Method for manufacturing stretchable circuit board, metal-clad laminated sheet, metal foil with resin, stretchable circuit board, and stretchable circuit mounted article
A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.
1 . A method for manufacturing a stretchable circuit board, the method comprising:
preparing
a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less,
a second stretchable insulating layer, and
a fluid;
forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface;
filling the fluid in the via;
laminating the second stretchable insulating layer on the second surface to seal the via; and
patterning the metal layer.
2 . The method for manufacturing the stretchable circuit board according to claim 1 , wherein
at least one of the first stretchable insulating layer and the second stretchable insulating layer contains an uncured or semi-cured thermosetting resin, and
the method further comprises curing the uncured or semi-cured thermosetting resin between the laminating of the second stretchable insulating layer and the patterning of the metal layer.
3 . A metal-clad laminate comprising:
a metal layer;
a stretchable insulating layer in contact with the metal layer; and
a fluid,
wherein a via is provided inside the stretchable insulating layer and an opening leading to the via is provided on a surface, in contact with the metal layer, of the stretchable insulating layer,
the fluid is encapsulated in the via,
the stretchable insulating layer contains a thermosetting resin, and
a peel strength between the metal layer and the stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less.
4 . The metal-clad laminate according to claim 3 , wherein the stretchable insulating layer has a tensile modulus of 0.1 MPa or more and 100 MPa or less.
5 . The metal-clad laminate according to claim 3 , wherein the thermosetting resin contains an epoxy resin.
6 . The metal-clad laminate according to claim 3 , wherein the fluid is at least one selected from a liquid metal and a heat medium.
7 . The metal-clad laminate according to claim 3 , wherein
the stretchable insulating layer includes a first stretchable insulating layer and a second stretchable insulating layer,
the metal-clad laminate comprises the metal layer, the first stretchable insulating layer, and the second stretchable insulating layer in this order,
the first stretchable insulating layer has a first surface in contact with the metal layer and a second surface in contact with the second stretchable insulating layer,
the first surface has a first opening and the second surface has a second opening, and
the via leads from the first opening to the second opening.
8 . A stretchable circuit board wherein the metal layer in the metal-clad laminate according to claim 3 is a patterned circuit.
9 . A stretchable circuit mounted article wherein an electronic component is mounted on the metal layer in the stretchable circuit board according to claim 8 .
10 . A metal foil with resin comprising:
a metal layer;
a stretchable insulating layer in contact with the metal layer; and
a fluid,
wherein a via is provided inside the stretchable insulating layer and an opening leading to the via is provided on a surface, in contact with the metal layer, of the stretchable insulating layer,
the fluid is encapsulated in the via,
the stretchable insulating layer contains an uncured or semi-cured product of a thermosetting resin, and
a peel strength between the metal layer and the stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less when the stretchable insulating layer containing the thermosetting resin is cured.