Multilayered high-temperature dielectric film
A multilayered dielectric film includes a plurality of nanolayers, with at least one first type of layer including traditional dielectric films and at least one second type of layer including high heat stability polymers. The consultant layered film demonstrates an improved storage modulus and decreased dissipation factor at high temperatures. The at least one first type of layer and the at least one second type of layer differ in dielectric permittivity by a factor of between approximately 0.5 and approximately 1.5 times.
1. A high temperature performance dielectric film, comprising:
a coextruded plurality of layers, including a plurality of A layers and a plurality of B layers in a simple alternating pattern;
wherein the plurality of A layers comprise at least one high temperature polymer;
wherein the plurality of B layers consist of polypropylene;
wherein the at least one high temperature polymer is a polymer having a glass transition temperature greater than 125° C. or a melting temperature greater than 200° C.; and
wherein the plurality of A layers have a dielectric permittivity between 0.5 and 1.5 times greater than the plurality of B layers.
2. The film of claim 1 , wherein the at least one high temperature polymer includes cyclic olefin copolymer (COC).
3. The film of claim 2 , wherein the plurality of A layers consist of approximately 10-30% COC and approximately 70-90% polypropylene.
4. The film of claim 1 , wherein the thickness of at least one of the coextruded and/or post-extrusion stretched plurality of layers is less than 150 nm.
5. The film of claim 1 , wherein the coextruded plurality of layers do not include any tie layers.
6. The film of claim 1 , wherein the film is incorporated in a capacitor.
7. A high temperature performance dielectric film, comprising:
a coextruded plurality of layers, including a plurality of A layers and a plurality of B layers in a simple alternating pattern;
wherein the plurality of A layers comprise at least one high temperature polymer;
wherein the plurality of B layers consists of polypropylene;
wherein the at least one high temperature polymer is a polymer having a glass transition temperature greater than 125° C. or a melting temperature greater than 200° C.; and
wherein the plurality of A layers consist of approximately 10-30% cyclic olefin copolymer and approximately 70-90% polypropylene.
8. The film of claim 7 , wherein each of the coextruded and/or post-extrusion oriented plurality of layers have a thickness less than 150 nm.
9. The film of claim 7 , wherein the film has a total thickness between approximately 3 μm and approximately 15 μm.
10. The film of claim 7 , wherein the coextruded plurality of layers do not include any tie layers.
11. The film of claim 7 , wherein the film includes one or more skin or coating layers, and wherein the one or more skin or coating layers include at least one metallization layer.
12. The film of claim 7 , wherein the film is incorporated in a capacitor.
13. A high temperature performance dielectric film, comprising:
a coextruded plurality of layers, including a plurality of A layers and a plurality of B layers in a simple alternating pattern;
wherein the plurality of B layers consists of polypropylene;
wherein the plurality of A layers have a dielectric permittivity between 0.5 and 1.5 times greater than the plurality of B layers;
wherein at least one of the coextruded plurality of layers have a thickness less than 150 nm; and
wherein the film has a total thickness between approximately 3 μm and approximately 15 μm.
14. The film of claim 13 , wherein the plurality of A layers comprise at least one high temperature polymer, and wherein the at least one high temperature polymer is a polymer having a glass transition temperature greater than 125° C. or a melting temperature greater than 200° C.
15. The film of claim 13 , wherein the plurality of A layers and the plurality of B layers are in a simple alternating pattern within the film.
16. The film of claim 13 , wherein the coextruded plurality of layers do not include any tie layers.