Load drive device
A semiconductor device, and an electronic module including the semiconductor device, are described. In an example, the semiconductor device includes a first voltage side terminal arranged to be connected to an external first voltage, a second voltage side terminal arranged to be connected to an external second voltage different from the external first voltage, and a terminal which is adjacent to the first voltage side terminal and is arranged to be connected to one terminal of an external resistor. A current distributor is configured to distribute a current to a direct path to the first voltage side terminal and to a loss path to the terminal. A current driver is configured to perform current control of a current including a current between the first voltage side terminal and the second voltage side terminal.
1. A semiconductor device comprising:
a first voltage side terminal arranged to be connected to an external first voltage,
a second voltage side terminal arranged to be connected to an external second voltage different from the external first voltage,
a third terminal which is adjacent to the first voltage side terminal and is arranged to be connected to one terminal of an external resistor,
a current distributor configured to distribute a current to a direct path to the first voltage side terminal and to a loss path to the third terminal, and
a current driver configured to perform current control of a current including a current between the first voltage side terminal and the second voltage side terminal.
2. The semiconductor device according to claim 1 , wherein the first voltage side terminal is arranged to be connected to another terminal of the external resistor.
3. The semiconductor device according to claim 1 , wherein, in a plan view of the semiconductor device:
the first voltage side terminal is arranged on a first side of the semiconductor device, and
the second voltage side terminal is arranged on a second side of the semiconductor device opposite to the first side of the semiconductor device.
4. The semiconductor device according to claim 3 , wherein the third terminal is on the first side of the semiconductor device.
5. The semiconductor device according to claim 4 , wherein the third terminal is at an end of the first side of the semiconductor device.
6. The semiconductor device according to claim 3 ,
wherein the current driver and the current distributor are integrated in a semiconductor chip of the semiconductor device, and
wherein, in a plan view of the semiconductor chip,
the current distributor is arranged on a first side of the semiconductor chip which is close to the first side of the semiconductor device, and
the current driver is arranged on a second side of the semiconductor chip which is close to the second side of the semiconductor device.
7. The semiconductor device according to claim 1 , wherein the semiconductor device has a heat dissipation pad.
8. The semiconductor device according to claim 7 , wherein the semiconductor device is packaged as a small outline type heat-sink thin shrink small outline package (HTSSOP).
9. The semiconductor device according to claim 7 , wherein the semiconductor device is packaged as a package having pins drawn out only in one direction.
10. The semiconductor device according to claim 1 , wherein the external first voltage is a power source.
11. The semiconductor device according to claim 10 , wherein the first voltage side terminal is arranged to be directly connected to the power source.
12. The semiconductor device according to claim 11 , wherein the second voltage side terminal is arranged to be connected to an external load.
13. The semiconductor device according to claim 1 , wherein the current driver is configured to perform constant current control.
14. The semiconductor device according to claim 1 , wherein the current distributor includes:
a first transistor in the direct path, and
the semiconductor device further includes a controller configured to control the first transistor.
15. The semiconductor device according to claim 14 , wherein the current distributor further includes:
a second transistor in the loss path, and
the controller configured to control the second transistor.
16. The semiconductor device according to claim 15 , wherein the controller includes:
a third terminal voltage detector configured to generate a first differential input voltage from voltage at the third terminal,
a second terminal voltage detector configured to generate a second differential input voltage from the voltage at the second voltage side terminal, and
a differential amplifier configured to generate a control signal for the current distributor according to a difference value between the first differential input voltage and the second differential input voltage.
17. An electronic module comprising:
a semiconductor device on a module board,
an external resistor with one terminal connected to a first terminal of the semiconductor device,
wherein the first terminal of the semiconductor device is arranged to be connected to an external first voltage, and a second terminal of the semiconductor device is arranged to be connected to an external second voltage different from the external first voltage,
wherein the semiconductor device includes:
a third terminal which is adjacent to the first voltage side terminal and is arranged to be connected to another terminal of an external resistor,
a current distributor configured to distribute a current to a direct path to the first voltage side terminal and to a loss path to the third terminal, and
a current driver configured to perform current control of a current including a current between the first voltage side terminal and the second voltage side terminal.
18. The electronic module according to claim 17 , wherein, in a plan view of the semiconductor device:
the first voltage side terminal is arranged on a first side of the semiconductor device, and
the second voltage side terminal is arranged on a second side of the semiconductor device opposite to the first side of the semiconductor device, and
the third terminal is at an end of the first side of the semiconductor device.
19. The electronic module according to claim 17 , wherein:
the semiconductor device has a heat dissipation pad, and
the semiconductor device is packaged as a small outline type heat-sink thin shrink small outline package (HTSSOP).
20. The electronic module according to claim 17 , wherein:
the external first voltage is a power source, the first voltage side terminal is arranged to be directly connected to the power source, and the second voltage side terminal is arranged to be connected to an external load.