IP Library Granted Patent US 12,000,748
Granted Patent B2
US 12,000,748 · App. 18/350,713 · Granted Jun 4, 2024

Frequency-modulating sensor array

Inventors: Paul M. Hagelin (Saratoga, CA); Charles I. Grosjean (Los Gatos, CA); Lev Goncharov (St. Petersburg, RU)
Assignee: SiTime Corporation
G01L5/16G01L1/146G01L1/205G01L9/001
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Quick Facts
Patent No.
US 12,000,748
App. No.
18/350,713
Granted
Jun 4, 2024
Kind
B2
Abstract

Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.

Claims (67)

1. A device comprising:

a surface;

one or more microelectromechanical systems (MEMS) resonators mounted in proximity to the surface, so as to be stressed and thereby change in resonance frequency as the surface is engaged by a force, the one or more MEMS resonators sufficient to produce at least two electronic signals each representing a different orientation of a resonance mode axis relative to a direction of the force relative to the surface; and

circuitry to receive the at least two electronic signals, and to generate therefrom a signal representing the direction of the force relative to the surface.

2. The device of claim 1 wherein:

the one or more MEMS resonators comprises a first resonator and a second resonator;

the surface has a first axis;

the first resonator and the second resonator are respectively oriented so as to provide different, respective, resonance mode orientations relative to the first axis; and

the at least two electronic signals comprises a first signal, representing a sensed resonance frequency of the first resonator, and a second signal, representing a sensed resonance frequency of the second resonator.

3. The device of claim 1 wherein:

the one or more MEMS resonators comprises a first resonator, the first resonator being a multi-axis-resonance-mode resonator; and

the at least two electronic signals comprises a first signal, representing a sensed resonance frequency of a first resonance-mode axis of the first resonator, and a second signal, representing a sensed resonance frequency of a second resonance-mode axis of the first resonator.

4. The device of claim 3 wherein:

the multi-axis-resonance-mode resonator has an in-plane resonance mode and an out-of-plane resonance mode; and

the signal representing the direction of the force is dependent of change in resonance frequency, if any, with respect to each of the in-plane resonance mode and the out-of-plane resonance mode.

5. The device of claim 1 wherein:

the circuitry comprises readout circuitry to sample each MEMS resonator of the one or more MEMS resonators during time intervals, so as to obtain for each MEMS resonator samples taken at respective times; and

the circuitry to generate the signal representing the direction of the force is to determine the direction of the force relative to the surface in a manner that is dependent on the samples taken at respective times.

6. The device of claim 1 wherein the surface comprises glass and wherein each MEMS resonator of the one or more MEMS resonators is mounted on a substrate, between the substrate and the glass, in a manner so as to be structurally-stressed as the surface is engaged by the force.

7. The device of claim 1 wherein the device further comprises calibration circuitry to, for each MEMS resonator of the one or more MEMS resonators, identify drift frequency drift over time, store compensation information to correct the identified drift, and apply the compensation information so as to dynamically normalize a resonator output.

8. The device of claim 1 wherein the device further comprises circuitry to store calibration information for the one or more MEMS resonators, in the form of at least one polynomial, and apply the calibration information so as to normalize a resonator output.

9. The device of claim 1 wherein:

the one or more MEMS resonators comprises two or more resonators; and

the two or more resonators are characterized by a post-formation wafer-level mass difference, produced as an observable result of a wafer-level mass adjustment frequency trim operation, such that at least one of the two or more resonators is structurally different from at least one other of the two or more resonators.

10. The device of claim 1 wherein:

the circuitry is to store, for each of the at least two electronic signals, a corresponding baseline frequency;

for each of the at least two electronic signals, the circuitry is to identify a frequency deviation relative to the corresponding baseline frequency; and

the circuitry is to calculate the direction dependent on each frequency deviation.

11. The device of claim 1 wherein:

the device further comprises a timing signal generator, to produce a reference timing signal;

for each of the at least two electronic signals, the circuitry is to identify a frequency deviation using the reference timing signal; and

the circuitry is to calculate the direction dependent on each frequency deviation.

12. A device comprising:

a surface;

one or more microelectromechanical systems (MEMS) resonators mounted in proximity to the surface, so as to be stressed and thereby change in resonance frequency as the surface is engaged by a force, the one or more MEMS resonators sufficient to produce at least two electronic signals each representing a different orientation of a resonance mode axis relative to a direction of the force relative to the surface; and

circuitry to sample each MEMS resonator of the one or more MEMS resonators during time intervals, so as to obtain for each MEMS resonator samples taken at respective times, and to generate therefrom a signal representing the direction of the force relative to the surface.

