Vacuum insulated panel with seal material thermal diffusivity and/or conductivity
A vacuum insulating panel may include: a first glass substrate; a second glass substrate; a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at a pressure less than atmospheric pressure; a seal provided between at least the first and second substrates, the seal including a first ceramic seal layer and a second ceramic seal layer, wherein the second ceramic seal layer is located between at least the first ceramic seal layer and the first glass substrate; and wherein one or more of: (i) a thermal (TC) conductivity of the first ceramic seal layer is be less than a thermal conductivity of the first glass substrate, and wherein the thermal conductivity of the first glass substrate is less than a thermal conductivity of the second ceramic seal layer, so that the thermal conductivity of the second ceramic seal layer is greater than the thermal conductivity of the first substrate and greater than the thermal conductivity of the first ceramic seal layer; (ii) a thermal conductivity of the second ceramic seal layer is greater than a thermal conductivity of the first ceramic seal layer; and/or (iii) a ratio TDp1/TDg, where TDp1 represents a thermal diffusivity (TD) of the second ceramic seal layer and TDg represents a thermal diffusivity of the first glass substrate, is at least 1.020 and wherein the thermal diffusivity of the second ceramic seal layer is greater than a thermal diffusivity of the first ceramic seal layer.
1. A vacuum insulating panel comprising:
a first glass substrate;
a second glass substrate;
a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at pressure less than atmospheric pressure;
a seal provided at least partially between at least the first and second substrates, the seal comprising a first ceramic seal layer and a second ceramic seal layer, wherein the second ceramic seal layer is located at least partially between at least the first ceramic seal layer and the first glass substrate; and
wherein a thermal conductivity of the first ceramic seal layer is less than a thermal conductivity of the first glass substrate, and wherein the thermal conductivity of the first glass substrate is less than a thermal conductivity of the second ceramic seal layer, so that the thermal conductivity of the second ceramic seal layer is greater than the thermal conductivity of the first substrate and greater than the thermal conductivity of the first ceramic seal layer.
2. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer has a thermal conductivity of from 1.00 to 2.00 W/mK, and the first ceramic seal layer has a thermal conductivity of from 0.75 to 1.00 W/mK.
3. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer has a thermal conductivity of from 1.0 to 1.90 W/mK, and the first ceramic seal layer has a thermal conductivity of from 0.80 to 1.00 W/mK.
4. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer has a thermal conductivity of from about 1.10 to 1.50 W/mK, and the first ceramic seal layer has a thermal conductivity of from about 0.80 to 0.95 W/mK.
5. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer has a thermal conductivity of from about 1.12 to 1.30 W/mK, and the first ceramic seal layer has a thermal conductivity of from about 0.80 to 0.95 W/mK.
6. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer has a thermal conductivity of from about 1.14 to 1.25 W/mK, and the first ceramic seal layer has a thermal conductivity of from about 0.85 to 0.95 W/mK.
7. The vacuum insulating panel of claim 1 , wherein the thermal conductivity of the first glass substrate is from about 0.94 to 1.1 W/mK.
8. The vacuum insulating panel of claim 1 , wherein a ratio TCp1/TCm1, where TCp1 is the thermal conductivity of the second ceramic seal layer and TCm1 is the thermal conductivity of the first ceramic seal layer, is from about 1.2 to 1.5.
9. The vacuum insulating panel of claim 1 , wherein a ratio TCp1/TCm1, where TCp1 is the thermal conductivity of the second ceramic seal layer and TCm1 is the thermal conductivity of the first ceramic seal layer, is from about 1.25 to 1.40.
10. The vacuum insulating panel of claim 1 , wherein a ratio TCp1/TCg, where TCp1 is the thermal conductivity of the second ceramic seal layer and TCg is the thermal conductivity of the first glass substrate, is at least 1.020.
11. The vacuum insulating panel of claim 1 , wherein the first ceramic seal layer comprises from about 20-80 wt. % tellurium oxide, the tellurium oxide comprising TeO 4 and TeO 3 , and wherein the first ceramic seal layer comprises more TeO 3 than TeO 4 by wt. %.
12. The vacuum insulating panel of claim 11 , wherein the first ceramic seal layer comprises from about 40-70 wt. % tellurium oxide.
