IP Library Granted Patent US 12,395,778
Granted Patent B2
US 12,395,778 · App. 18/351,480 · Granted Aug 19, 2025

Sensor device

Inventors: Yongshuai Yuan (Shenzhen, CN); Wenjun Deng (Shenzhen, CN); Wenbing Zhou (Shenzhen, CN); Yujia Huang (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Xin Qi (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R1/222G01H11/08G01N29/036G01N29/2406G01N29/2437G01P1/023H04R1/08H04R1/20H04R17/02H04R17/10H04R19/04G01N2291/014G01N2291/022
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,395,778
App. No.
18/351,480
Granted
Aug 19, 2025
Kind
B2
Abstract

The embodiments of the present disclosure provide a sensor device, including: a sensor assembly with a first resonant frequency and a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity may be formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly may change a sound pressure in the acoustic cavity, and the sensor assembly may convert the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly may provide the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency may be in a range of 1000 Hz-10000 Hz.

Claims (45)

1. A sensor device, comprising:

a sensor assembly with a first resonant frequency; and

a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity is formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly change a sound pressure in the acoustic cavity, and the sensor assembly converts the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly provides the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency is in a range of 1000 Hz-10000 Hz.

2. The sensor device of claim 1 , wherein

the sound pickup assembly includes a liquid or a gel; and

the liquid or the gel and a gas in the acoustic cavity form a resonant system with the second resonant frequency.

3. The sensor device of claim 2 , wherein

the sound pickup assembly further includes a supporting component configured to limit a movement of the liquid or the gel.

4. The sensor device of claim 3 , wherein

the supporting component includes a pipe column connected to or in contact with the sensor assembly; and

the pipe column includes a straight pipe column or a curved pipe column.

5. The sensor device of claim 4 , wherein a height of the pipe column is in a range of 0.1 mm-50 mm.

6. The sensor device of claim 4 , wherein a diameter of the pipe column is in a range of 0.01 mm-5 mm.

7. The sensor device of claim 2 , wherein a density of the liquid is 0 g/cm 3 -3 g/cm 3 .

8. The sensor device of claim 2 , wherein a viscosity of the liquid is 1 cst-3000 cst.

9. The sensor device of claim 1 , wherein

the sensor assembly includes a printed circuit board; and

the sound pickup assembly includes a diaphragm connected to the printed circuit board.

10. The sensor device of claim 9 , wherein a modulus of the diaphragm is 100 MPa-300 GPa.

11. The sensor device of claim 9 , wherein a modulus of the diaphragm is 5 GPa-50 GPa.

12. The sensor device of claim 9 , wherein

the sensor assembly includes a second diaphragm; and

a modulus of the diaphragm is 1/100-1/10 of a modulus of the second diaphragm.

13. The sensor device of claim 9 , wherein

the diaphragm is circular; and

a radius of the diaphragm is 500 um-3 mm.

14. The sensor device of claim 1 , wherein

the sound pickup assembly includes a diaphragm, a liquid, and a supporting component, or includes the diaphragm, a gel, and the supporting component;

the liquid and the diaphragm form a resonant system with the second resonant frequency, or the gel and the diaphragm form the resonant system with the second resonant frequency; and

the diaphragm and the supporting component are configured to limit a movement of the liquid or the gel.

15. The sensor device of claim 1 , wherein

the sound pickup assembly includes a diaphragm and a liquid, or includes the diaphragm and a gel; and

the liquid and the diaphragm form a resonant system with the second resonant frequency, or the gel and the diaphragm form the resonant system with the second resonant frequency.

16. The sensor device of claim 1 , wherein

the sound pickup assembly includes a diaphragm, a liquid, a supporting component, and a mass block, or includes the diaphragm, a gel, the supporting component, and the mass block;

the liquid, the diaphragm, and the mass block form a resonant system with the second resonant frequency, or the gel, the diaphragm, and the mass block form the resonant system with the second resonant frequency;

the diaphragm and the supporting component are configured to limit a movement of the liquid or the gel; and

the mass block is placed in the liquid or the gel.

17. The sensor device of claim 1 , wherein

the sound pickup assembly includes a diaphragm, a supporting component, and a mass block;

the diaphragm and the mass block form a resonant system with the second resonant frequency; and

the supporting component is configured to support the diaphragm and the mass block.

18. The sensor device of claim 1 , wherein the second resonant frequency is lower than the first resonant frequency.

19. The sensor device of claim 18 , wherein a difference between the first resonant frequency and the second resonant frequency is in a range of 1000 Hz-10000 Hz.

20. The sensor device of claim 1 , wherein the second resonant frequency is 2000 Hz-10000 Hz.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2023
From: YUAN, YONGSHUAI; DENG, WENJUN; ZHOU, WENBING; HUANG, YUJIA; LIAO, FENGYUN; QI, XIN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 065398/0744 →
CHANGE OF NAME Recorded Oct 31, 2023
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 065398/0760 →
Priority Claims (1)
CN 202110445739.3 · Apr 23, 2021 · national
Continuity (2)
Continuation PCTCN2021112030 · Aug 11, 2021
Related Publication 20230362524A1 · Nov 9, 2023
References Cited (12)
US 20060197411A1 · Hoen et al. · 2006 [cited by applicant]
US 20160142829A1 · Berger et al. · 2016 [cited by applicant]
US 20170111731A1 · Merks-Swolfs · 2017 [cited by applicant]
US 20200404412A1 · Akiyama et al. · 2020 [cited by applicant]
US 20210051416A1 · Masters et al. · 2021 [cited by applicant]
CN 209526861U · 2019 [cited by applicant]
CN 111510834A · 2020 [cited by applicant]
CN 111741418A · 2020 [cited by applicant]
CN 211630374U · 2020 [cited by applicant]
CN 112565995A · 2021 [cited by applicant]
CN 112601169A · 2021 [cited by applicant]
International Search Report in PCT/CN2021/112030 mailed on Jan. 13, 2022, 7 pages. [cited by applicant]