LEAK PREVENTION AND DETECTION IN LIQUID-COOLED PACKAGES
Systems and apparatus for adjusting power caps for leak prevention and detection in liquid-cooled packages include a circuit board and a cooling package coupled to, and configured to cool, the circuit board, where the cooling package includes: a package top plate and a package base coupled to the package top plate, where the package base includes: a cooling chamber comprising one or more cooling components, and a leak channel configured to catch and store liquid that has leaked out of the cooling chamber.
1 . An apparatus for leak prevention and detection in liquid-cooled packages, the apparatus comprising:
a package top plate; and
a package base coupled to the package top plate, wherein the package base includes:
a cooling chamber comprising one or more cooling components; and
a leak channel configured to catch and store liquid that has leaked out of the cooling chamber.
2 . The apparatus of claim 1 , wherein the leak channel includes a sensor configured to detect the liquid that has leaked into the leak channel from the cooling chamber.
3 . The apparatus of claim 2 , wherein the sensor comprises a humidity sensor.
4 . The apparatus of claim 2 , further comprising a controller configured to send a signal based on the sensor detecting the liquid in the leak channel.
5 . The apparatus of claim 2 , wherein a floor of the leak channel is sloped towards the sensor.
6 . The apparatus of claim 1 , wherein the leak channel is positioned around a perimeter of the package base.
7 . The apparatus of claim 6 , wherein the leak channel includes multiple sensors positioned within the leak channel around the package base.
8 . The apparatus of claim 1 , wherein at least one of the one or more cooling components includes a vapor chamber.
9 . The apparatus of claim 1 , wherein the package top plate includes one or more ports configured to circulate liquid through the package base.
10 . A system for leak prevention and detection in liquid-cooled packages, the system comprising:
a circuit board; and
a cooling package coupled to the circuit board and configured to cool one or more components on the circuit board, wherein the cooling package includes:
a package top plate; and
a package base coupled to the package top plate, wherein the package base includes:
a cooling chamber comprising one or more cooling components; and
a leak channel configured to catch and store liquid that has leaked out of the cooling chamber.
11 . The system of claim 10 , wherein the leak channel includes a sensor configured to detect the liquid that has leaked into the leak channel from the cooling chamber.
12 . The system of claim 11 , wherein the cooling package comprises a controller configured to send a signal based on the sensor detecting the liquid in the leak channel.
13 . The system of claim 11 , wherein a floor of the leak channel is sloped towards the sensor.
14 . The system of claim 10 , wherein the leak channel is positioned around a perimeter of the package base.
15 . The system of claim 14 , wherein the leak channel includes multiple sensors positioned within the leak channel around the package base.
16 . The system of claim 10 , wherein the package top plate includes one or more ports configured to circulate liquid through the package base.
17 . A method of manufacturing liquid-cooled packages, the method comprising:
positioning one or more cooling components in a cooling chamber of a package base, wherein the package base includes the cooling chamber and a leak channel, wherein the leak channel is configured to catch and store liquid that has leaked out of the cooling chamber; and
coupling the package base to a package top plate.
18 . The method of claim 17 , further comprising positioning, in the leak channel of the package base, a sensor configured to detect the liquid that has leaked into the leak channel from the cooling chamber.
19 . The method of claim 18 , wherein a floor of the leak channel is configured to slope towards the sensor.
20 . The method of claim 18 , wherein the leak channel is positioned around a perimeter of the package base.