13. The vacuum insulating panel of claim 11 , wherein from about 60-95% of Te in the first seal layer is in a form of TeO 3 .
14. The vacuum insulating panel of claim 11 , wherein from about 3-35% of Te in the first seal layer is in a form of TeO 4 .
15. The vacuum insulating panel of claim 11 , wherein from about 1-9% of Te in the first ceramic seal layer is in a form of TeO 3+1 .
16. The vacuum insulating panel of claim 11 , wherein a ratio TeO 4 :TeO 3 in the first ceramic seal layer is from about 0.05 to 0.40.
17. The vacuum insulating panel of claim 11 , wherein the first seal layer further comprises vanadium oxide, and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide.
18. The vacuum insulating panel of claim 17 , wherein the vanadium oxide comprises VO 2 and V 2 O 5 , and wherein more V in the first ceramic seal layer is in a form of VO 2 than V 2 O 5 .
19. The vacuum insulating panel of claim 17 , wherein the first ceramic seal layer comprises from about 10-50 wt. % vanadium oxide.
20. The vacuum insulating panel of claim 1 , wherein the first ceramic seal layer is a main seal layer, and the second ceramic seal layer is a primer layer.
21. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer is configured to be located between the first ceramic seal layer and a laser during laser sintering of the first ceramic seal layer.
22. The vacuum insulating panel of claim 1 , wherein the second ceramic seal layer comprises bismuth oxide and boron oxide.
23. The vacuum insulating panel of claim 22 , wherein the second ceramic seal layer comprises from about 1-40 mol % bismuth and from about 3-40 mol % boron on an elemental basis, and wherein the second ceramic seal layer comprises at least two times more boron (B) than bismuth (Bi) on an elemental basis in terms of mol %.
24. The vacuum insulating panel of claim 22 , wherein the second ceramic seal layer comprises from about 2-15 mol % bismuth and from about 5-30 mol % boron on an elemental basis, and wherein the second ceramic seal layer comprises at least three times more boron (B) than bismuth (Bi) on an elemental basis in terms of mol %.
25. The vacuum insulating panel of claim 22 , wherein the second ceramic seal layer comprises from about 1-12 mol % bismuth oxide, from about 15-40 mol % boron oxide, and from about 0-50 mol % silicon oxide.
26. The vacuum insulating panel of claim 1 , wherein the seal further comprises a third ceramic seal layer comprising bismuth oxide and/or boron oxide, the first ceramic seal layer being located between at least the second and third ceramic seal layers.
27. The vacuum insulating panel of claim 26 , wherein the third ceramic seal layer comprises from about 1-40 mol % bismuth and from about 3-40 mol % boron on an elemental basis, and wherein the third ceramic seal layer comprises at least two times more boron (B) than bismuth (Bi) on an elemental basis in terms of mol %.
28. The vacuum insulating panel of claim 26 , wherein for at least one location of the seal, the first seal layer has a first thickness, the second seal layer has a second thickness, and the third seal layer has a third thickness; and wherein the first thickness is greater than the second thickness and less than the third thickness.
29. The vacuum insulating panel of claim 1 , wherein the first ceramic seal layer has a density of from about 2.8-4.0 g/cm 3 , the second ceramic seal layer has a density of from about 3.0-4.2 g/cm 3 , and wherein the density of the second ceramic seal layer is at least about 0.20 g/cm 3 greater than the density of the first ceramic seal layer.
30. The vacuum insulating panel of claim 1 , wherein the seal is substantially lead-free.
31. The vacuum insulating panel of claim 1 , wherein the first seal layer has an average particle size (D50) of from about 5-20 μm.
32. The vacuum insulating panel of claim 1 , wherein the first ceramic seal layer comprises: from about 40-70% wt. % tellurium oxide, from about 12-40 wt. % vanadium oxide, from about 3-30 wt. % aluminum oxide, and from about 1-25 wt. % silicon oxide.
33. The vacuum insulating panel of claim 1 , wherein the first ceramic seal layer is thicker than the second ceramic seal layer.
34. The vacuum insulating panel of claim 33 , wherein the first ceramic seal layer has a physical thickness of from about from about 30-120 μm, and the second ceramic seal layer has a physical thickness of from about 20-70 μm.
35. The vacuum insulating panel of claim 1 , wherein the first and second glass substrates comprise tempered glass substrates or heat strengthened glass substrates.
