Wire bond wires for interference shielding
Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.
1. An apparatus, comprising:
a substrate of a system-in-package, wherein the substrate comprises a first side and a second side opposite the first side;
a first and a second microelectronic device coupled to the first side of the substrate;
an EMI shield comprising a plurality of wire bond wires having first ends coupled to the first side of the substrate and second ends extending away therefrom, wherein the second microelectronic device is separated from the first microelectronic device by at least a portion of the EMI shield; and
a conductive cover, wherein:
the conductive cover extends along a top portion of the system-in-package; and
the conductive cover extends along at least a portion of one or more sides of the system-in-package.
2. The apparatus according to claim 1 , wherein the conductive cover is part of a top portion of the EMI shield.
3. The apparatus according to claim 1 , wherein the conductive cover is coupled to the substrate.
4. The apparatus according to claim 1 , wherein the conductive cover extends from the top portion of the system-in-package to the first side of the substrate.
5. The apparatus according to claim 1 , wherein:
a first wire bond wire of the plurality of wire bond wires has a first height;
the portion of the one or more sides of the system-in-package has a second height; and
the first height is substantially the same as the second height.
6. The apparatus according to claim 1 , further comprising additional wire bond wires connected to the conductive cover.
7. The apparatus according to claim 1 , further comprising a second EMI shield comprising additional wire bond wires having first ends coupled to the first side of the substrate.
8. The apparatus according to claim 1 , wherein at least a portion of the plurality of wire bond wires substantially shield the first microelectronic device from interference at one or more frequencies generated by the second microelectronic device.
9. The apparatus according to claim 1 , wherein at least a portion of the plurality of wire bond wires substantially shield the second microelectronic device from interference at the one or more frequencies generated by the first microelectronic device.
10. The apparatus according to claim 1 , wherein
the first microelectronic device is an active device; and
the second microelectronic device is a passive device.
11. The apparatus according to claim 1 , wherein at least a portion of the plurality of wire bond wires are uniformly spaced apart from one another.
12. The apparatus according to claim 1 , wherein at least a portion of the plurality of wire bond wires are not uniformly spaced apart from one another.
13. An apparatus, comprising:
a substrate of a system-in-package, wherein the substrate comprises a first side and a second side opposite the first side;
a first and a second microelectronic device coupled to the first side of the substrate;
a plurality of wire bond wires having first ends coupled to the first side of the substrate and second ends extending away therefrom, wherein the second microelectronic device is separated from the first microelectronic device by at least two wire bonds of the plurality of wire bonds; and
a conductive cover, wherein:
the conductive cover extends along a top portion of the system-in-package;
the conductive cover extends along at least a portion of one or more sides of the system-in-package; and
the conductive cover is grounded.
14. The apparatus according to claim 13 , further comprising an EMI shield comprising a portion of the plurality of wire bond wires, wherein the conductive cover is part of a top portion of the EMI shield.
15. The apparatus according to claim 13 , wherein the conductive cover is coupled to the substrate.
16. The apparatus according to claim 13 , wherein the conductive cover extends from the top portion of the system-in-package to the first side of the substrate.
17. The apparatus according to claim 13 , wherein:
a first wire bond wire of the plurality of wire bond wires has a first height;
the portion of the one or more sides of the system-in-package has a second height; and
the first height is substantially the same as the second height.
18. The apparatus according to claim 13 , further comprising additional wire bond wires connected to the conductive cover.
19. The apparatus according to claim 13 , further comprising an EMI shield comprising additional wire bond wires having first ends coupled to the first side of the substrate.
20. The apparatus according to claim 13 , wherein at least a portion of the plurality of wire bond wires substantially shield the first microelectronic device from interference at one or more frequencies generated by the second microelectronic device.
21. The apparatus according to claim 13 , wherein at least a portion of the plurality of wire bond wires substantially shield the second microelectronic device from interference at the one or more frequencies generated by the first microelectronic device.
22. The apparatus according to claim 13 , wherein
the first microelectronic device is an active device; and
the second microelectronic device is a passive device.
23. The apparatus according to claim 13 , wherein at least a portion of the plurality of wire bond wires are uniformly spaced apart from one another.
24. The apparatus according to claim 13 , wherein at least a portion of the plurality of wire bond wires are not uniformly spaced apart from one another.
25. The apparatus according to claim 13 , wherein the plurality of wire bond wires are part of a bond via array having a staggered spacing between rows and/or columns.