IP Library › Granted Patent US 12,638,247
Granted Patent B2
US 12,638,247 · App. 18/418,349 · Granted May 26, 2026

Vapor chamber structure and manufacturing method thereof

Inventors: Chin-Sheng Wang (Taoyuan City, TW); Ra-Min Tain (Hsinchu County, TW)
Assignee: Unimicron Technology Corp.
F28D15/046F28D15/0233
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Quick Facts
Patent No.
US 12,638,247
App. No.
18/418,349
Granted
May 26, 2026
Kind
B2
Abstract

A vapor chamber structure includes a first flexible substrate, a second flexible substrate, a spacer, a flexible sealing member, and a working fluid. The first flexible substrate includes a first organic material layer, a first copper foil layer, and a first capillary structure layer. The second flexible substrate includes a second organic material layer, a second copper foil layer, and a second capillary structure layer. The first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are retracted by a distance relative to the first and second organic material layers to form a space. The first and second organic material layers and the flexible sealing member define a sealed chamber. The working fluid is disposed in the sealed chamber and located among the first and second capillary structure layers and grooves of the spacer.

Claims (23)

1 . A vapor chamber structure, comprising:

a first flexible substrate, comprising a first polymer material layer, a first copper foil layer, and a first capillary structure layer, wherein the first copper foil layer is located between the first organic material layer and the first capillary structure layer;

a second flexible substrate, comprising a second polymer material layer, a second copper foil layer, and a second capillary structure layer, wherein the second copper foil layer is located between the second polymer material layer and the second capillary structure layer, at least one of the first polymer material layer and the second polymer material layer has at least one opening, and the at least one opening correspondingly exposes at least one of the first copper foil layer and the second copper foil layer;

a spacer, sandwiched between the first capillary structure layer and the second capillary structure layer and having a top surface, a bottom surface opposite to the top surface, and a plurality of grooves penetrating the spacer and connecting the top surface and the bottom surface, wherein the first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are retracted by a distance relative to the first polymer material layer and the second polymer material layer to form a space;

a flexible sealing member, sealing the space, wherein the first copper foil layer, the second copper foil layer, and the flexible sealing member define a sealed chamber, and the first capillary structure layer, the second capillary structure layer, and the grooves are located in the sealed chamber; and

a working fluid, disposed in the sealed chamber and located among the first capillary structure layer, the second capillary structure layer, and the grooves.

2 . The vapor chamber structure according to claim 1 , wherein each of the first capillary structure layer and the second capillary structure layer comprises a mesh structure layer, and a material of the mesh structure layer comprises metal, alloy, stainless steel, ceramics, glass fiber, carbon, or an polymer plastic material.

3 . The vapor chamber structure according to claim 1 , wherein materials of the first polymer material layer and the second polymer material layer respectively comprise a liquid crystal polymer, polyimide, or silicone.

4 . The vapor chamber structure according to claim 1 , wherein a material of the flexible sealing member comprises a liquid crystal polymer, polyimide, or silicone.

5 . The vapor chamber structure according to claim 1 , wherein the distance ranges from 0.5 cm to 1.5 cm.

6 . The vapor chamber structure according to claim 1 , further comprising:

an adhesive layer, disposed in the space, wherein the flexible sealing member seals the space through the adhesive layer.

7 . The vapor chamber structure according to claim 1 , wherein a material of the spacer comprises stainless steel.

8 . The vapor chamber structure according to claim 1 , wherein the working fluid comprises water.

9 . A manufacturing method of a vapor chamber structure, comprising:

providing a first flexible base material and a second flexible base material, wherein the first flexible base material comprises a first polymer material layer and a first copper foil layer, and the second flexible base material comprises a second polymer material layer and a second copper foil layer;

forming a first capillary structure layer and a second capillary structure layer on the first copper foil layer and the second copper foil layer, respectively, wherein the first copper foil layer is located between the first polymer material layer and the first capillary structure layer, the first polymer material layer, the first copper foil layer, and the first capillary structure layer define a first flexible substrate, the second copper foil layer is located between the second polymer material layer and the second capillary structure layer, and the second polymer material layer, the second copper foil layer, and the second capillary structure layer define a second flexible substrate;

sandwiching a spacer between the first capillary structure layer and the second capillary structure layer, wherein the first capillary structure layer, the spacer, and the second capillary structure layer define a chamber, the spacer has a top surface, a bottom surface opposite to the top surface, and a plurality of grooves penetrating the spacer and connecting the top surface and the bottom surface, and the first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are retracted by a distance relative to the first polymer material layer and the second polymer material layer to form a space;

filling the chamber with a working fluid, wherein the working fluid is located among the first capillary structure layer, the second capillary structure layer, and the grooves;

performing a vacuuming process on the chamber, and forming a flexible sealing member to seal the space, wherein the first copper foil layer, the second copper foil layer, and the flexible sealing member define a sealed chamber, and the first capillary structure layer, the second capillary structure layer, and the grooves are located in the sealed chamber; and

performing a drilling process on at least one of the first polymer material layer and the second polymer material layer to form at least one opening, the at least one opening correspondingly exposing at least one of the first copper foil layer and the second copper foil layer.

10 . The manufacturing method of the vapor chamber structure according to claim 9 , further comprising:

providing an adhesive layer, wherein the flexible sealing member seals the space through the adhesive layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2024
From: WANG, CHIN-SHENG; TAIN, RA-MIN
To: UNIMICRON TECHNOLOGY CORP.
Reel/Frame 066219/0801 →
Priority Claims (3)
TW 109123680 · Jul 14, 2020 · national
TW 109138973 · Nov 9, 2020 · national
TW 112142742 · Nov 7, 2023 · national
Continuity (6)
Continuation In Part 17983396 · Nov 9, 2022
Division 17168200 · Feb 5, 2021
Continuation In Part 17017702 · Sep 11, 2020
Provisional Application 63528657 · Jul 25, 2023
Provisional Application 62972050 · Feb 9, 2020
Related Publication 20240159473A1 · May 16, 2024
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