IP Library Granted Patent US 12,285,945
Granted Patent B2
US 12,285,945 · App. 18/429,872 · Granted Apr 29, 2025

Method and apparatus for load-locked printing

Inventors: Sass Somekh (Los Altos, CA); Eliyahu Vronsky (Los Altos, CA); Conor F. Madigan (San Francisco, CA)
Assignee: Kateeva, Inc.
B41J2/14B05B17/0638B05B17/0646B05C5/0208B05C13/02B41J2/015B41J2/16505B41J2/315B41J11/0015B41J29/393B41M5/0011B41M5/0047C23C4/137H01L21/67201H01L21/67784H05B33/10H10H20/01B05C15/00B05D5/00B41J2202/09B41J2202/16H10K71/00H10K71/135H10K71/40
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Quick Facts
Patent No.
US 12,285,945
App. No.
18/429,872
Granted
Apr 29, 2025
Kind
B2
Abstract

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

Claims (47)

1. A method for forming a film on a substrate, the method comprising:

transporting a substrate to a printhead region having an inert gas environment using gas floatation,

floating the substrate on a gas in the printhead region using a combination of pressure and vacuum; and

while floating the substrate in the printhead region:

moving the substrate in a first direction and moving at least one print-head in a second direction, the first and second directions being substantially orthogonal to each other,

controlling a float height of the substrate using pressure of the gas,

detecting a misalignment of the substrate,

printing a material on a surface of the substrate using the at least one print-head; and

using the detected misalignment to control printing the material on the surface of the substrate.

2. The method of claim 1 , further comprising receiving the substrate at a inlet region, isolating the inlet region, and forming the inert gas environment prior to transporting the substrate to the printhead region.

3. The method of claim 1 , further comprising, after transporting the substrate to the printhead region, isolating the printhead region.

4. The method of claim 1 , further comprising transporting the substrate from the printhead region to an outlet region, wherein the printhead region and the outlet region are enclosed in a housing and separated by a partition.

5. The method of claim 1 , further comprising controlling a location of the substrate using the pressure and vacuum.

6. The method of claim 1 , wherein using the detected misalignment to control printing the material comprises adjusting position of at least one of the print-head and the substrate based on the misalignment and adjusting print-head firing based on the misalignment.

7. The method of claim 6 , wherein detecting the misalignment comprises determining a magnification misalignment, a translational misalignment, an angular misalignment, or a combination thereof.

8. The method of claim 6 , wherein detecting the misalignment comprises identifying an alignment target on the substrate using a camera.

9. The method of claim 1 , further comprising aligning the substrate along the first direction before printing the material on the substrate.

10. A method for forming a film on a substrate, the method comprising:

transporting a substrate to a printhead region having an inert gas environment using gas floatation,

floating the substrate on a gas in the printhead region using a combination of pressure and vacuum; and

while floating the substrate in the printhead region:

moving the substrate in a first direction and moving at least one print-head in a second direction, the first and second directions being substantially orthogonal to each other,

controlling a float height of the substrate using pressure of the gas,

detecting a misalignment of the substrate,

printing a material on a surface of the substrate using the at least one print-head; and

using the detected misalignment to control dispensing the material from the at least one print-head while printing the material on the surface of the substrate.

11. The method of claim 10 , wherein printing the material on the surface of the substrate comprises printing the material in a pattern on the surface of the substrate.

12. The method of claim 11 , wherein the material is printed in a pattern on the surface of the substrate to form a display device.

13. The method of claim 10 , wherein the material comprises an organic material.

14. The method of claim 10 , wherein detecting the misalignment comprises determining a magnification misalignment, a translational misalignment, an angular misalignment, or a combination thereof.

15. The method of claim 14 , wherein using the detected misalignment to control printing the material comprises adjusting position of at least one of the print-head and the substrate based on the misalignment to correct for the misalignment.

16. The method of claim 10 , further comprising controlling a location of the substrate using the pressure and vacuum.

17. The method of claim 10 , wherein:

the at least one print-head comprises an energizing element to dispense the material from the at least one print-head, and

using the detected misalignment to control dispensing the material from the at least one print-head while printing the material on the surface of the substrate comprises activating the energizing element based on the misalignment.

18. A method for forming a film on a substrate, the method comprising:

transporting a substrate to a printhead region having an inert gas environment using gas floatation,

floating the substrate on a gas in the printhead region using a combination of pressure and vacuum; and

while floating the substrate in the printhead region:

moving the substrate in a first direction and moving at least one print-head in a second direction, the first and second directions being substantially orthogonal to each other,

controlling a float height of the substrate using pressure of the gas,

detecting a misalignment of the substrate,

printing a material on a surface of the substrate by activating an energizing element of the at least one print-head to dispense the material onto the surface of the substrate;

positioning the substrate based on the detected misalignment; and

activating the energizing element of the at least one print-head based on the detected misalignment.

