IP Library › Patent Application 18403190
Patent Application
App. No. 18/403,190

BONDING STRUCTURE, AND CONTAINER, PIPE FOR TRANSFERRING HIGHLY PURE ORGANOTIN COMPOUND, AND HIGHLY PURE ORGANOTIN COMPOUND MANUFACTURING APPARATUS HAVING THE SAME

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Quick Facts
Patent No.
US None
App. No.
18/403,190
Abstract

A bonding structure used for forming a sealed space (for example, a container) for containing or transferring an organotin compound, wherein the bonding structure is a structure in which a first member is connected with a second member via a gasket or an O-ring, and the gasket or the O-ring is formed with a fluororesin derived from monomers of at least tetrafluoroethylene and perfluoromethyl vinyl ether.

Claims (19)

1 . A bonding structure, comprising:

a first member; and

a second member connected to the first member via a gasket or an O-ring,

wherein the gasket or the O-ring comprises a fluororesin made from a monomer of at least tetrafluoroethylene and perfluoromethyl vinyl ether.

2 . The bonding structure according to claim 1 , wherein the organotin compound has formula (1),

R p SnX m   (1)

wherein R represents a hydrocarbon group; “p” represents 0 or 1; X represents a hydrolysable substituent; “m” represents an integer of 1 to 4; and m+p represents 2 or 4.

3 . The bonding structure according to claim 1 , wherein the highly pure organotin compound has a purity of not less than 99%.

4 . The bonding structure according to claim 1 , wherein the fluororesin has a crosslinked moiety.

5 . A container, comprising:

the bonding structure of claim 1 .

6 . A pipe, comprising:

the bonding structure of claim 1 .

7 . A manufacturing apparatus for an organotin compound, comprising:

a pipe for transferring an organotin compound having the bonding structure of claim 1 .

8 . The bonding structure according to claim 2 , wherein the organotin compound is represented by the following general formula (1),

R p SnX m   (1)

wherein “p” represents 1; and “m” represents 3.

9 . The bonding structure according to claim 1 , wherein the highly pure organotin compound has a purity of not less than 99.9%.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2024
From: FUKUI, HIROSHI; UEHARA, HISATOSHI
To: MITSUBISHI CHEMICAL CORPORATION; GELEST, INC.
Reel/Frame 067897/0279 →