Granted Patent B2

US 12,334,382 · App. 18/433,499 · Granted Jun 17, 2025

Inventors: Sol-Lee Hwang (Hwaseong-si, KR); Hee-Chul Lim (Hwaseong-si, KR); Dong-Won Jung (Hwaseong-si, KR); Min-Ho Lee (Hwaseong-si, KR); Hyun-Kyoo Shon (Hwaseong-si, KR)

Assignee: AUROS TECHNOLOGY, INC.

H01L21/681

Abstract

Claims (40)

1. An overlay measurement device for measuring an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer, the overlay measurement device comprising:

a light source;

an aperture that changes a beam from the light source to be suitable for photographing the first overlay mark or the second overlay mark;

a detector for obtaining an image of the first overlay mark or an image of the second overlay mark;

a transmission and receipt part; and

a processor connecting to the transmission and receipt part electrically,

wherein the processor is configured to:

obtain data transmitted from a user terminal through the transmission and receipt part,

analyze a recipe included in the data,

perform optimization of measurement options of a wafer, based on the recipe, after the recipe is analyzed,

measure an aperture in a first pinhole position,

measure the aperture in a second pinhole position that is a predetermined distance apart from the first pinhole position once,

calculate Tis 3 Sigma in the first pinhole position and the second pinhole position, and

perform a pinhole optimization process of selecting a pinhole position where the Tis 3 Sigma is a minimum by modeling the Tis 3 Sigma in each pinhole position in relation to the aperture.

2. The overlay measurement device of claim 1 , wherein the data comprises information indicating whether to perform the optimization of measurement options of a wafer.

3. The overlay measurement device of claim 1 , wherein the data comprises information on a recipe that is input to measure characteristic of a wafer through a manager program installed in the user terminal and unique information on the overlay measurement device.

4. The overlay measurement device of claim 3 , wherein the unique information comprises an internet protocol (IP) address, an identifier, and a password of the overlay measurement device, and an IP of a server.

5. The overlay measurement device of claim 1 , wherein the processor determines authenticity of a file of the recipe by using at least one of a name form and a file extension of the file of the recipe included in the data.

6. The overlay measurement device of claim 1 , wherein the processor stores information on options that are chosen in each of a filter optimization process, an aperture optimization process, a focus optimization process or a pinhole optimization process, in a memory.

7. An overlay measurement system, comprising:

a user terminal generating data that comprise information on a recipe which is input through a manager program, and unique information on an overlay measurement device, and transmitting the generated data to an overlay measurement device corresponding to the unique information, and

the overlay measurement device analyzing a recipe included in the data that are received from the user terminal, and performing optimization of measurement options of a wafer, based on the recipe, after the recipe is analyzed,

wherein the overlay measurement device measures an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer,

wherein the overlay measurement device comprises a light source, an aperture that changes a beam from the light source to be suitable for photographing the first overlay mark or the second overlay mark, and a detector for obtaining an image of the first overlay mark or an image of the second overlay mark,

wherein the overlay measurement device is configured to:

measure an aperture in a first pinhole position,

measure the aperture in a second pinhole position that is a predetermined distance apart from the first pinhole position once,

calculate Tis 3 Sigma in the first pinhole position and the second pinhole position, and

perform a pinhole optimization process of selecting a pinhole position where the Tis 3 Sigma is a minimum by modeling the Tis 3 Sigma in each pinhole position in relation to the aperture.

8. A method of an overlay measurement device for measuring an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer, the method comprising:

receiving data from a user terminal, the data comprising information indicating whether to execute the optimization of measurement options of a wafer;

analyzing a recipe that is included in the data; and

when analyzing the recipe is completed and the data includes information indicating an execution of the optimization, performing optimization of measurement options of a wafer, based on the recipe,

wherein the overlay measurement device comprises a light source, an aperture that changes a beam from the light source to be suitable for photographing the first overlay mark or the second overlay mark, and a detector for obtaining an image of the first overlay mark or an image of the second overlay mark, and

wherein the optimization comprises:

measuring an aperture in a first pinhole position,

measuring the aperture in a second pinhole position that is a predetermined distance apart from the first pinhole position once,

calculating Tis 3 Sigma in the first pinhole position and the second pinhole position, and

performing a pinhole optimization process of selecting a pinhole position where the Tis 3 Sigma is a minimum by modeling the Tis 3 Sigma in each pinhole position in relation to the aperture.

9. The method of claim 8 , wherein receiving data comprises determining authenticity of a file of the recipe by using at least one of a name form and a file extension of the file of the recipe included in the data.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (23)