19. The method of claim 18 , further comprising controlling a location of the substrate using the pressure and vacuum.

20. The method of claim 18 , wherein the material comprises an organic material.

Continuity (11)
Continuation 17804419 · May 27, 2022
Continuation 17450713 · Oct 13, 2021
Continuation 16949412 · Oct 28, 2020
Continuation 15409844 · Jan 19, 2017
Continuation 14996086 · Jan 14, 2016
Continuation 13776602 · Feb 25, 2013
Division 13551209 · Jul 17, 2012
Continuation 12652040 · Jan 5, 2010
Continuation In Part 12139391 · Jun 13, 2008
Provisional Application 61142575 · Jan 5, 2009
Related Publication 20240167143A1 · May 23, 2024
References Cited (357)
US 3216858A · Bogdanowski · 1965 [cited by applicant]
US 3251139A · Strimling · 1966 [cited by applicant]
US 3498343A · Sperberg · 1970 [cited by applicant]
US 3632374A · Greiller · 1972 [cited by applicant]
US 3670466A · Lynch · 1972 [cited by applicant]
US 3885362A · Pollock · 1975 [cited by applicant]
US 4226897A · Coleman · 1980 [cited by applicant]
US 4409889A · Burleson · 1983 [cited by applicant]
US 4581478A · Pugh · 1986 [cited by applicant]
US 4587002A · Bok · 1986 [cited by applicant]
US 4676144A · Smith, III · 1987 [cited by applicant]
US 4693175A · Hashimoto · 1987 [cited by applicant]
US 4721121A · Adams · 1988 [cited by applicant]
US 5029518A · Austin · 1991 [cited by applicant]
US 5065169A · Vincent · 1991 [cited by applicant]
US 5314377A · Pelosi, III · 1994 [cited by applicant]
US 5344365A · Scott · 1994 [cited by applicant]
US 5388944A · Takanabe · 1995 [cited by applicant]
US 5562539A · Hashimoto · 1996 [cited by applicant]
US 5651625A · Smith · 1997 [cited by applicant]
US 5788447A · Yonemitsu · 1998 [cited by applicant]
US 5896154A · Mitani · 1999 [cited by applicant]
US 5951770A · Perlov · 1999 [cited by applicant]
US 6023899A · Mecozzi · 2000 [cited by applicant]
US 6049167A · Onitsuka · 2000 [cited by applicant]
US 6089282A · Spiegelman · 2000 [cited by applicant]
US 6375304B1 · Aldrich · 2002 [cited by applicant]
US 6437351B1 · Smick · 2002 [cited by applicant]
US 6604810B1 · Silverbrook · 2003 [cited by applicant]
US 6781684B1 · Ekhoff · 2004 [cited by applicant]
US 6869636B2 · Chung · 2005 [cited by applicant]
US 7258768B2 · Yamazaki · 2007 [cited by applicant]
US 7326300B2 · Sun · 2008 [cited by applicant]
US 7384662B2 · Takano · 2008 [cited by applicant]
US 7387662B2 · Ahman · 2008 [cited by applicant]
US 8383202B2 · Somekh · 2013 [cited by examiner]
US 8802186B2 · Somekh · 2014 [cited by examiner]
US 8802195B2 · Somekh · 2014 [cited by examiner]
US 9174433B2 · Somekh · 2015 [cited by examiner]
US 9248643B2 · Somekh · 2016 [cited by examiner]
US 10519535B2 · Somekh · 2019 [cited by applicant]
US 10851450B2 · Somekh · 2020 [cited by examiner]
US 11230757B2 · Somekh · 2022 [cited by examiner]
US 11802331B2 · Somekh · 2023 [cited by examiner]
US 11926902B2 · Somekh · 2024 [cited by examiner]
US 20010038408A1 · Codos · 2001 [cited by applicant]
US 20010041530A1 · Hara · 2001 [cited by applicant]
US 20020033860A1 · Kubota · 2002 [cited by applicant]
US 20020071745A1 · Mainberger · 2002 [cited by applicant]
US 20020079057A1 · Yoshioka · 2002 [cited by applicant]
US 20020084464A1 · Yamazaki · 2002 [cited by applicant]
US 20020113846A1 · Wang · 2002 [cited by applicant]
US 20020124906A1 · Suzuki · 2002 [cited by applicant]
US 20020191063A1 · Gelbart · 2002 [cited by applicant]
US 20030000476A1 · Matsunaga · 2003 [cited by applicant]
US 20030040061A1 · Baker · 2003 [cited by applicant]
US 20030040193A1 · Bailey · 2003 [cited by applicant]
US 20030097929A1 · Watanabe · 2003 [cited by applicant]
US 20030175414A1 · Hayashi · 2003 [cited by applicant]
US 20040050325A1 · Samoilov · 2004 [cited by applicant]
US 20040062856A1 · Marcus · 2004 [cited by applicant]
US 20040075385A1 · Tao · 2004 [cited by applicant]
US 20040086631A1 · Han · 2004 [cited by applicant]
US 20040105738A1 · Ahn · 2004 [cited by applicant]
