Near field communication antenna module
A system is provided for secure communication between a vehicle and a portable communication device. The system includes a PaaK transceiver module having an NFC antenna module with a multilayer PCB. The multilayer PCB includes a plurality of PCB layers arranged in a stacking direction. The NFC antenna module also includes an NFC antenna coil. On each respective PCB layer, the NFC antenna coil is wound around the respective PCB layer at or near a peripheral edge of the respective layer. Each winding entirely around the PCB layer forms a turn. The NFC antenna coil extends between adjacent PCB layers of the multilayer PCB through at least one via, and a total number of PCB layers is greater than two.
1 . A system for secure communication between a vehicle and a portable communication device, the system comprising:
a phone as a key (“PaaK”) transceiver module including
a near field communication (“NFC”) antenna module having a multilayer printed circuit board (“PCB”) with a plurality of PCB layers arranged in a stacking direction, and an NFC antenna coil,
wherein, on each respective PCB layer, the NFC antenna coil is wound around the
respective PCB layer at or near a peripheral edge of the respective layer, wherein each winding around the PCB layer forms a turn, wherein the NFC antenna coil extends between adjacent PCB layers of the multilayer PCB through at least one via, and wherein a total number of PCB layers is greater than two;
wherein a topmost PCB layer of the multilayer PCB includes both a first signal pad and a second signal pad, wherein each of the first signal pad and the second signal pad is arranged on a portion of the topmost PCB layer that is interior to the turns of the NFC antenna coil.
2 . The system of claim 1 , wherein the multilayer PCB includes between 3 and 8 PCB layers.
3 . The system of claim 1 , wherein, for each respective PCB layer, the NFC antenna coil includes a plurality of turns around the respective PCB layer.
4 . The system of claim 1 , wherein a total number of turns of the NFC antenna coil in the plurality of PCB layers is between 2 turns and 100 turns.
5 . The system of claim 1 , wherein the NFC antenna coil is wound at a distance of at least 0.5 millimeters (“mm”) from the peripheral edge of each respective PCB layer.
6 . The system of claim 5 , wherein the NFC antenna coil is wound at a distance between 0.5 mm and 1.0 mm from the peripheral edge of each respective PCB layer.
7 . The system of claim 5 , wherein the NFC antenna coil is wound at a distance between 0.5 mm and 1.5 mm from the peripheral edge of each respective PCB layer.
8 . The system of claim 1 , wherein a sensing distance of the NFC antenna coil is at least 35 mm.
9 . The system of claim 8 , wherein a sensing distance of the NFC antenna coil is at least 50 millimeters.
10 . The system of claim 1 , wherein a number of turns of the NFC antenna coil on a first respective PCB layer is different from a number of turns of the NFC antenna coil on a second respective PCB layer.
11 . The system of claim 1 , wherein a number of turns of the NFC antenna coil on each respective PCB layer is the same.
12 . The system of claim 1 , wherein the at least one via includes a plurality of vias each coupling adjacent PCB layers.
13 . The system of claim 1 , wherein
a first end of the NFC antenna coil is coupled to the first signal pad, and
a second end of the NFC antenna coil is coupled to the second signal pad.
14 . The system of claim 13 , wherein the NFC antenna coil extends from the topmost PCB layer to a bottommost PCB layer through one of the vias.
15 . The system of claim 1 , wherein on at least one respective PCB layer, the at least one via includes a first via and a second via each coupling the respective PCB layer to an adjacent PCB layer, wherein the first via is located at portion of the respective PCB layer exterior to the turns of the NFC antenna coil, and the second via is located at a portion of the respective PCB layer interior to the turns of the NFC antenna coil.
16 . The system of claim 1 , wherein each respective PCB layer has a width of 26 mm and a length of 40 mm.
17 . The system of claim 1 , wherein along the stacking direction, respective turns of the coil on each respective PCB layer are aligned relative to one another.
18 . The system of claim 1 , wherein each turn of the NFC antenna coil is a wound, rectangular shape.
19 . The system of claim 1 , wherein the multilayer PCB further includes a plurality of electronic components arranged interior to the turns of the NFC antenna coil on at least one PCB layer of the multilayer PCB.
20 . A system for secure communication between a vehicle and a portable communication device, the system comprising:
a PaaK transceiver module including
a near field communication (“NFC”) antenna module having a multilayer PCB with a plurality of PCB layers arranged in a stacking direction, and an NFC antenna coil,
wherein, on each respective PCB layer, the NFC antenna coil is wound around the respective PCB layer at or near a peripheral edge of the respective layer, wherein each winding around the PCB layer forms a turn, wherein the NFC antenna coil extends between adjacent PCB layers of the multilayer PCB through at least one via, and wherein a total number of turns is greater than four;
wherein a topmost PCB layer of the multilayer PCB includes both a first signal pad and a second signal pad, wherein each of the first signal pad and the second signal pad is arranged on a portion of the topmost PCB layer that is interior to the turns of the NFC antenna coil.
21 . A system for secure communication between a vehicle and a portable communication device, the system comprising:
a phone as a key (“PaaK”) transceiver module including
a near field communication (“NFC”) antenna module having a multilayer printed circuit board (“PCB”) with a plurality of PCB layers arranged in a stacking direction, and an NFC antenna coil,
wherein, on each respective PCB layer, the NFC antenna coil is wound around the respective PCB layer at or near a peripheral edge of the respective layer, wherein each winding around the PCB layer forms a turn, wherein the NFC antenna coil extends between adjacent PCB layers of the multilayer PCB through at least one via, and wherein along the stacking direction, respective turns of the coil on each respective PCB layer are aligned relative to one another;
wherein a topmost PCB layer of the multilayer PCB includes both a first signal pad and a second signal pad, wherein each of the first signal pad and the second signal pad is arranged on a portion of the topmost PCB layer that is interior to the turns of the NFC antenna coil.