Detection base plate and flat-panel detector
A detection base plate and a flat-panel detector. The detection base plate comprises multiple detection pixel units arranged in an array. Each detection pixel unit comprises: a thin-film transistor, a sacrificial layer and a photoelectric conversion part that are disposed on a substrate, wherein the sacrificial layer is located between the thin-film transistor and the photoelectric conversion part; the thin-film transistor comprises an active layer, a first electrode and a second electrode; at least part of an orthographic projection of the active layer on the substrate is located within an orthographic projection of the sacrificial layer on the substrate; and the photoelectric conversion part is electrically connected to the sacrificial layer and the first electrode. In the detection base plate, the sacrificial layers of the detection pixel units are mutually independent.
1. A detection base plate, comprising a substrate and multiple detection pixel units located on the substrate and arranged in an array;
each said detection pixel unit comprising: a thin-film transistor, a sacrificial layer and a photoelectric conversion layer disposed on the substrate; the sacrificial layer being located between the thin-film transistor and the photoelectric conversion part, wherein the sacrificial layer is an oxide material;
wherein the thin-film transistor comprises an active layer, a first electrode and a second electrode;
at least part of an orthographic projection of the active layer on the substrate is located within an orthographic projection of the sacrificial layer on the substrate;
the photoelectric conversion part is electrically connected to the sacrificial layer and the first electrode; and
in the detection base plate, the sacrificial layers of the detection pixel units are mutually independent;
wherein the photoelectric conversion part is disposed on a side, away from the substrate, of the thin-film transistor;
the photoelectric conversion part comprises a read electrode;
in the detection pixel units, the sacrificial layers contact with the read electrode; and
at least part of a boundary of an orthographic projection of the read electrode on the substrate is located within a boundary of the orthographic projection of the sacrificial layer on the substrate;
wherein the photoelectric conversion part further comprises a photoelectric conversion structure disposed on a side, away from the substrate, of the read electrode.
2. The detection base plate according to claim 1 , wherein the read electrodes of the photoelectric conversion parts of the detection pixel units are mutually independent.
3. The detection base plate according to claim 1 , wherein the detection pixel unit further comprises a first insulating layer and a first via hole, and the first via hole penetrates through the first insulating layer to expose the first electrode; and
the sacrificial layer does not contact with the first electrode, and the read electrode contacts with the first electrode by means of the first via hole.
4. The detection base plate according to claim 3 , wherein the orthographic projection of the sacrificial layer on the substrate does not overlap with or partially overlaps with an orthographic projection of the first via hole on the substrate.
5. The detection base plate according to claim 3 , wherein the first insulating layer comprises a first passivation layer and a first organic layer, and the first passivation layer covers the thin-film transistor; and
the first organic layer is located between the first passivation layer and the sacrificial layer.
6. The detection base plate according to claim 3 , wherein an orthographic projection of the photoelectric conversion structure on the substrate does not overlap with the orthographic projection of the first via hole on the substrate.
7. The detection base plate according to claim 6 , wherein a boundary of the orthographic projection of the photoelectric conversion structure on the substrate is located within a boundary of the orthographic projection of the read electrode on the substrate.
8. The detection base plate according to claim 1 , wherein the detection pixel unit further comprises: a second insulating layer, a bias electrode and a third passivation layer that are sequentially stacked on the photoelectric conversion part;
wherein the bias electrode is electrically connected to the photoelectric conversion part by means of a second via hole, and the second via hole penetrates through the second insulating layer.
9. The detection base plate according to claim 8 , wherein the second insulating layer comprises a second passivation layer and a second organic layer, and the detection pixel unit further comprises: an electrically conductive electrode located between the photoelectric conversion part and the second organic layer and contacting with the photoelectric conversion part.
10. The detection base plate according to claim 9 , wherein the photoelectric conversion part comprises a read electrode and a photoelectric conversion structure;
the photoelectric conversion structure is disposed on a side, away from the substrate, of the read electrode, and comprises a first doping layer, an intrinsic layer and a second doping layer that are sequentially stacked on the read electrode, and a polarity of the first doping layer is opposite to a polarity of the second doping layer; and
the first doping layer contacts with the read electrode, and the second doping layer contacts with the electrically conductive electrode.