US 20040115339A1 · Ito · 2004 [cited by applicant]
US 20040118309A1 · Fedor · 2004 [cited by applicant]
US 20040123804A1 · Yamazaki · 2004 [cited by applicant]
US 20040254297A1 · Hsu · 2004 [cited by applicant]
US 20050005850A1 · Yamazaki · 2005 [cited by applicant]
US 20050040338A1 · Weiss · 2005 [cited by applicant]
US 20050062773A1 · Fouet · 2005 [cited by applicant]
US 20050104945A1 · Chung · 2005 [cited by applicant]
US 20050140764A1 · Chang · 2005 [cited by applicant]
US 20050156956A1 · Silverbrook · 2005 [cited by applicant]
US 20050223994A1 · Blomiley · 2005 [cited by applicant]
US 20060008591A1 · Sun · 2006 [cited by examiner]
US 20060045669A1 · Namioka · 2006 [cited by applicant]
US 20060054774A1 · Yassour · 2006 [cited by applicant]
US 20060096395A1 · Weiss · 2006 [cited by applicant]
US 20060099328A1 · Waite · 2006 [cited by applicant]
US 20060119669A1 · Sharma · 2006 [cited by applicant]
US 20060137544A1 · Liu · 2006 [cited by applicant]
US 20060186804A1 · Sakakura · 2006 [cited by applicant]
US 20060219605A1 · Devitt · 2006 [cited by applicant]
US 20060222481A1 · Foree · 2006 [cited by applicant]
US 20060236938A1 · Powell · 2006 [cited by applicant]
US 20060273713A1 · Mehta · 2006 [cited by applicant]
US 20070004328A1 · Balzer · 2007 [cited by applicant]
US 20070021050A1 · Kennedy · 2007 [cited by applicant]
US 20070026151A1 · Higginson · 2007 [cited by applicant]
US 20070044713A1 · Yasui · 2007 [cited by applicant]
US 20070046185A1 · Kim · 2007 [cited by applicant]
US 20070099310A1 · Vepa · 2007 [cited by applicant]
US 20070172292A1 · Silverbrook · 2007 [cited by applicant]
US 20070234952A1 · Kojima · 2007 [cited by applicant]
US 20070257033A1 · Yamada · 2007 [cited by applicant]
US 20080079958A1 · Niimi · 2008 [cited by applicant]
US 20080085652A1 · Winters · 2008 [cited by applicant]
US 20080145190A1 · Yassour · 2008 [cited by applicant]
US 20080206036A1 · Smith · 2008 [cited by applicant]
US 20080241587A1 · Ohmi · 2008 [cited by applicant]
US 20080259101A1 · Kurita · 2008 [cited by applicant]
US 20080260938A1 · Ikeda · 2008 [cited by applicant]
US 20080273072A1 · Chung · 2008 [cited by applicant]
US 20080308037A1 · Bulovic · 2008 [cited by applicant]
US 20080311307A1 · Bulovic · 2008 [cited by applicant]
US 20090056116A1 · Presley · 2009 [cited by applicant]
US 20120056923A1 · Vronsky · 2012 [cited by applicant]
US 20220024226A1 · Somekh · 2022 [cited by applicant]
CN 1416365A · 2003 [cited by applicant]
CN 1445089A · 2003 [cited by applicant]
CN 1722918A · 2006 [cited by applicant]
CN 1956209A · 2007 [cited by applicant]
CN 101189271A · 2008 [cited by applicant]
JP 549294 · 1993 [cited by applicant]
JP H09503704A · 1997 [cited by applicant]
JP H10249237A · 1998 [cited by applicant]
JP H11312640A · 1999 [cited by applicant]
JP 2000223548A · 2000 [cited by applicant]
JP 2002069650A · 2002 [cited by applicant]
JP 2002093878A · 2002 [cited by applicant]
JP 2002359180A · 2002 [cited by applicant]
JP 2003048312A · 2003 [cited by applicant]
JP 2003173871A · 2003 [cited by applicant]
JP 2003266007A · 2003 [cited by applicant]
JP 2003272847A · 2003 [cited by applicant]
JP 2004146369A · 2004 [cited by applicant]
JP 2004164873A · 2004 [cited by applicant]
JP 2004241751A · 2004 [cited by applicant]
JP 2004247111A · 2004 [cited by applicant]
JP 2004253332A · 2004 [cited by applicant]
JP 2004291456A · 2004 [cited by applicant]
JP 2004362854A · 2004 [cited by applicant]
JP 2004535956A · 2004 [cited by applicant]
JP 2005502487A · 2005 [cited by applicant]
JP 2005074299A · 2005 [cited by applicant]
JP 2005218899A · 2005 [cited by applicant]
JP 2005254038A · 2005 [cited by applicant]
JP 2006026463A · 2006 [cited by applicant]
JP 2006123551A · 2006 [cited by applicant]
JP 2006150900A · 2006 [cited by applicant]
JP 2006159116A · 2006 [cited by applicant]
JP 2007013140A · 2007 [cited by applicant]
JP 2007122914A · 2007 [cited by applicant]
JP 2007511890A · 2007 [cited by applicant]
