IP Library Granted Patent US 12,652,964
Granted Patent B2
US 12,652,964 · App. 18/442,149 · Granted Jun 9, 2026

A-axis Josephson junctions with improved contacts

Inventors: Archana Tiwari (Waterloo, CA); Mitchell Robson (Toronto, CA); Priyanka Brojabasi (Kitchener, CA)
Assignee: Ambature, Inc.
H10N60/0912H10N60/12H10N60/805
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Quick Facts
Patent No.
US 12,652,964
App. No.
18/442,149
Granted
Jun 9, 2026
Kind
B2
Abstract

In some implementations of the invention, a silicon dioxide (SiO 2 ) insulating layer added between islands of a top YBCO layer of a Josephson Junction isolates a contact layer from YBCO (or other conductive components) in the Josephson Junction. In some implementations of the invention, a SiO 2 insulating layer added between islands of a bottom YBCO layer of adjacent Josephson Junctions isolates the contact layer or other components from YBCO (or other conductive components) in the Josephson Junction. In some implementations of the invention, an etch stop layer may be deposited over the islands of the top YBCO layer prior to adding the SiO 2 insulating layer. This etch stop layer protects the top YBCO layer during the adding of the SiO 2 insulating layer and during subsequent formation of a via through the SiO 2 to the etch stop layer.

Claims (22)

1 . A method for fabricating a Josephson Junction, the method comprising:

depositing an etch stop layer of gold on top of at least two spatially separated islands of YBCO, wherein the YBCO forms a top layer of an a-axis trilayer of YBCO/insulator/YBCO;

depositing a layer of silicon dioxide between the at least two spatially separated islands of YBCO and over the etch stop layer;

etching the silicon dioxide to expose the etch stop layer without exposing any other surfaces of the trilayer; and

depositing a contact layer directly onto the exposed etch stop layer, wherein the contact layer comprises a layer of gold.

2 . The method of claim 1 , wherein the contact layer comprises a layer of titanium.

3 . The method of claim 1 , wherein the contact layer comprises a layer of titanium under the layer of gold.

4 . The method of claim 1 , wherein the insulator in the a-axis trilayer of YBCO/insulator/YBCO comprises PBCO.

5 . The method of claim 1 , further comprising applying a wire bond to the electrical contact on each of the separated islands.

6 . The method of claim 1 , wherein etching the silicon dioxide to expose the etch stop layer comprises forming a via in the silicon dioxide through to the etch stop layer.

7 . A method for fabricating a Josephson Junction, the method comprising:

etching islands in a top YBCO layer of an a-axis trilayer of YBCO/PBCO/YBCO;

depositing an etch stop layer of gold on top of the islands in the top YBCO layer;

depositing a layer of silicon dioxide between the islands in the top YBCO layer and over the etch stop layer;

etching the silicon dioxide to expose the etch stop layer without exposing any other surfaces of the trilayer; and

depositing a contact layer directly onto the exposed etch stop layer, wherein the contact layer comprises a layer of gold.

8 . The method of claim 7 , further comprising etching islands in a bottom YBCO layer of the a-axis trilayer of YBCO/PBCO/YBCO.

9 . The method of claim 7 , wherein the contact layer comprises a layer of titanium.

10 . The method of claim 7 , wherein the contact layer comprises a layer of titanium under the layer of gold.

11 . The method of claim 7 , further comprising applying a wire bond to the electrical contact on each of the separated islands.

12 . The method of claim 7 , wherein etching the silicon dioxide to expose the etch stop layer comprises forming a via in the silicon dioxide through to the etch stop layer.

13 . The method of claim 12 , further comprising depositing a contact layer in the via.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2024
From: TIWARI, ARCHANA; BROJABASI, PRIYANKA; ROBSON, MITCHELL
To: AMBATURE, INC.
Reel/Frame 067387/0751 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2024
From: TIWARI, ARCHANA; BROJABASI, PRIYANKA; ROBSON, MITCH
To: AMBATURE, INC.
Reel/Frame 067173/0696 →
Continuity (3)
Provisional Application 63447442 · Feb 22, 2023
Provisional Application 63446086 · Feb 16, 2023
Related Publication 20250040448A1 · Jan 30, 2025
References Cited (10)
US 5155658A · Inam · 1992 [cited by examiner]
US 5240904A · Tanaka · 1993 [cited by examiner]
US 5455451A · Usagawa · 1995 [cited by examiner]
US 6004907A · Suh · 1999 [cited by examiner]
US 6943136B2 · Kwon · 2005 [cited by examiner]
US 12369501B2 · Ladizinsky · 2025 [cited by examiner]
US 20030071258A1 · Zagoskin · 2003 [cited by examiner]
US 20030107033A1 · Tzalenchuk · 2003 [cited by examiner]
US 20040099861A1 · Shoji · 2004 [cited by examiner]
US 20200091398A1 · Lebby · 2020 [cited by examiner]