Thermal droop compensation in power amplifiers
Systems and methods for thermal droop compensation in power amplifiers are disclosed. In one aspect, a droop compensation circuit is added to a temperature-sensitive active bias circuit in a power amplifier chain. The droop compensation circuit relies on current mirroring to draw a trigger current that may be used by a correction circuit to create an additional bias signal that offsets temperature-induced droop in the power amplifier. Variations contemplate where the bias signal is injected within the power amplifier chain and what form the correction circuit may take (e.g., an attenuator, a variable gain amplifier (VGA), or the like). By compensating for temperature droop in this fashion, rapid pulsing signals that generate rapid pulses of heat may be transmitted across an effectively linear power amplifier chain without having to deal with droop effects.
1 . An amplifier chain comprising:
a power amplifier;
an active bias circuit coupled to the power amplifier, the active bias circuit comprising a heat-sensitive element;
a droop circuit separate and distinct from the active bias circuit and comprising a current mirror comprising a gate coupled to the heat sensitive element and configured to draw current responsive to heat changes in the heat-sensitive element and generate a trigger signal; and
a correction circuit separate and distinct from the active bias circuit, the correction circuit coupled to the power amplifier and the droop circuit and configured to:
receive the trigger signal; and
responsive to receipt of the trigger signal, provide a thermal droop correction to the power amplifier by adjusting an input signal of the power amplifier.
2 . The amplifier chain of claim 1 , wherein the heat-sensitive element comprises a transistor.
3 . The amplifier chain of claim 2 , wherein the transistor comprises a heterojunction bipolar transistor (HBT).
4 . The amplifier chain of claim 1 , wherein the correction circuit comprises a variable gain amplifier.
5 . The amplifier chain of claim 1 , wherein the correction circuit comprises an attenuator.
6 . An amplifier chain comprising:
a power amplifier;
an active bias circuit coupled to the power amplifier, the active bias circuit comprising a heat-sensitive element;
a droop circuit coupled to the heat-sensitive element, the droop circuit comprising a current mirror configured to draw current responsive to changes in the heat-sensitive element and generate a trigger signal, wherein the droop circuit further comprises an operational amplifier (op-amp) coupled to the current mirror through a common node, wherein an output of the op-amp is configured to generate the trigger signal; and
a correction circuit coupled to the power amplifier and the droop circuit and configured to:
receive the trigger signal; and
responsive to receipt of the trigger signal, provide a thermal droop correction to the power.
7 . The amplifier chain of claim 6 , wherein the droop circuit further comprises an ambient temperature sensor coupled to the op-amp.
8 . The amplifier chain of claim 6 , wherein the droop circuit further comprises a voltage divider coupled to a reference voltage and an input of the op-amp.
9 . The amplifier chain of claim 1 , wherein the current mirror comprises two transistors.
10 . The amplifier chain of claim 6 , wherein the correction circuit comprises an attenuator coupled to the op-amp in the droop circuit.
11 . A method of correcting thermal droop in an amplifier chain, comprising:
responsive to heat changes in a heat-sensitive element caused by a proximate power amplifier, triggering a current draw through a gate in a current mirror coupled to the heat-sensitive element by the gate;
causing a voltage imbalance between inputs of an operational amplifier (op-amp);
responsive to the voltage imbalance creating a trigger current at the op-amp for a correction circuit; and
responsive to the trigger current, changing an input signal for the proximate power amplifier with the correction circuit.
12 . The method of claim 11 , further comprising detecting the heat changes in the heat-sensitive element.
13 . The method of claim 12 , wherein detecting the heat changes in the heat-sensitive element comprises generating a base-to-emitter voltage drop change across terminals of a heterojunction bipolar transistor (HBT).
14 . The method of claim 11 , wherein changing the input signal comprises using to an attenuator coupled to the proximate power amplifier.
15 . The method of claim 14 , further comprising adjusting a bias signal to the proximate power amplifier with the attenuator.
16 . The method of claim 11 , wherein changing the input signal comprises using a variable gain amplifier coupled to the proximate power amplifier.
17 . The method of claim 16 , further comprising adjusting a bias signal to the proximate power amplifier with the variable gain amplifier.
18 . A wireless communication device comprising:
an amplifier chain comprising:
a power amplifier;
an active bias circuit coupled to the power amplifier, the active bias circuit comprising a heat-sensitive element;
a droop circuit coupled to the heat-sensitive element, the droop circuit comprising a current mirror configured to draw current responsive to heat changes in the heat-sensitive element and generate a trigger signal, wherein the droop circuit further comprise an operational amplifier (op-amp) coupled to the current through a common node, wherein an output of the op-amp is configured to generate the trigger signal; and
a correction circuit coupled to the power amplifier and the droop circuit and configured to:
receive the trigger signal; and
responsive to receipt of the trigger signal, provide a thermal droop correction to the power amplifier.