IP Library › Granted Patent US 12,594,815
Granted Patent B2
US 12,594,815 · App. 18/434,882 · Granted Apr 7, 2026

Temperature control system

Inventor: Keizo Iwama (Saitama, JP)
Assignee: HONDA MOTOR CO., LTD.
B60H1/00921B60H2001/00928
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Quick Facts
Patent No.
US 12,594,815
App. No.
18/434,882
Granted
Apr 7, 2026
Kind
B2
Abstract

A temperature control system is mounted on a vehicle. The temperature control system includes a PU cooling circuit configured to allow a first refrigerant to flow therethrough and adjust a temperature of a power unit, a refrigeration cycle circuit, which is used for air conditioning, configured to allow a second refrigerant to flow therethrough, a first heat exchanger configured to exchange heat between the first refrigerant in the PU cooling circuit and the second refrigerant in the refrigeration cycle circuit, a gas-liquid separation device configured to separate the first refrigerant into gas and liquid, and a refrigerant cooling circuit configured to allow the first refrigerant to flow therethrough and communicate with the PU cooling circuit via the gas-liquid separation device.

Claims (22)

1 . A temperature control system mounted on a vehicle, the temperature control system comprising:

a PU cooling circuit configured to allow a first refrigerant to flow therethrough and adjust a temperature of a power unit;

a refrigeration cycle circuit, which is used for air conditioning, configured to allow a second refrigerant to flow therethrough;

a first heat exchanger configured to exchange heat between the first refrigerant in the PU cooling circuit and the second refrigerant in the refrigeration cycle circuit;

a gas-liquid separation device configured to separate the first refrigerant into gas and liquid; and

a refrigerant cooling circuit configured to allow the first refrigerant in a gaseous state to flow therethrough and communicate with the PU cooling circuit via the gas-liquid separation device,

wherein a second heat exchanger of the refrigeration cycle circuit is configured to take in waste heat which is discharged from the gaseous first refrigerant separated by the gas-liquid separation device to an atmosphere by a condenser of the refrigerant cooling circuit.

2 . The temperature control system according to claim 1 ,

wherein the refrigeration cycle circuit includes:

a first flow path configured to allow the second refrigerant to flow through the second heat exchanger configured to exchange heat between the second refrigerant and outside air, a first expansion valve, an evaporator, a first compressor, and a first heater core in this order; and

a second flow path configured to allow the second refrigerant to flow through the second heat exchanger, the first compressor, the first heater core, the first heat exchanger, and a second expansion valve in this order, and

the first flow path and the second flow path are switchable by a valve device.

3 . The temperature control system according to claim 2 , wherein the refrigerant cooling circuit includes:

a refrigerant main flow path configured to allow the first refrigerant to flow through the gas-liquid separation device, a second compressor, the condenser, and a third expansion valve in this order; and

a refrigerant bypass flow path configured to bypass the second compressor in the refrigerant main flow path, and

the refrigerant main flow path and the refrigerant bypass flow path are switchable by a first valve.

4 . The temperature control system according to claim 3 ,

wherein the first flow path passes through a second heater core disposed between the second compressor and the condenser.

5 . The temperature control system according to claim 3 , wherein the PU cooling circuit includes:

a PU main flow path configured to allow the first refrigerant to flow through a battery, the gas-liquid separation device, a pump, a radiator, a drive unit, the first heat exchanger, and a heater; and

a PU bypass flow path configured to bypass the radiator in the PU main flow path, and

the PU main flow path and the PU bypass flow path are switchable by a second valve.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2024
From: IWAMA, KEIZO
To: HONDA MOTOR CO., LTD.
Reel/Frame 066398/0894 →
Priority Claims (1)
JP 2023-017644 · Feb 8, 2023 · national
Continuity (1)
Related Publication 20240262167A1 · Aug 8, 2024
References Cited (7)
US 20210053412A1 · Kim et al. · 2021 [cited by applicant]
US 20220063368A1 · Miyamoto et al. · 2022 [cited by applicant]
CN 112046237A · 2020 [cited by examiner]
CN 212289437U · 2021 [cited by examiner]
JP 2021031045A · 2021 [cited by applicant]
WO WO2020129257A1 · 2020 [cited by applicant]
May 21, 2024, Translation of Japanese Office Action issued for related JP Application No. 2023-017644. [cited by applicant]