36. The vacuum insulating panel of claim 1 , wherein the seal is a hermetic edge seal of the vacuum insulating panel.
37. The vacuum insulating panel of claim 1 , wherein the panel is configured for use in a window.
38. A vacuum insulating panel comprising:
a first substrate;
a second substrate;
a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at pressure less than atmospheric pressure;
a seal provided at least partially between at least the first and second substrates, the seal comprising a first ceramic seal layer and a second ceramic seal layer, wherein the second ceramic seal layer is located at least partially between at least the first ceramic seal layer and the first substrate; and
wherein a thermal conductivity of the second ceramic seal layer is greater than a thermal conductivity of the first ceramic seal layer.
39. The vacuum insulating panel of claim 38 , wherein a ratio TCp1/TCm1, where TCp1 is the thermal conductivity of the second ceramic seal layer and TCm1 is the thermal conductivity of the first ceramic seal layer, is from about 1.2 to 1.5.
40. The vacuum insulating panel of claim 38 , wherein a ratio TCp1/TCm1, where TCp1 is the thermal conductivity of the second ceramic seal layer and TCm1 is the thermal conductivity of the first ceramic seal layer, is from about 1.25 to 1.40.
41. The vacuum insulating panel of claim 38 , wherein the second ceramic seal layer has a thermal conductivity of from 1.0 to 1.90 W/mK, and the first ceramic seal layer has a thermal conductivity of from 0.80 to 1.0 W/mK.
42. The vacuum insulating panel of claim 38 , wherein the second ceramic seal layer has a thermal conductivity of from about 1.12 to 1.30 W/mK, and the first ceramic seal layer has a thermal conductivity of from about 0.80 to 0.95 W/mK.
43. The vacuum insulating panel of claim 38 , wherein the first ceramic seal layer comprises from about 20-80 wt. % tellurium oxide, the tellurium oxide comprising TeO 4 and TeO 3 , and wherein the first ceramic seal layer comprises more TeO 3 than TeO 4 by wt. %.
44. The vacuum insulating panel of claim 43 , wherein the first ceramic seal layer comprises from about 40-70 wt. % tellurium oxide.
45. The vacuum insulating panel of claim 43 , wherein from about 60-95% of Te in the first seal layer is in a form of TeO 3 .
46. The vacuum insulating panel of claim 43 , wherein the first seal layer further comprises vanadium oxide, and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide.
47. The vacuum insulating panel of claim 46 , wherein the vanadium oxide comprises VO 2 and V 2 O 5 , and wherein more V in the first ceramic seal layer is in a form of VO 2 than V 2 O 5 .
48. The vacuum insulating panel of claim 38 , wherein the second ceramic seal layer comprises bismuth oxide and boron oxide.
49. The vacuum insulating panel of claim 48 , wherein the second ceramic seal layer comprises from about 1-40 mol % bismuth and from about 3-40 mol % boron on an elemental basis, and wherein the second ceramic seal layer comprises at least two times more boron (B) than bismuth (Bi) on an elemental basis in terms of mol %.
50. The vacuum insulating panel of claim 48 , wherein the second ceramic seal layer comprises from about 2-15 mol % bismuth and from about 5-30 mol % boron on an elemental basis, and wherein the second ceramic seal layer comprises at least three times more boron (B) than bismuth (Bi) on an elemental basis in terms of mol %.
51. The vacuum insulating panel of claim 48 , wherein the second ceramic seal layer comprises from about 1-12 mol % bismuth oxide, from about 15-40 mol % boron oxide, and from about 0-50 mol % silicon oxide.
52. The vacuum insulating panel of claim 38 , wherein the seal further comprises a third ceramic seal layer, the first ceramic seal layer being located between at least the second and third ceramic seal layers.
53. The vacuum insulating panel of claim 38 , wherein the first ceramic seal layer has a density of from about 2.8-4.0 g/cm 3 , the second ceramic seal layer has a density of from about 3.0-4.2 g/cm 3 , and wherein the density of the second ceramic seal layer is at least about 0.20 g/cm 3 greater than the density of the first ceramic seal layer.
54. The vacuum insulating panel of claim 38 , wherein the first ceramic seal layer is thicker than the second ceramic seal layer.