JP 2007147648A · 2007 [cited by applicant]
JP 2007273093A · 2007 [cited by applicant]
JP 2007299785A · 2007 [cited by applicant]
JP 2008004919A · 2008 [cited by applicant]
JP 2008047340A · 2008 [cited by applicant]
JP 2008511146A · 2008 [cited by applicant]
JP 2009501083A · 2009 [cited by applicant]
JP 2009136799A · 2009 [cited by applicant]
JP 4423082B2 · 2010 [cited by applicant]
JP 2010134315A · 2010 [cited by applicant]
JP 2010533349A · 2010 [cited by applicant]
JP 4954162B2 · 2012 [cited by applicant]
KR 20020006670A · 2002 [cited by applicant]
KR 20040072383A · 2004 [cited by applicant]
KR 20060044265A · 2006 [cited by applicant]
KR 20060084048A · 2006 [cited by applicant]
KR 20060088909A · 2006 [cited by applicant]
KR 20070042272A · 2007 [cited by applicant]
KR 20070069287A · 2007 [cited by applicant]
KR 20070079834A · 2007 [cited by applicant]
KR 20090126568A · 2009 [cited by applicant]
KR 20100079840A · 2010 [cited by applicant]
TW 200302678A · 2003 [cited by applicant]
TW 200303829A · 2003 [cited by applicant]
TW 200504828A · 2005 [cited by applicant]
TW I247554B · 2006 [cited by applicant]
TW 200618308A · 2006 [cited by applicant]
TW 200714652A · 2007 [cited by applicant]
TW 201211701A · 2012 [cited by applicant]
WO 2001060623A1 · 2001 [cited by applicant]
WO 2004088740A1 · 2004 [cited by applicant]
WO 2006041240A1 · 2006 [cited by applicant]
Notice of Allowance issued Sep. 29, 2014 to U.S. Appl. No. 13/773,654. [cited by applicant]
Notice of Allowance issued Sep. 29, 2020 for U.S. Appl. No. 16/362,595. [cited by applicant]
Notice of Allowance issued Sep. 9, 2015 to U.S. Appl. No. 13/774,693. [cited by applicant]
Notice of Final Rejection dated Oct. 18, 2022 for KR Patent Application No. 10-2021-7041315. [cited by applicant]
Notice of Final Rejection dated Sep. 27, 2022 for KR Patent Application No. 10-2021-7041139. [cited by applicant]
Notice of Final Rejection issued Jul. 29, 2021 to KR Patent Application No. 10-2020-7032729. [cited by applicant]
Notice of First Refusal issued Jul. 19, 2019 for KR Patent Application No. 10-2017-7031818. [cited by applicant]
Notice of Reason for Refusal issued Oct. 1, 2021 for JP Patent Application No. 2020-181803. [cited by applicant]
Notice of Reasons for Refusal issued Aug. 1, 2021 in KR Patent Application No. 10-2021-7018547. [cited by applicant]
Notification of First Refusal issued Oct. 23, 2018 to KR Patent application No. 10-2017-7018730. [cited by applicant]
Notification of First Refusal issued Oct. 23, 2018 to KR Patent Application No. 10-2017-7018732. [cited by applicant]
Notification of Provisional Rejection issued Aug. 22, 2016 to KR Patent Application No. 10-2015-7003107. [cited by applicant]
Notification of Provisional Rejection issued May 25, 2017 for KR Patent Application No. 10-2014-7020478. [cited by applicant]
Notification of Reason for Refusal issued Dec. 14, 2020 in KR Patent Application No. 10-2020-7027327. [cited by applicant]
Notification of Reason for Refusal issued Feb. 22, 2022 for KR Patent Application No. 10-2021-7018547. [cited by applicant]
Notification of Reason for Refusal issued Mar. 28, 2022 in KR Patent Application No. 10-2021-7041315. [cited by applicant]
Office Action issued Apr. 23, 2019 for JP Patent Application No. 2018-140175. [cited by applicant]
Office Action issued Aug. 3, 2017 for JP Patent Application No. 2016-148189. [cited by applicant]
Office Action issued Dec. 18, 2019 for CN Patent Application No. 201811010130.8. [cited by applicant]
Office Action issued Dec. 18, 2019 for TW Patent Application No. 108102087. [cited by applicant]
Office Action issued Dec. 24, 2019 for JP Patent Application No. 2018-140175. [cited by applicant]
Office Action issued Feb. 2, 2018 to JP Patent Application No. 2016-519508. [cited by applicant]
Office Action issued Jan. 28, 2016 to JP Patent Application No. 2015-526775. [cited by applicant]