13. The device of claim 12 wherein:

the one or more MEMS resonators comprises a first resonator and a second resonator;

the surface has a first axis;

the first resonator and the second resonator are respectively oriented so as to provide different, respective, resonance mode orientations relative to the first axis; and

the at least two electronic signals comprises a first signal, representing a sensed resonance frequency of the first resonator, and a second signal, representing a sensed resonance frequency of the second resonator.

14. The device of claim 12 wherein:

the one or more MEMS resonators comprises a first resonator, the first resonator being a multi-axis-resonance-mode resonator; and

the at least two electronic signals comprises a first signal, representing a sensed resonance frequency of a first resonance-mode axis of the first resonator, and a second signal, representing a sensed resonance frequency of a second resonance-mode axis of the first resonator.

15. The device of claim 14 wherein:

the multi-axis-resonance-mode resonator has an in-plane resonance mode and an out-of-plane resonance mode; and

the signal representing the direction of the force is dependent of change in resonance frequency, if any, with respect to each of the in-plane resonance mode and the out-of-plane resonance mode.

16. The device of claim 14 wherein the surface comprises glass and wherein each MEMS resonator of the one or more MEMS resonators is mounted on a substrate, between the substrate and the glass, in a manner so as to be structurally-stressed as the surface is engaged by the force.

17. The device of claim 12 wherein the device further comprises calibration circuitry to, for each MEMS resonator of the one or more MEMS resonators, identify drift frequency drift over time, store compensation information to correct the identified drift, and apply the compensation information so as to dynamically normalize a resonator output.

18. The device of claim 12 wherein the device further comprises circuitry to store calibration information for the one or more MEMS resonators, in the form of at least one polynomial, and apply the calibration information so as to normalize a resonator output.

19. The device of claim 12 wherein:

the one or more MEMS resonators comprises two or more resonators; and

the two or more resonators are characterized by a post-formation wafer-level mass difference, produced as an observable result of a wafer-level mass adjustment frequency trim operation, such that at least one of the two or more resonators is structurally different from at least one other of the two or more resonators.

20. The device of claim 12 wherein:

the circuitry is to store, for each of the at least two electronic signals, a corresponding baseline frequency;

for each of the at least two electronic signals, the circuitry is to identify a frequency deviation relative to the corresponding baseline frequency; and

the circuitry is to calculate the direction dependent on each frequency deviation.

21. The device of claim 12 wherein:

the device further comprises a timing signal generator, to produce a reference timing signal;

for each of the at least two electronic signals, the circuitry is to identify a frequency deviation using to the reference timing signal; and

the circuitry is to calculate the direction dependent on each frequency deviation.

22. A device comprising:

a surface;

one or more microelectromechanical systems (MEMS) resonators mounted in proximity to the surface, so as to be stressed and thereby change in resonance frequency as the surface is engaged by a force, the one or more MEMS resonators sufficient to produce at least two electronic signals each representing a different orientation of a resonance mode axis relative to a direction of the force relative to the surface; and

circuitry to

for each of the at least two electronic signals, provide at least one reference, and detect a frequency deviation, if any, using the at least one reference, and

generate, from each detected frequency deviation, a signal representing the direction of the force.

Assignments (4)
SECURITY INTEREST Recorded Jun 30, 2026
From: SITIME CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 075862/0712 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: GROSJEAN, CHARLES I.; HAGELIN, PAUL M.
To: SITIME CORPORATION
Reel/Frame 064218/0084 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: GONCHAROV, LEV
To: LIMITED LIABILITY COMPANY KELLY SERVICES IT SOLUTIONS
Reel/Frame 064218/0080 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: LIMITED LIABILITY COMPANY KELLY SERVICES IT SOLUTIONS
To: SITIME CORPORATION
Reel/Frame 064218/0098 →
Continuity (6)
Continuation 18080243 · Dec 13, 2022
Continuation 17712095 · Apr 2, 2022
Division 15702717 · Sep 12, 2017
Provisional Application 62438987 · Dec 23, 2016
Provisional Application 62393640 · Sep 12, 2016
Related Publication 20240011854A1 · Jan 11, 2024