11. The detection base plate according to claim 10 , wherein an orthographic projection of the electrically conductive electrode on the substrate may be located within an orthographic projection of the photoelectric conversion part on the substrate.
12. The detection base plate according to claim 1 , further comprising multiple grid lines arranged in a first direction and multiple data lines arranged in a second direction, wherein in the detection pixel units, the orthographic projections of the sacrificial layers on the substrate do not overlap with orthographic projections of the grid lines on the substrate and do not overlap with orthographic projections of the data lines on the substrate either.
13. The detection base plate according to claim 12 , wherein in the detection pixel units, the sacrificial layers comprise first parts and second parts, and portions, close to the grid lines or the data lines, of the first parts protrude out of the second parts; and
a line width of portions, close to the first parts, of the data lines is smaller than that of portions, close to the second parts, of the data lines, and a line width of portions, close to the first parts, of the grid lines is smaller than that of portions, close to the second parts, of the grid lines.
14. The detection base plate according to claim 13 , wherein the detection pixel unit further comprises: a bias electrode electrically connected to the photoelectric conversion part; and
the detection base plate further comprises multiple bias lines arranged in the second direction, and the bias lines are electrically connected to the bias electrodes of at least one row of detection pixel units arranged in the first direction.
15. The detection base plate according to claim 1 , wherein when the thin-film transistor is an N-type thin-film transistor, the first electrode is a drain, and the second electrode is a source; or
when the thin-film transistor is a P-type thin-film transistor, the first electrode is a source, and the second electrode is a drain.
16. A flat-panel detector, comprising the detection base plate according to claim 1 .
17. A detection base plate, comprising a substrate and multiple detection pixel units located on the substrate and arranged in an array;
each said detection pixel unit comprising: a thin-film transistor, a sacrificial layer and a photoelectric conversion layer disposed on the substrate; the sacrificial layer being located between the thin-film transistor and the photoelectric conversion part, wherein the sacrificial layer is an oxide material;
wherein the thin-film transistor comprises an active layer, a first electrode and a second electrode;
at least part of an orthographic projection of the active layer on the substrate is located within an orthographic projection of the sacrificial layer on the substrate;
the photoelectric conversion part is electrically connected to the sacrificial layer and the first electrode; and
in the detection base plate, the sacrificial layers of the detection pixel units are mutually independent;
wherein in the detection pixel units, the sacrificial layers comprise first parts and second parts, and portions, close to the grid lines or the data lines, of the first parts protrude out of the second parts; and
a line width of portions, close to the first parts, of the data lines is smaller than that of portions, close to the second parts, of the data lines, and a line width of portions, close to the first parts, of the grid lines is smaller than that of portions, close to the second parts, of the grid lines;
wherein the photoelectric conversion part further comprises a photoelectric conversion structure disposed on a side, away from the substrate, of the read electrode.
18. A detection base plate, comprising a substrate and multiple detection pixel units located on the substrate and arranged in an array;
each said detection pixel unit comprising: a thin-film transistor, a sacrificial layer and a photoelectric conversion layer disposed on the substrate; the sacrificial layer being located between the thin-film transistor and the photoelectric conversion part, wherein the sacrificial layer is capable of reacting with hydrogen atoms, and the sacrificial layer is made of any one of indium zinc oxide, indium tin oxide, indium gallium zinc oxide, indium tin zinc oxide, and gallium indium tin oxide;
wherein the thin-film transistor comprises an active layer, a first electrode and a second electrode;
at least part of an orthographic projection of the active layer on the substrate is located within an orthographic projection of the sacrificial layer on the substrate;
the photoelectric conversion part is electrically connected to the sacrificial layer and the first electrode; and
in the detection base plate, the sacrificial layers of the detection pixel units are mutually independent;
wherein the photoelectric conversion part is disposed on a side, away from the substrate, of the thin-film transistor;
the photoelectric conversion part comprises a read electrode;
in the detection pixel units, the sacrificial layers contact with the read electrode; and
at least part of a boundary of an orthographic projection of the read electrode on the substrate is located within a boundary of the orthographic projection of the sacrificial layer on the substrate;
wherein the orthographic projection of the active layer on the substrate is located within the orthographic projection of the sacrificial layer on the substrate.