Packages and processes for radio frequency mitigation and self-test
A semiconductor component package includes circuitry that can be used both for mitigating radio-frequency interference of signals in the package and for performing self-test procedures of components in the package. The circuitry includes chokes between the I/O pads of the package and a sensor module in the package to attenuate high-frequency RF interference in the package and protect sensors in the package. Each I/O pad may have a corresponding choke. During a self-test procedure, such as a test of a sensor's temperature coefficient of offset, the chokes can be decoupled from the I/O pads and the sensor module and coupled between a current source and a ground. A current can be supplied to the choke to raise the temperature of the package. The chokes may use high-resistance windings to increase heat generation during the self-test procedure.
1 . An electronic device, comprising:
a sensor module comprising a sensing device;
a processor couplable to the sensor module using one or more routing traces;
one or more chokes, each choke of the one or more chokes associated with a respective routing trace of the one or more routing traces;
switching circuitry, wherein the switching circuitry is configured to:
in a first mode of operation, couple the one or more chokes between the sensor module and the processor in a path of the one or more routing traces, and
in a second mode of operation, couple a set of chokes of the one or more chokes between a current source and a ground; and
one or more input/output (I/O) pads, wherein the processor is configured to:
in the second mode of operation, after the switching circuitry couples the set of chokes between the current source and the ground, determine that one or more criteria are satisfied, and
in accordance with the determination that the one or more criteria are satisfied, cause the electronic device to enter the first mode of operation by causing the switching circuitry to uncouple the set of chokes from the current source and the ground and coupling the set of chokes between the sensor module and respective I/O pads of the one or more I/O pads.
2 . The electronic device of claim 1 , further comprising:
a substrate electrically coupled between the sensor module and the processor, the substrate comprising the one or more chokes and at least a portion of each of the one or more routing traces.
3 . The electronic device of claim 1 , wherein the sensor module comprises:
analog-to-digital circuitry coupled with the sensing device for receiving analog signals from the sensing device and converting the analog signals into digital signals to be transmitted on at least one of the one or more routing traces; and
the current source.
4 . The electronic device of claim 1 , wherein the switching circuitry is configured to:
in the second mode of operation, uncouple the set of chokes from the sensor module.
5 . The electronic device of claim 1 , wherein, in the second mode of operation, the processor is configured to select the set of chokes based on a target temperature, a target elapsed time, or a combination thereof.
6 . The electronic device of claim 1 , wherein the processor is configured to, in the second mode of operation, select a direct current (DC) value and cause the current source to supply a DC current having the DC value to the set of chokes.
7 . The electronic device of claim 1 , wherein the processor is configured to cause the electronic device to enter the second mode of operation in response to a determination that a self-test procedure is to be initiated.
8 . The electronic device of claim 1 , wherein the one or more criteria include a first criterion that is satisfied when a pre-determined time duration has elapsed after entering the first mode of operation.
9 . The electronic device of claim 1 , further comprising a temperature sensor for determining a temperature at a location of the electronic device, wherein the one or more criteria include a second criterion that is satisfied when the temperature at the location of the electronic device reaches a threshold.
10 . The electronic device of claim 1 , wherein the sensing device comprises a pressure sensor configured to detect an air pressure outside of the electronic device, a temperature sensor, a humidity sensor, or an accelerometer.
11 . The electronic device of claim 1 , wherein at least one of the one or more chokes comprises insulated wiring wound around a core and configured to attenuate alternating current (AC) signals.
12 . The electronic device of claim 1 , further comprising a radio frequency (RF) antenna.
13 . The electronic device of claim 2 , further comprising:
an enclosure to enclose at least a portion of the sensor module, wherein a surface of the enclosure is in contact with the substrate; and
a gel disposed inside the enclosure and in contact with at least part of the enclosed portion of the sensor module.
14 . The electronic device of claim 2 , wherein the substrate is a ceramic substrate.
15 . The electronic device of claim 6 , wherein the processor is configured to select the DC value based on a target temperature, a target elapsed time, or a combination thereof.
16 . The electronic device of claim 11 , wherein the wiring is formed of a high-resistivity metal having a resistance of at least 4×10 −8 ohms/meter at 20° C.
17 . The electronic device of claim 16 , wherein the wiring comprises tungsten.