IP Library › Granted Patent US 12,716,492
Granted Patent B2
US 12,716,492 · App. 18/409,858 · Granted Aug 25, 2026

Bonding structure, metal gasket or metal o-ring used therein, and container, pipe, and organotin compound manufacturing apparatus having the same

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Quick Facts
Patent No.
US 12,716,492
App. No.
18/409,858
Granted
Aug 25, 2026
Kind
B2
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2024
From: UEHARA, HISATOSHI; FUKUI, HIROSHI
To: MITSUBISHI CHEMICAL CORPORATION; GELEST, INC.
Reel/Frame 067693/0427 →
Continuity (2)
Provisional Application 63444750 · Feb 10, 2023
Related Publication 20240280176A1 · Aug 22, 2024
References Cited (4)
JP 2624941B2 · 1997 [cited by applicant]
JP 2003172452A · 2003 [cited by applicant]
WO WO2011152332A1 · 2011 [cited by examiner]
Machine Translation of WO2011152332 (Year: 2025). [cited by examiner]