Semiconductor device with metal connector having notch
View Patent ↗A semiconductor device according to an embodiment includes a metal frame separated from a semiconductor chip, and a metal connector connected to the semiconductor chip via a first bonding material on an electrode of the semiconductor chip, and connected to the metal frame via a second bonding material on a disposition surface of the metal frame. The metal connector includes: a first part connected to the first bonding material and serving as a first end; a second part connected to the first part and rising toward the metal frame; a third part connected to the second part and serving as a second end; and a notch that opens on a second-end-side surface formed on the third part, adjacent to a connecting surface connected to the second bonding material, and opposed to a tilted surface of the metal frame adjacent to and tilted with respect to the disposition surface.
1 . A semiconductor device comprising:
a semiconductor chip having an electrode;
a first bonding material provided on the electrode of the semiconductor chip;
a metal frame disposed to be separated from the semiconductor chip;
a second bonding material provided on the metal frame; and
a metal connector connected to the semiconductor chip via the first bonding material and connected to the metal frame via the second bonding material, wherein
the metal frame comprises:
a disposition surface on which the second bonding material is disposed; and
a tilted surface adjacent to the disposition surface and tilted by a predetermined angle with respect to the disposition surface,
the metal connector comprises:
a first part connected to the first bonding material and serving as a first end;
a second part integrally connected to the first part and formed so as to rise toward the metal frame;
a third part integrally connected to the second part and serving as a second end;
a connecting surface formed in the third part and connected to the second bonding material;
a second-end-side surface formed on the third part, adjacent to the connecting surface, and opposed to the tilted surface of the metal frame; and
a notch that opens on the second-end-side surface and penetrates through the third part in a thickness direction,
a direction orthogonal to a direction in which the tilted surface of the metal frame and the second-end-side surface of the metal connector are opposed to each other and to the thickness direction is a width direction of the metal connector, and
the metal connector is set such that a length of the third part in the width direction is longer than a length of the first part in the width direction, and a weight of the third part is larger than a weight of the first part.
2 . The semiconductor device according to claim 1 , wherein, in the direction in which the tilted surface of the metal frame and the second-end-side surface of the metal connector are opposed to each other, a length of the notch of the metal connector is longer than a distance between the tilted surface of the metal frame and the second-end-side surface of the metal connector.
3 . The semiconductor device according to claim 1 , wherein the electrode is a gate electrode, and the metal connector is a gate connector.
4 . The semiconductor device according to claim 1 , wherein the notch is rectangular, semicircular, or V-shaped in the metal connector in a planar view.
5 . A semiconductor device comprising:
a semiconductor chip having an electrode;
a first bonding material provided on the electrode of the semiconductor chip;
a metal frame disposed to be separated from the semiconductor chip;
a second bonding material provided on the metal frame; and
a metal connector connected to the semiconductor chip via the first bonding material and connected to the metal frame via the second bonding material, wherein
the metal frame comprises:
a disposition surface on which the second bonding material is disposed; and
a tilted surface adjacent to the disposition surface and tilted by a predetermined angle with respect to the disposition surface,
the metal connector comprises:
a first part connected to the first bonding material and serving as a first end;
a second part integrally connected to the first part and formed so as to rise toward the metal frame;
a third part integrally connected to the second part and serving as a second end;
a connecting surface formed in the third part and connected to the second bonding material;
a second-end-side surface formed on the third part, adjacent to the connecting surface, and opposed to the tilted surface of the metal frame; and
a notch that opens on the second-end-side surface and penetrates through the third part in a thickness direction, and
in a direction in which the tilted surface of the metal frame and the second-end-side surface of the metal connector are opposed to each other, a length of the notch of the metal connector is longer than a distance between the tilted surface of the metal frame and the second-end-side surface of the metal connector.