Office Action issued Jul. 16, 2019 to JP Patent Application No. 2018-115532. [cited by applicant]
Office Action issued Jun. 22, 2016 to CN Patent Application No. 201480045349.5. [cited by applicant]
Office Action issued Jun. 23, 2016 to CN Patent Application No. 201380052559.2. [cited by applicant]
Office Action issued Jun. 26, 2018 for CN Patent Application No. 201710427402.3. [cited by applicant]
Office Action issued Jun. 28, 2019 to JP Patent Application No. 2018-156034. [cited by applicant]
Office Action issued Jun. 28, 2020 to CN Patent Application No. 201710914561.6. [cited by applicant]
Office Action issued Mar. 23, 2015 to CN Patent Application No. 201210596572. [cited by applicant]
Office Action issued May 7, 2019 for JP Patent Application No. 2018-142544. [cited by applicant]
Office Action issued Sep. 3, 2018 to CN Patent Application No. 201710428301.8. [cited by applicant]
Official Action issued Jul. 28, 2016 for JP Patent Application No. 2014-548852. [cited by applicant]
Official Action issued Jul. 30, 2019 to JP Patent Application No. 2018-107016. [cited by applicant]
Penultimate Office Action issued Aug. 29, 2019 to JP Patent Application No. 2017-114390. [cited by applicant]
Penultimate Office Action issued Mar. 22, 2018 to JP Patent Application No. 2016-90252. [cited by applicant]
Provisional Rejection issued Apr. 4, 2019 to KR Patent Application No. 10-2019-7008155. [cited by applicant]
Provisional Rejection issued Feb. 25, 2019 for KR Patent Application No. 20187027231. [cited by applicant]
Provisional Rejection issued Jan. 18, 2018 to KR Patent Application No. 10-2017-7018732. [cited by applicant]
Provisional Rejection issued Jan. 7, 2020 to KR Patent Application No. 10-2019-7037354. [cited by applicant]
Provisional Rejection issued Jul. 6, 2018 to KR Patent Application No. 10-2016-7000033. [cited by applicant]
Provisional Rejection issued Oct. 17, 2017 to KR Patent Application No. 10-2015-7027963. [cited by applicant]
Rejection Decision issued Jul. 25, 2018 to TW Patent Application No. 103117122. [cited by applicant]
Second CN Office Action issued Sep. 27, 2017 for CN Patent Application No. 201610181336.1. [cited by applicant]
Second Office Action issued Jul. 2, 2019 to CN Patent Application No. 201710914561.6. [cited by applicant]
Second Office Action issued Jul. 31, 2017 for CN Patent Application No. 20140027671.5. [cited by applicant]
Second Office Action issued Jun. 26, 2018 for CN Patent Application No. 201710427402.3. [cited by applicant]
Second Office Action issued Mar. 2, 2017 to CN Patent Application No. 201380052559.2. [cited by applicant]
Second Office Action issued Mar. 5, 2019 to CN Patent Application No. 201580023550.8. [cited by applicant]
Second Office Action issued Oct. 8, 2015 to CN Patent Application No. 201210596572. [cited by applicant]
Street et al., “Jet Printing of Active-Matrix TFT Backplanes for Displays and Sensors”, IS&T Archiving, Dec. 2005, vol. 20, No. 5, 16 pages. [cited by applicant]
TW Examination Report and Search Report issued Mar. 13, 2017 for TW Patent Application No. 105144240. [cited by applicant]
Non-Final Office Action issued Feb. 28, 2014 to U.S. Appl. No. 13/773,649. [cited by applicant]
Non-Final Office Action issued Feb. 7, 2014 to U.S. Appl. No. 13/773,643. [cited by applicant]
Non-Final Office Action issued Jan. 17, 2017 for U.S. Appl. No. 14/996,086. [cited by applicant]
Non-Final Office action issued Jan. 26, 2018 to U.S. Appl. No. 15/184,755. [cited by applicant]
Non-Final Office Action issued Jul. 1, 2014 to U.S. Appl. No. 13/773,654. [cited by applicant]
Non-Final Office Action issued Jun. 14, 2012 for U.S. Appl. No. 12/652,040. [cited by applicant]
Non-Final Office Action issued Jun. 29, 2018 to U.S. Appl. No. 15/605,806. [cited by applicant]
Non-Final Office Action issued Mar. 10, 2016 to U.S. Appl. No. 14/275,637. [cited by applicant]
Non-Final Office Action issued Mar. 28, 2019 to U.S. Appl. No. 16/102,392. [cited by applicant]
