Overlay measurement device and method, and system and program therefor
An overlay measurement device for measuring an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer, includes: a light source; an objective lens that concentrates a beam from the light source on a measurement position of the wafer, and gathers the beam being reflected in the measurement positon; a lens focus actuator that adjusts a distance between the objective lens and the wafer such that a focus surface is placed at the first overlay mark or the second overlay mark; an auto focus module that adjusts a focus by adjusting the lens focus actuator; a detector for obtaining an image of the first overlay mark or an image of the second overlay mark; a transmission and receipt part; and a processor connecting to the transmission and receipt part electrically.
1. An overlay measurement device for measuring an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer, the overlay measurement device comprising:
a light source;
an objective lens that concentrates a beam from the light source on a measurement position of the wafer, and gathers the beam being reflected in the measurement positon;
a lens focus actuator that adjusts a distance between the objective lens and the wafer such that a focus surface is placed at the first overlay mark or the second overlay mark;
an auto focus module that adjusts a focus by adjusting the lens focus actuator;
a detector for obtaining an image of the first overlay mark or an image of the second overlay mark;
a transmission and receipt part; and
a processor connecting to the transmission and receipt part electrically,
wherein the processor is configured to:
obtain data transmitted from a user terminal through the transmission and receipt part,
analyze a recipe included in the data,
perform optimization of measurement options of a wafer, based on the recipe, after the recipe is analyzed,
perform a focus scan at one site by controlling the auto focus module,
determine a focus measurement area based on the performed focus scan,
calculate statistical values for a plurality of parameters by moving the focus by one step within the determined focus measurement area for each site,
apply a weight respectively to the calculated statistical values, and
perform a focus optimization process of selecting a focus where a total of the statistical values to which the weight is applied respectively is a minimum value as a focus of the auto focus module.
2. The overlay measurement device of claim 1 , wherein the data comprises information indicating whether to perform the optimization of measurement options of a wafer.
3. The overlay measurement device of claim 1 , wherein the data comprises information on a recipe that is input to measure characteristic of a wafer through a manager program installed in the user terminal and unique information on the overlay measurement device.
4. The overlay measurement device of claim 3 , wherein the unique information comprises an internet protocol (IP) address, an identifier, and a password of the overlay measurement device, and an IP of a server.
5. The overlay measurement device of claim 1 , wherein the processor determines authenticity of a file of the recipe by using at least one of a name form and a file extension of the file of the recipe included in the data.
6. The overlay measurement device of claim 1 , wherein the plurality of parameters comprises at least one of Final Residual 3 Sigma, Tis 3 Sigma, Registration 3 Sigma, total measurement uncertainty (TMU), and move and measure (MAM) time, or comprises total weight comprised of combinations thereof.
7. The overlay measurement device of claim 1 , wherein the processor stores information on options that are chosen a focus optimization process, in a memory.
8. An overlay measurement system, comprising:
a user terminal generating data that comprise information on a recipe which is input through a manager program, and unique information on an overlay measurement device, and transmitting the generated data to an overlay measurement device corresponding to the unique information, and
the overlay measurement device analyzing a recipe included in the data that are received from the user terminal, and performing optimization of measurement options of a wafer, based on the recipe, after the recipe is analyzed,
wherein the overlay measurement device measures an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer,
wherein the overlay measurement device comprises a light source, an objective lens that concentrates a beam from the light source on a measurement position of the wafer and gathers the beam being reflected in the measurement positon, a lens focus actuator that adjusts a distance between the objective lens and the wafer such that a focus surface is placed at the first overlay mark or the second overlay mark, an auto focus module that adjusts a focus by adjusting the lens focus actuator, and a detector for obtaining an image of the first overlay mark or an image of the second overlay mark,
wherein the overlay measurement device is configured to:
perform a focus scan at one site by controlling the auto focus module,
determine a focus measurement area based on the performed focus scan,
calculate statistical values for a plurality of parameters by moving the focus by one step within the determined focus measurement area for each site,
apply a weight respectively to the calculated statistical values, and
perform a focus optimization process of selecting a focus where a total of the statistical values to which the weight is applied respectively is a minimum value as a focus of the auto focus module.
9. A method of an overlay measurement device for measuring an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer, the method comprising:
receiving data from a user terminal, the data comprising information indicating whether to execute the optimization of measurement options of a wafer;
analyzing a recipe that is included in the data; and
when analyzing the recipe is completed and the data includes information indicating an execution of the optimization, performing optimization of measurement options of a wafer, based on the recipe,
wherein the overlay measurement device comprises a light source, an objective lens that concentrates a beam from the light source on a measurement position of the wafer and gathers the beam being reflected in the measurement positon, a lens focus actuator that adjusts a distance between the objective lens and the wafer such that a focus surface is placed at the first overlay mark or the second overlay mark, an auto focus module that adjusts a focus by adjusting the lens focus actuator, and a detector for obtaining an image of the first overlay mark or an image of the second overlay mark, and
wherein the optimization comprises:
performing a focus scan at one site by controlling the auto focus module,
determining a focus measurement area based on the performed focus scan,
calculating statistical values for a plurality of parameters by moving the focus by one step within the determined focus measurement area for each site,
applying a weight respectively to the calculated statistical values, and
performing a focus optimization process of selecting a focus where a total of the statistical values to which the weight is applied respectively is a minimum value as a focus of the auto focus module.
10. The method of claim 9 , wherein receiving data comprises determining authenticity of a file of the recipe by using at least one of a name form and a file extension of the file of the recipe included in the data.
11. The method of claim 9 , wherein the plurality of parameters comprises at least one of Final Residual 3 Sigma, Tis 3 Sigma, Registration 3 Sigma, total measurement uncertainty (TMU), and move and measure (MAM) time, or comprises total weight comprised of combinations thereof.