Thin film transistor substrate, display apparatus, and method of manufacturing the thin film transistor substrate
Provided are a thin-film transistor substrate that has enhanced electrical characteristics, such as off-current characteristics of a thin-film transistor, without increasing the number of mask processes, a display apparatus, and a method of manufacturing the thin-film transistor substrate. The thin-film transistor substrate includes: a semiconductor layer including a first conductive region, a second conductive region, and a first semiconductor region; a lower electrode disposed on the semiconductor layer and at least partially overlapping the first semiconductor region; and an upper electrode disposed on the lower electrode and at least partially overlapping the first semiconductor region, a first boundary between the first semiconductor region and the first conductive region coincides with an edge of the upper electrode, and a second boundary between the first semiconductor region and the second conductive region coincides with an edge of the lower electrode or an edge of the upper electrode.
1. A method of manufacturing a thin-film transistor substrate, the method comprising:
forming a semiconductor layer on a substrate, the semiconductor layer including a crystallization region and a non-crystallization region;
sequentially forming a lower electrode and an upper electrode on the semiconductor layer; and
injecting impurities into the semiconductor layer by using the upper electrode as a doping mask to form, in the semiconductor layer, a first conductive region, a second conductive region, and a semiconductor region between the first conductive region and the second conductive region,
wherein a first width of the semiconductor region in a first direction is greater than a second width of the lower electrode in the first direction, and
a first boundary between the semiconductor region and the first conductive region is determined by an edge of the upper electrode,
a second boundary between the semiconductor region and the second conductive region is determined by an edge of the lower electrode or an edge of the upper electrode,
the semiconductor region includes a first channel region overlapping the lower electrode and a second channel region that does not overlap the lower electrode but overlaps the upper electrode,
the non-crystallization region includes at least a part of the second channel region, and
the crystallization region includes the second conductive region and at least a part of the first channel region.
2. The method of claim 1 , wherein forming the semiconductor layer includes crystallizing the crystallization region of the semiconductor layer.
3. The method of claim 2 , wherein the crystallizing the crystallization region comprises exposing a first portion of an amorphous silicon layer to a laser,
a mask blocks the laser from exposing a second portion of the amorphous silicon layer, and
the second portion includes the non-crystallization region.
4. The method of claim 1 , wherein the non-crystallization region includes a part of the first conductive region.
5. The method of claim 1 , wherein the non-crystallization region includes a part of the first channel region.
6. The method of claim 1 , wherein the non-crystallization region includes a part of each of the first conductive region and the first channel region.