Non-Final Office Action issued May 16, 2014 to U.S. Appl. No. 13/802,304. [cited by applicant]
Non-Final Office Action issued May 23, 2019 for U.S. Appl. No. 15/409,844. [cited by applicant]
Non-Final Office Action issued Nov. 20, 2015 for U.S. Appl. No. 14/637,301. [cited by applicant]
Non-Final Office Action issued Nov. 4, 2016 for U.S. Appl. No. 14/543,786. [cited by applicant]
Non-Final Office Action issued Oct. 17, 2018 to U.S. Appl. No. 15/446,984. [cited by applicant]
Non-Final Office Action issued Oct. 3, 2019 to U.S. Appl. No. 16/362,595. [cited by applicant]
Non-Final Office Action issued Oct. 5, 2017 to U.S. Appl. No. 15/594,856. [cited by applicant]
Non-final Office Action issued Oct. 5, 2022 for U.S. Appl. No. 17/247,591. [cited by applicant]
Non-final Office Action issued Oct. 6, 2021 for U.S. Appl. No. 17/247,591. [cited by applicant]
Non-Final Office Action issued on Mar. 24, 2021 for U.S. Appl. No. 16/553,909. [cited by applicant]
Non-Final Office Action issued Sep. 18, 2017 to U.S. Appl. No. 14/543,786. [cited by applicant]
Non-Final Office Action mailed Sep. 29, 2023 for U.S. Appl. No. 17/443,450. [cited by applicant]
Notice of Allowance dated Apr. 12, 2024 for U.S. Appl. No. 18/185,631. [cited by applicant]
Notice of Allowance dated Apr. 26, 2021 for U.S. Appl. No. 16/421,834. [cited by applicant]
Notice of Allowance dated Mar. 4, 2024 for U.S. Appl. No. 17/247,591. [cited by applicant]
Notice of Allowance dated Mar. 8, 2024 for U.S. Appl. No. 17/443,450. [cited by applicant]
Notice of Allowance issued Aug. 5, 2019 to U.S. Appl. No. 15/446,984. [cited by applicant]
Notice of Allowance issued Dec. 7, 2012 to U.S. Appl. No. 12/652,040. [cited by applicant]
Notice of Allowance issued Dec. 9, 2014 for U.S. Appl. No. 13/802,304. [cited by applicant]
Notice of Allowance issued Feb. 20, 2014 to U.S. Appl. No. 13/551,209. [cited by applicant]
Notice of Allowance issued Jan. 31, 2017 for U.S. Appl. No. 14/205,340. [cited by applicant]
Notice of Allowance issued Jan. 6, 2020 to U.S. Appl. No. 14/543,786. [cited by applicant]
Notice of Allowance issued Jul. 1, 2014 to U.S. Appl. No. 13/773,649. [cited by applicant]
Notice of Allowance issued Jul. 10, 2019 for U.S. Appl. No. 15/106,907. [cited by applicant]
Notice of Allowance issued Jul. 14, 2017 to U.S. Appl. No. 15/385,803. [cited by applicant]
Notice of Allowance issued Jul. 17, 2015 for U.S. Appl. No. 13/570,154. [cited by applicant]
Notice of Allowance issued Jul. 2, 2014 to U.S. Appl. No. 13/774,577. [cited by applicant]
Notice of Allowance issued Jun. 24, 2019 for U.S. Appl. No. 15/184,755. [cited by applicant]
Notice of Allowance issued Jun. 30, 2014 to U.S. Appl. No. 13/773,643. [cited by applicant]
Notice of Allowance issued Jun. 9, 2022 for U.S. Appl. No. 16/574,334. [cited by applicant]
Notice of Allowance issued Mar. 29, 2017 to U.S. Appl. No. 15/423,169. [cited by applicant]
Notice of Allowance issued Mar. 7, 2019 to U.S. Appl. No. 15/605,806. [cited by applicant]
Notice of Allowance issued Mar. 8, 2019 to U.S. Appl. No. 14/275,637. [cited by applicant]
Notice of Allowance issued Mar. 9, 2018 to U.S. Appl. No. 15/594,856. [cited by applicant]
Notice of Allowance issued May 16, 2016 to U.S. Appl. No. 14/637,301. [cited by applicant]
Notice of Allowance issued Nov. 19, 2015 to U.S. Appl. No. 13/776,602. [cited by applicant]
Notice of Allowance issued Oct. 23, 2019 to U.S. Appl. No. 16/102,392. [cited by applicant]
Notice of Allowance issued Oct. 4, 2019 to U.S. Appl. No. 15/417,583. [cited by applicant]
Notice of Allowance issued Oct. 6, 2014 for U.S. Appl. No. 13/720,830. [cited by applicant]
Notice of Allowance issued Sep. 16, 2019 to U.S. Appl. No. 14/996,086. [cited by applicant]
CN First Office Action dated Dec. 2, 2022 for CN Patent Application No. 201910510788.3. [cited by applicant]
CN Office Action dated Sep. 26, 2022 for CN Patent Application No. 202010333896.0. [cited by applicant]
