IP Library › Granted Patent US 12,298,822
Granted Patent B2
US 12,298,822 · App. 18/407,949 · Granted May 13, 2025

Automated system and method for inserting memory modules into motherboards

Inventors: Suk Wong (Sammamish, WA); Umakaran Nemallan (Mississauga, CA); Ryan Schiller (Seattle, WA)
Assignee: Google LLC
G06F1/186H05K13/04
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Quick Facts
Patent No.
US 12,298,822
App. No.
18/407,949
Granted
May 13, 2025
Kind
B2
Abstract

The technology relates to a memory insertion apparatus for pushing memory modules into corresponding memory sockets on a circuit board. The memory insertion apparatus may include a frame and an actuation assembly coupled to the frame, and one or more cam assemblies each rotatably coupled to the frame and operatively coupled to the actuation assembly. Each cam assembly may include a central shaft extending in a longitudinal direction, and a plurality of cams each having a tip configured to engage one of the memory modules, the tip extending from the central shaft in a respective radial direction perpendicular to the longitudinal direction. A center of each cam may be offset from centers of adjacent ones of the cams by a pitch distance that is about equal to a pitch distance between centers of adjacent ones of the memory sockets.

Claims (17)

1. A method for pushing memory modules into corresponding memory sockets with an automated memory insertion apparatus, the method comprising:

rotating one or more cam assemblies relative to a frame, each cam assembly having a central shaft extending in a longitudinal direction and a plurality of cams each extending from the central shaft in a respective radial direction perpendicular to the longitudinal direction, a center of each cam of each of the cam assemblies being offset from centers of adjacent ones of the cams by a pitch distance that is equal to a pitch distance between centers of adjacent ones of the memory sockets; and

applying, by the cams, an insertion force to the memory modules in the corresponding memory sockets.

2. The method of claim 1 , wherein the applying includes the one or more cam assemblies together cooperatively performing a rocking push-in of each of the memory modules into the corresponding memory sockets, such that a first end of each of the memory modules is pushed before a second end thereof.

3. The method of claim 1 , wherein the one or more cam assemblies comprise a first cam assembly and a second cam assembly, and wherein the first cam assembly is rotationally offset relative to the second cam assembly, such that during the rotating, each cam of the first cam assembly contacts a first end of a corresponding one of the memory modules before a corresponding cam of the second cam assembly contacts a second end of the corresponding one of the memory modules.

4. The method of claim 1 , wherein each cam of each of the cam assemblies is offset from an adjacent one of the cams by 120° to 240° about a circumference of the central shaft, such that during the applying, in a sequence, a group of the memory modules, all odd-numbered memory modules in the sequence are inserted into the corresponding memory sockets before any of the even-numbered memory modules in the sequence are inserted into the corresponding memory sockets.

5. The method of claim 1 , wherein the applying includes the one or more cam assemblies together cooperatively performing an in-phase push-in of each of the memory modules into the corresponding memory sockets, such that a first end and a second end of each of the memory modules is pushed simultaneously.

6. The method of claim 1 , wherein the one or more cam assemblies comprise a first cam assembly and a second cam assembly, and wherein the first cam assembly is rotationally aligned in a same orientation relative to the second cam assembly, such that during the rotating, each cam of the first cam assembly contacts a first end of a corresponding one of the memory modules simultaneously with when a corresponding cam of the second cam assembly contacts a second end of the corresponding one of the memory modules.

7. The method of claim 1 , further comprising measuring a distance between the cam assemblies and the memory module.

8. The method of claim 7 , wherein the measuring is performed by a non-contact measuring device.

9. The method of claim 1 , further comprising offsetting each cam of each of the one or more cam assemblies from an adjacent one of the cams by 120° to 240° about a circumference of the central shaft.

10. The method of claim 1 , further comprising arranging the cams of each of the one or more cam assemblies in sequence having odd-numbered and even-numbered ones of the cams.

11. The method of claim 10 , wherein each odd-numbered cam of each of the cam assemblies is offset from a closest one of the odd-numbered cams by 15° to 45° about a circumference of the central shaft.

12. The method of claim 10 , wherein each even-numbered cam of each of the cam assemblies is offset from a closest one of the even-numbered cams by 15° to 45° about a circumference of the central shaft.

13. The method of claim 1 , wherein each of the cam assemblies includes eight cams.

14. The method of claim 1 , wherein each of the cams has a rounded generally triangular shape.

15. The method of claim 1 , wherein each of the one or more cam assemblies includes an identical number and arrangement of cams.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2024
From: WONG, SUK; NEMALLAN, UMAKARAN; SCHILLER, RYAN
To: GOOGLE LLC
Reel/Frame 066080/0988 →
Continuity (2)
Division 17349418 · Jun 16, 2021
Related Publication 20240143046A1 · May 2, 2024
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