55. A vacuum insulating panel comprising:
a first glass substrate;
a second glass substrate;
a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at a pressure less than atmospheric pressure;
a seal provided at least partially between at least the first and second substrates, the seal comprising a first ceramic seal layer and a second ceramic seal layer, wherein the second ceramic seal layer is located at least partially between at least the first ceramic seal layer and the first glass substrate;
wherein a ratio TDp1/TDg, wherein TDp1 represents a thermal diffusivity of the second ceramic seal layer and TDg represents a thermal diffusivity of the first glass substrate, is at least 1.020; and
wherein the thermal diffusivity of the second ceramic seal layer is greater than a thermal diffusivity of the first ceramic seal layer.
56. The vacuum insulating panel of claim 55 , wherein the second ceramic seal layer has a thermal diffusivity of from 0.0050 to 0.0070 cm 2 /s.
57. The vacuum insulating panel of claim 55 , wherein the second ceramic seal layer has a thermal diffusivity of from 0.0054 to 0.0065 cm 2 /s.
58. The vacuum insulating panel of claim 55 , wherein the second ceramic seal layer has a thermal diffusivity of from 0.0055 to 0.0057 cm 2 /s.
59. The vacuum insulating panel of claim 55 , wherein the first glass substrate has a thermal diffusivity of from 0.0053 to 0.0054 cm 2 /s.
60. The vacuum insulating panel of claim 55 , wherein the ratio TDp1/TDg is at least 1.030.
61. The vacuum insulating panel of claim 55 , wherein the thermal diffusivity of the first glass substrate is less than the thermal diffusivity of the first ceramic seal layer.
62. The vacuum insulating panel of claim 55 , wherein the first ceramic seal layer comprises from about 20-80 wt. % tellurium oxide, the tellurium oxide comprising TeO 4 and TeO 3 , and wherein the first ceramic seal layer comprises more TeO 3 than TeO 4 by wt. %.
63. The vacuum insulating panel of claim 62 , wherein from about 60-95% of Te in the first seal layer is in a form of TeO 3 .
64. The vacuum insulating panel of claim 62 , wherein the first seal layer further comprises vanadium oxide, and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide.
65. The vacuum insulating panel of claim 64 , wherein the vanadium oxide comprises VO 2 and V 2 O 5 , and wherein more V in the first ceramic seal layer is in a form of VO 2 than V 2 O 5 .
66. The vacuum insulating panel of claim 55 , wherein the second ceramic seal layer comprises bismuth oxide and boron oxide.
67. The vacuum insulating panel of claim 66 , wherein the second ceramic seal layer comprises from about 1-40 mol % bismuth and from about 3-40 mol % boron on an elemental basis, and wherein the second ceramic seal layer comprises at least two times more boron (B) than bismuth (Bi) on an elemental basis in terms of mol %.
68. The vacuum insulating panel of claim 55 , wherein the seal further comprises a third ceramic seal layer, the first ceramic seal layer being located between at least the second and third ceramic seal layers.
69. The vacuum insulating panel of claim 55 , wherein the first ceramic seal layer has a density of from about 2.8-4.0 g/cm 3 , the second ceramic seal layer has a density of from about 3.0-4.2 g/cm 3 , and wherein the density of the second ceramic seal layer is at least about 0.20 g/cm 3 greater than the density of the first ceramic seal layer.
70. The vacuum insulating panel of claim 55 , wherein the first ceramic seal layer is thicker than the second ceramic seal layer.
71. A vacuum insulating panel comprising:
a first glass substrate;
a second glass substrate;
a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at pressure less than atmospheric pressure;
a seal provided at least partially between at least the first and second substrates, the seal comprising a first seal layer comprising tellurium oxide and vanadium oxide and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide;
wherein the tellurium oxide comprises TeO 4 and TeO 3 , and wherein the first seal layer comprises more TeO 3 than TeO 4 by wt. %; and
wherein a thermal conductivity of the first seal layer is from 0.75 to 1.00 W/mK.
72. The vacuum insulating panel of claim 71 , wherein the seal further comprises a second seal layer comprising bismuth oxide and/or boron oxide, wherein the second seal layer has a thermal conductivity of from 1.0 to 1.90 W/mK, and the first seal layer has a thermal conductivity of from about 0.80 to 0.95 W/mK.