Electronic device comprising speaker module
According to one or more embodiments of the present disclosure, an electronic device may comprise: a housing; a resonance space which is disposed in the housing and in which a sound-absorbing material is accommodated; and a speaker module which is disposed in the housing and includes an acoustic filter opposite to at least a part of the resonance space, wherein the acoustic filter comprises a first plate including a first through-pattern and a second plate including a second through-pattern opposite to a part of the first through-pattern.
1 . An electronic device comprising:
a housing;
a resonance space located inside the housing;
a sound absorbing material disposed inside the resonance space; and
a speaker module disposed inside the housing, the speaker module comprising a first speaker module surface facing the resonance space and an acoustic filter forming at least a part of the first speaker module surface, and
wherein the acoustic filter comprises:
a first plate comprising a plurality of first through holes,
a second plate coupled to the first plate and comprising a plurality of second through holes, wherein the plurality of second through holes are misaligned with the plurality of first through holes such that each of the plurality of second through holes partially overlaps a corresponding one of the plurality of first through holes, and
an overlap region formed by the plurality of first through holes and the plurality of second through holes partially overlapping with each other.
2 . The electronic device of claim 1 ,
wherein the plurality of first through holes are arranged with respect to at least one first axis, and
wherein the plurality of second through holes are arranged with respect to at least one second axis spaced apart from the at least one first axis.
3 . The electronic device of claim 1 , wherein the acoustic filter further comprises an adhesive member disposed between the first plate and the second plate.
4 . The electronic device of claim 3 , wherein the first plate further comprises a first center region in which the plurality of first through holes are located, and a first periphery region surrounding the first center region,
wherein the second plate further comprises a second center region in which the plurality of first through holes are located, and a second periphery region surrounding the second center region, and
wherein the adhesive member is disposed between the first periphery region and the second periphery region.
5 . The electronic device of claim 1 , wherein the speaker module further comprises a speaker support member configured to support the first plate or the second plate.
6 . The electronic device of claim 5 , wherein the first plate further comprises a first protrusion region facing the second plate and connected to the speaker support member, and
wherein at least a part of the second plate is disposed between the first plate and the speaker support member.
7 . The electronic device of claim 1 ,
wherein the first plate further comprises a first surface facing at least a part of the resonance space, and a second surface opposite to the first surface,
wherein the plurality of first through holes penetrate the first surface and the second surface,
wherein the second plate further comprises a third surface facing the first surface, and a fourth surface opposite to the third surface, and
wherein the plurality of second through holes penetrate the third surface and the fourth surface.
8 . The electronic device of claim 1 , wherein the speaker module further comprises a diaphragm and a coil configured to vibrate the diaphragm.
9 . The electronic device of claim 8 , wherein the housing comprises a speaker hole configured to transmit sound generated by the speaker module to an outside of the electronic device, and
wherein the speaker hole and the acoustic filter are located in different directions relative to the diaphragm.
10 . The electronic device of claim 1 , wherein the first plate and the second plate further comprise at least one of aluminum, stainless steel, and copper.
11 . The electronic device of claim 1 , wherein the plurality of first through holes are and the plurality of second through holes are formed using press processing.
12 . The electronic device of claim 1 , wherein the sound absorbing material comprises a plurality of particles solidified into a synthetic resin.
13 . The electronic device of claim 1 , wherein a shape of the plurality of first through holes are different from a shape of the plurality of second through holes.
14 . An electronic device ocomprising:
a housing;
a resonance space located inside the housing;
a sound absorbing material disposed inside the resonance space; and
a speaker module disposed inside the housing, the speaker module comprising an acoustic filter facing at least a portion of the resonance space,
wherein the acoustic filter comprises:
a first plate comprising a first through pattern;
a second plate comprising a second through pattern facing a portion of the first through pattern; and
an overlap region in which the first through pattern and the second through pattern overlap with each other, and
wherein a first cross-sectional area of the overlap region is smaller than a second cross-sectional area of the first through pattern or a third cross-sectional area of the second through pattern.
15 . The electronic device of claim 14 , wherein a first length of the overlap region is smaller than a second length of the sound absorbing material.
16 . An electronic device comprising:
a housing;
a resonance space located inside the housing;
a sound absorbing material disposed inside the resonance space; and
a speaker module disposed inside the housing, the speaker module comprising an acoustic filter facing at least a portion of the resonance space,
wherein the acoustic filter comprises:
a first plate comprising a first through pattern, a first center region in which the first through pattern is located, and a first periphery region surrounding the first center region;
a second plate comprising a second through pattern facing a portion of the first through pattern, a second center region in which the second through pattern is located, and a second periphery region surrounding the second center region and an adhesive member disposed between the first periphery region and the second periphery region.