INTEGRALLY-MOLDED COIL AND POWER CONVERSION DEVICE
An integrally-molded coil according to the present disclosure includes a coil portion and a resin portion. The resin portion is formed by molding a resin material having electrical insulation and thermal conductivity using the coil portion as an insert. The coil portion includes a coil main body and one or more pairs of leads each extending from the coil main body to an outside of the resin portion. An outer surface of the resin portion is applied with a surface treatment for imparting electrical conductivity, and is insulated from the one or more pairs of leads.
1 . An integrally-molded coil comprising:
a coil portion; and
a resin portion formed by molding a resin material having electrical insulation and thermal conductivity using the coil portion as an insert, wherein
the coil portion includes a coil main body and one or more pairs of leads each extending from the coil main body to an outside of the resin portion, and
an outer surface of the resin portion is applied with a surface treatment for imparting electrical conductivity, and is insulated from the one or more pairs of leads.
2 . The integrally-molded coil according to claim 1 , wherein
the resin portion includes a main body portion enclosing the coil main body, and a connecting portion extending from the main body portion and thermally and electrically connected to a cooling member, and
the connecting portion is connected to a ground potential via the cooling member.
3 . The integrally-molded coil according to claim 1 , further comprising a terminal extending from the outer surface of the resin portion and electrically connected to each of the outer surface applied with the surface treatment and a circuit board, wherein
the terminal is connected to a ground potential via the circuit board.
4 . The integrally-molded coil according to claim 2 , further comprising a terminal extending from the outer surface of the resin portion and electrically connected to each of the outer surface applied with the surface treatment and a circuit board, wherein
the terminal is connected to a ground potential via the circuit board.
5 . The integrally-molded coil according to claim 3 , wherein
the resin portion includes a main body portion enclosing the coil main body, and a connecting portion extending from the main body portion and thermally connected to a cooling member.
6 . The integrally-molded coil according to claim 4 , wherein
the resin portion includes a main body portion enclosing the coil main body, and a connecting portion extending from the main body portion and thermally connected to a cooling member.
7 . The integrally-molded coil according to claim 3 , wherein
the resin portion includes a main body portion enclosing the coil main body, and an enlarged portion extending from the main body portion to form an enlarged heat transfer surface.
8 . The integrally-molded coil according to claim 4 , wherein
the resin portion includes a main body portion enclosing the coil main body, and an enlarged portion extending from the main body portion to form an enlarged heat transfer surface.
9 . A power conversion device comprising:
an integrally-molded coil; and
a circuit board,
the integrally-molded coil comprising:
a coil portion; and
a resin portion formed by molding a resin material having electrical insulation and thermal conductivity using the coil portion as an insert, wherein
the coil portion includes a coil main body and one or more pairs of leads each extending from the coil main body to an outside of the resin portion,
an outer surface of the resin portion is applied with a surface treatment for imparting electrical conductivity, and is insulated from the one or more pairs of leads, and
the circuit board is electrically connected to the one or more pairs of leads and supplies power to the coil main body via the one or more pairs of leads.
10 . The power conversion device according to claim 9 , wherein
the resin portion includes a main body portion enclosing the coil main body, and a connecting portion extending from the main body portion and thermally and electrically connected to a cooling member, and
the connecting portion is connected to a ground potential via the cooling member.
11 . The power conversion device according to claim 9 , wherein
the integrally-molded coil further includes a terminal extending from the outer surface of the resin portion and electrically connected to each of the outer surface applied with the surface treatment and the circuit board, and
the terminal is connected to a ground potential via the circuit board.
12 . The power conversion device according to claim 10 , wherein
the integrally-molded coil further includes a terminal extending from the outer surface of the resin portion and electrically connected to each of the outer surface applied with the surface treatment and the circuit board, wherein
the terminal is connected to a ground potential via the circuit board.
13 . The power conversion device according to claim 11 , wherein
the resin portion includes a main body portion enclosing the coil main body, and a connecting portion extending from the main body portion and thermally connected to a cooling member.
14 . The power conversion device according to claim 12 , wherein
the resin portion includes a main body portion enclosing the coil main body, and a connecting portion extending from the main body portion and thermally connected to a cooling member.
15 . The power conversion device according to claim 11 , wherein
the resin portion includes a main body portion enclosing the coil main body, and an enlarged portion extending from the main body portion to form an enlarged heat transfer surface.
16 . The power conversion device according to claim 12 , wherein
the resin portion includes a main body portion enclosing the coil main body, and an enlarged portion extending from the main body portion to form an enlarged heat transfer surface.