CN Office Action issued Jan. 23, 2017 for CN Patent Application No. 201480027671.5. [cited by applicant]
Corrected Notice of Allowability issued Oct. 23, 2018 to U.S. Appl. No. 14/996,086. [cited by applicant]
Corrected Notice of Allowability issued Oct. 31, 2014 for U.S. Appl. No. 13/720,830. [cited by applicant]
Corrected Notice of Allowability issued Sep. 20, 2017 to U.S. Appl. No. 15/385,803. [cited by applicant]
EP Extended Search Report dated Aug. 24, 2021 for EP Patent Application No. 21167787.7. [cited by applicant]
EP Search Report issued Mar. 25, 2019 to EP Patent Application No. 18201256.7. [cited by applicant]
European Search Report issued Apr. 17, 2019 for EP Patent Application No. 19162637.3. [cited by applicant]
Examination Report issued Apr. 19, 2017 for TW Patent Application No. 103108995. [cited by applicant]
Examination Report issued Apr. 26, 2016 to TW Patent Application No. 101148932. [cited by applicant]
Examination Report issued Aug. 13, 2015 for CN Patent Application No. 201310704315.X. [cited by applicant]
Examination Report issued Mar. 22, 2018 to TW Patent Application No. 103117122. [cited by applicant]
Examination Report issued Mar. 27, 2019 for TW Patent Application No. 107102956. [cited by applicant]
Examination Report issued May 2, 2019 for TW Patent Application No. 107116642. [cited by applicant]
Examination Report issued May 20, 2019 for EP Patent Application No. 14810543.0. [cited by applicant]
Examination Report issued Sep. 15, 2021 for TW Patent Application No. 109109239. [cited by applicant]
Extended European Search Report issued Apr. 12, 2017 for EP Patent Application No. 14810543.0. [cited by applicant]
Extended European Search Report issued Jul. 1, 2016 for EP Patent Application No. 13585304.2. [cited by applicant]
Extended European Search Report issued Jun. 19, 2017 for EP Patent Application No. 14779907.6. [cited by applicant]
Final Office Action dated Apr. 14, 2022 for U.S. Appl. No. 17/247,591. [cited by applicant]
Final Office Action dated Dec. 19, 2022 for JP Patent Application No. 2021-143917. [cited by applicant]
Final Office Action dated Nov. 18, 2022 for JP Patent Application No. 2020-144660. [cited by applicant]
Final Office Action dated Oct. 27, 2023 for U.S. Appl. No. 17/820,782. [cited by applicant]
Final Office Action issued Aug. 5, 2019 to U.S. Appl. No. 16/102,392. [cited by applicant]
Final Office Action issued Jul. 19, 2017 for U.S. Appl. No. 15/409,844. [cited by applicant]
Final Office Action issued Jul. 28, 2017 for U.S. Appl. No. 14/996,086. [cited by applicant]
First Office Action issued Sep. 26, 2023 in CN Patent Application No. 202010333896.0. [cited by applicant]
KR Decision of Refusal dated Mar. 31, 2023 for KR Patent Application No. 10-2022-7040440. [cited by applicant]
Non-final Office Action dated Jul. 3, 2023 for U.S. Appl. No. 17/820,782. [cited by applicant]
Official Action issued May 14, 2024 in TW Patent Application No. 112143522. [cited by applicant]
KR Office Action dated Aug. 9, 2024 for KR Patent Application No. 10-2024-7003182. [cited by applicant]
Final Office Action issued Jul. 9, 2019 to U.S. Appl. No. 14/996,086. [cited by applicant]
Final Office Action issued Jun. 10, 2014 to U.S. Appl. No. 13/773,649. [cited by applicant]
Final Office Action issued Jun. 12, 2014 to U.S. Appl. No. 13/773,643. [cited by applicant]
Final Office Action issued Jun. 12, 2020 to U.S. Appl. No. 16/362,595. [cited by applicant]
Final Office Action issued Jun. 18, 2014 to U.S. Appl. No. 13/774,577. [cited by applicant]
Final Office Action issued Mar. 22, 2019 to U.S. Appl. No. 15/446,984. [cited by applicant]
Final Office Action issued Mar. 7, 2018 to U.S. Appl. No. 14/543,786. [cited by applicant]
Final Office Action issued May 14, 2018 to JP Patent Application No. 2016-148189. [cited by applicant]
Final Office Action issued Nov. 21, 2018 to JP Patent Application No. 2016-090252. [cited by applicant]
