The housing according to claim 2 ,

wherein the cantilever is formed in a position closer to an inner space than an outermost peripheral surface of the peripheral wall of the one of the upper case and the lower case, and

in a state in which the upper case and the lower case are mated with each other, the cantilever is hidden by the one of the upper case and the lower case.

4. The housing according to claim 3 ,

wherein a notch for pressing the cantilever to disengage the hook from the engagement portion in a state in which the upper case and the lower case are mated is formed in the rim portion of the other of the upper case and the lower case.

5. A housing for housing an electronic device, the housing comprising:

an upper case and a lower case which are formed so as to mate with each other,

a gasket arranged between the upper case and the lower case,

an elastically deformable cantilever which is formed on one of the upper case and the lower case and which has a hook, and

an engagement portion formed on the other of the upper case and the lower case,

wherein when an operation to mate the upper case and the lower case is performed, before the cantilever is completely engaged with the engagement portion, a gap between the upper case and the lower case is sealed by the gasket,

wherein:

the upper case and the lower case each have a peripheral wall,

the gasket is arranged between the peripheral walls of the upper case and the lower case,

the cantilever is formed so as to protrude from a distal end of the peripheral wall of the upper case, and

wherein the engagement portion is formed as an engagement hole in a rim portion positioned further outside of the peripheral wall of the lower case.

6. The housing according to claim 5 ,

wherein the cantilever is formed in a position closer to an inner space than an outermost peripheral surface of the peripheral wall of the upper case, and

in a state in which the upper case and the lower case are mated with each other, the cantilever is hidden by the upper case.

7. The housing according to claim 6 ,

wherein a notch for pressing the cantilever to disengage the hook from the engagement portion in a state in which the upper case and the lower case are mated is formed in the rim portion of the lower case.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE RECEIVING PARTY'S ADDRESS IS "12-4, HIGASHI-SHINAGAWA 4-CHROME, SHINAGAWA-KU, TOKYO, 140-0002, JAPAN" PREVIOUSLY RECORDED AT REEL: 68660 FRAME: 58. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 15, 2024
From: FUJITSU COMPONENT LIMITED
To: FCL COMPONENTS LIMITED
Reel/Frame 069192/0898 →
CHANGE OF NAME Recorded Aug 20, 2024
From: FUJITSU COMPONENT LIMITED
To: FCL COMPONENTS LIMITED
Reel/Frame 068660/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2023
From: AKIEDA, SHINICHIRO
To: FUJITSU COMPONENT LIMITED
Reel/Frame 065485/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: AKIEDA, SHINICHIROU; TANABE, TAKURO; KOIKE, TAMOTSU
To: FUJITSU COMPONENT LIMITED
Reel/Frame 064491/0498 →
Priority Claims (1)
JP 2022-119912 · Jul 27, 2022 · national
Continuity (1)
Related Publication 20240040728A1 · Feb 1, 2024
References Cited (19)
US 5079559A · Umetsu et al. · 1992 [cited by applicant]
US 9728865B1 · Voli · 2017 [cited by applicant]
US 20040157483A1 · Karasik et al. · 2004 [cited by applicant]
US 20060030194A1 · Goetz · 2006 [cited by examiner]
US 20090017778A1 · Akieda · 2009 [cited by applicant]
US 20120118773A1 · Rayner · 2012 [cited by examiner]
US 20120314354A1 · Rayner · 2012 [cited by examiner]
US 20130088130A1 · Rayner · 2013 [cited by applicant]
US 20130146323A1 · Yamaguchi · 2013 [cited by examiner]
US 20140021025A1 · Sersch · 2014 [cited by applicant]
US 20150296636A1 · Wang · 2015 [cited by examiner]
CA 2845703C · 2020 [cited by applicant]
JP H0615364U · 1994 [cited by applicant]
JP H10208717A · 1998 [cited by applicant]
JP 200261618A · 2002 [cited by applicant]
JP 200921936A · 2009 [cited by applicant]
KR 101435081B1 · 2014 [cited by applicant]
U.S. Appl. No. 18/350,368, filed Jul. 11, 2023, naming inventors Akieda et al. [cited by applicant]
Extended Search Report from counterpart European Application No. 23187539.4 dated Jan. 5, 2024, 8 pp. [cited by applicant]