Vapor chamber
A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.
1 . A vapor chamber, comprising:
a first cover;
a second cover, wherein the second cover and the first cover are bonded together to form a heat dissipation space, the second cover has at least two through holes, the at least two through holes correspond to the heat dissipation space, and the at least two through holes are configured for at least two pipes to be inserted therein; and
a partition, located in the heat dissipation space and protruding from the first cover, wherein the partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other, the partition surrounds the open subspace, and the open subspace is in fluid communication with the at least two through holes:
wherein the first cover comprises a plate and a thermally conductive protrusion, the thermally conductive protrusion protrudes from the plate along a direction away from the heat dissipation space, the heat dissipation space has a vaporization area corresponding to the thermally conductive protrusion, the thermally conductive protrusion has a thermal contact surface facing away from the vaporization area, the thermal contact surface is configured to be thermally coupled heat source, the partition is located in the vaporization area, and the partition protrudes from the thermally conductive protrusion;
wherein the first cover comprises a plurality of first supporting structures and a plurality of second supporting structures, the plurality of first supporting structures protrude from the plate, the plurality of second supporting structures protrude from the thermally conductive protrusion, and the plurality of first supporting structures and the plurality of second supporting structures protrude toward and contact the second cover,
wherein the first cover comprises a plurality of thermally conductive protruding plates, the plurality of thermally conductive protruding plates are located in the air tight subspace, the plurality of thermally conductive protruding plates protrude from the thermally conductive protrusion, the plurality of thermally conductive protruding plates are connected to the plurality of second supporting structures, and the plurality of thermally conductive protruding plates are arranged around the partition.
2 . The vapor chamber according to claim 1 , wherein a cross-section area of the air tight subspace surrounding an inner surface of the partition is less than or equal to a contact area between the heat source and the thermal contact surface.
3 . The vapor chamber according to claim 1 , further comprising a wick structure, wherein the wick structure is located in the air tight subspace, and the wick structure is stacked on the first cover, the second cover and a side of the partition.
4 . The vapor chamber according to claim 1 , wherein first cover comprises a plurality of fins, the plurality of fins are located in the open subspace.
5 . The vapor chamber according to claim 4 , wherein a height of each of the plurality of fins is ½ to ⅔ of a height of each of the plurality of thermally conductive protruding plates.
6 . The vapor chamber according to claim 4 , wherein a height of each of the plurality of fins is ¼ to ⅓ of a height of each of the plurality of thermally conductive protruding plates.
7 . The vapor chamber according to claim 1 , wherein a length of the partition is ½ to ⅔ of a length of the thermally conductive protrusion.
8 . The vapor chamber according to claim 1 , wherein a length of the partition is ¼ to ⅓ of a length of the thermally conductive protrusion.
9 . The vapor chamber according to claim 1 , wherein the at least two pipes are located in the vaporization area, and the at least two pipes are inserted into the at least two through holes.