Final Office Action issued Nov. 8, 2013 to U.S. Appl. No. 13/551,209. [cited by applicant]
Final Office Action issued Oct. 14, 2016 for U.S. Appl. No. 14/205,340. [cited by applicant]
Final Office Action issued Oct. 25, 2019 to U.S. Appl. No. 15/409,844. [cited by applicant]
Final Office Action issued Oct. 7, 2016 for U.S. Appl. No. 14/275,637. [cited by applicant]
Forrest, Stephen R., “The Path to Ubiquitous and Low-cost Organic Electronic Appliances on Plastic,” Nature, Apr. 29, 2004, vol. 428, pp. 911-918. [cited by applicant]
Fourth Office Action issued Mar. 25, 2016 for CN Patent Application No. 201210596572.1. [cited by applicant]
International Search Report and Written Opinion issued Dec. 22, 2014 for PCT Application No. PCT/US14/023820. [cited by applicant]
International Search Report and Written Opinion issued Mar. 11, 2014 for PCT Application No. PCT/US13/063128. [cited by applicant]
International Search Report and Written Opinion issued Oct. 8, 2014 for PCT Application No. PCT/US2014/037722. [cited by applicant]
International Search Report and Written Opinion issued on Feb. 26, 2013 for PCT Application No. PCT/US12/70717. [cited by applicant]
International Search Report and Written Opinion issued on Jun. 18, 2013 for PCT Application No. PCT/US13/031083. [cited by applicant]
JP Non-final Office Action dated Apr. 5, 2022 for Application No. 2020-144660. [cited by applicant]
JP Notice of Reason for Refusal dated Jun. 28, 2021 for Application No. 2020-144660. [cited by applicant]
JP Office Action dated Apr. 15, 2024 for JP Patent Application No. 2023-037153. [cited by applicant]
JP Office Action issued Apr. 26, 2017 for JP Patent Application No. 2016-90252. [cited by applicant]
JP Office Action issued Jun. 1, 2017 to JP Patent Application No. 2016-501353. [cited by applicant]
KR Decision of Rejection dated Feb. 17, 2023 for KR Patent Application No. 10-2021-7041315. [cited by applicant]
KR Office Action dated Jan. 17, 2024 for KR Patent Application No. 10-2023-7015024. [cited by applicant]
KR Office Action dated Jul. 1, 2022 for Application No. 10-2022-7013035. [cited by applicant]
KR Office Action dated Nov. 17, 2022 for KR Patent Application No. 10-2022-7029657. [cited by applicant]
KR Office Action issued Dec. 10, 2021 for KR Patent Application No. 10-2021-7036621. [cited by applicant]
KR Office Action issued Dec. 16, 2021 for KR Patent Application No. [cited by applicant]
KR Second Office Action dated Jan. 11, 2024 for KR Patent Application No. 10-2023-7015116. [cited by applicant]
Non-final Office Action dated Feb. 28, 2023 for U.S. Appl. No. 17/302,841. [cited by applicant]
Non-final Office Action dated Mar. 10, 2023 for U.S. Appl. No. 17/450,713. [cited by applicant]
Non-final Office Action dated Mar. 28, 2022 for U.S. Appl. No. 16/574,334. [cited by applicant]
Non-final Office Action dated Sep. 27, 2023 for U.S. Appl. No. 18/185,631. [cited by applicant]
Non-Final Office Action issued Apr. 15, 2015 to U.S. Appl. No. 13/776,602. [cited by applicant]
Non-Final Office Action issued Apr. 17, 2015 to U.S. Appl. No. 13/774,693. [cited by applicant]
Non-Final Office Action issued Apr. 24, 2013 to U.S. Appl. No. 13/551,209. [cited by applicant]
Non-Final Office Action issued Apr. 27, 2016 to U.S. Appl. No. 14/543,786. [cited by applicant]
Non-Final Office Action issued Apr. 28, 2014 to U.S. Appl. No. 13/720,830. [cited by applicant]
Non-Final Office Action issued Apr. 4, 2016 to U.S. Appl. No. 14/205,340. [cited by applicant]
Non-final Office Action issued Aug. 8, 2022 for JP Patent Application No. 2021-143917. [cited by applicant]
Non-Final Office Action issued Aug. 9, 2019 for U.S. Appl. No. 14/543,786. [cited by applicant]
Non-Final Office Action issued Dec. 11, 2020 to U.S. Appl. No. 16/421,834. [cited by applicant]
Non-Final Office Action issued Feb. 13, 2018 for U.S. Appl. No. 14/996,086. [cited by applicant]
Non-Final Office Action issued Feb. 17, 2017 for U.S. Appl. No. 15/409,844. [cited by applicant]