IP Library Granted Patent US 12,238,498
Granted Patent B2
US 12,238,498 · App. 18/452,080 · Granted Feb 25, 2025

Bone conduction speaker

Inventors: Lei Zhang (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Xin Qi (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R9/025H01F7/081H01F7/121H04R1/1091H04R9/06H04R2460/13
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Quick Facts
Patent No.
US 12,238,498
App. No.
18/452,080
Granted
Feb 25, 2025
Kind
B2
Abstract

The present disclosure relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element, and the first magnetic element may generate a second magnetic field. The magnetic circuit may further include a first magnetic guide element and at least one second magnetic element. The at least one second magnetic element may be configured to surround the first magnetic element and a magnetic gap may be configured between the second magnetic element and the first magnetic element. A magnetic field strength of the first magnetic field within the magnetic gap may exceed a magnetic field strength of the second magnetic field within the magnetic gap.

Claims (42)

1. A magnetic circuit assembly of a bone conduction speaker, wherein the magnetic circuit assembly generates a first magnetic field, and the magnetic circuit assembly includes:

a first magnetic element generating a second magnetic field;

a first magnetic guide element configured to adjust a distribution of the second magnetic field, a lower surface of the first magnetic guide element being connected with an upper surface of the first magnetic element;

a second magnetic guide element configured to adjust the distribution of the second magnetic field, at least a portion of the second magnetic guide element being configured to surround the first magnetic element and a magnetic gap being configured between the second magnetic guide element and the first magnetic element; and

at least one second magnetic element connected with an upper surface of the first magnetic guide element, wherein the at least one second magnetic element generates a third magnetic field.

2. The magnetic circuit assembly of claim 1 , wherein an included angle between a magnetization direction of the at least one second magnetic element and a magnetization direction of the first magnetic element is in a range from 90 degrees to 180 degrees.

3. The magnetic circuit assembly of claim 2 , wherein the included angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in a range from 150 degrees to 180 degrees.

4. The magnetic circuit assembly of claim 3 , wherein the included angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is 180 degrees.

5. The magnetic circuit assembly of claim 2 , wherein a magnetic field strength of the first magnetic field within the magnetic gap exceeds a magnetic field strength of the second magnetic field within the magnetic gap.

6. The magnetic circuit assembly of claim 2 , wherein a magnetic field strength of the first magnetic field within the magnetic gap exceeds a magnetic field strength of the third magnetic field within the magnetic gap.

7. The magnetic circuit assembly of claim 2 , wherein a magnetic field strength of the second magnetic field within the magnetic gap under the third magnetic field exceeds a magnetic field strength of the second magnetic field within the magnetic gap without the third magnetic field.

8. The magnetic circuit assembly of claim 1 , further comprising:

at least one third magnetic element configured to surround the at least one second magnetic element.

9. The magnetic circuit assembly of claim 8 , further comprising:

at least one fourth magnetic element, wherein the at least one fourth magnetic element is connected with the second magnetic guide element and the at least one third magnetic element.

10. The magnetic circuit assembly of claim 1 , further comprising:

at least one fifth magnetic element located below the magnetic gap, wherein the at least one fifth magnetic element is connected with the first magnetic element and the second magnetic guide element.

11. The magnetic circuit assembly of claim 1 , further comprising:

a third magnetic guide element connected with the at least one second magnetic element.

12. A magnetic circuit assembly of a bone conduction speaker, comprising:

a first magnetic element generating a first magnetic field;

a first magnetic guide element;

a magnetic field changing element configured to surround the first magnetic element, the magnetic field changing element being a magnetic element for generating a magnetic field or a magnetic guide element for adjusting a distribution of the first magnetic field, a magnetic gap being configured between the magnetic field changing element and the first magnetic element; and

at least one second magnetic element located below the magnetic gap, wherein the at least one second magnetic element generates a second magnetic field.

13. The magnetic circuit assembly of claim 12 , wherein magnetic induction lines generated by the first magnetic element or the at least one second magnetic element that are originally divergent without the magnetic field changing element converge to the magnetic gap under an action of the magnetic field changing element.

14. The magnetic circuit assembly of claim 12 , wherein the second magnetic field increases a magnetic strength of the first magnetic field within the magnetic gap.

15. The magnetic circuit assembly of claim 12 , further comprising:

at least one third magnetic element connected with the magnetic field changing element, wherein the at least one third magnetic element generates a third magnetic field.

16. The magnetic circuit assembly of claim 15 , further comprising:

at least one fourth magnetic element located between the magnetic field changing element and the at least one third magnetic element.

17. The magnetic circuit assembly of claim 12 , further comprising:

a magnetic shield configured to encompass the first magnetic element, the first magnetic guide element, the magnetic field changing element, and the second magnetic element, or

at least one conductive element connected with at least one of the first magnetic element, the first magnetic guide element, or the second magnetic element.

18. The magnetic circuit assembly of claim 12 , wherein the magnetic field changing element is connected with the at least one second magnetic element, a connection surface between the magnetic field changing element and the at least one second magnetic element including a cross section in a wedge shape.

19. The magnetic circuit assembly of claim 12 , further comprising:

at least one fifth magnetic element connected with an upper surface of the first magnetic guide element, wherein the at least one fifth magnetic element generates a fifth magnetic field, the fifth magnetic field increases the magnetic field strength of the first magnetic field within the magnetic gap.

20. A bone conduction speaker, comprising

a magnetic circuit assembly generating a first magnetic field, wherein the magnetic circuit assembly includes:

a first magnetic element generating a second magnetic field;

a first magnetic guide element configured to adjust a distribution of the second magnetic field, a lower surface of the first magnetic guide element being connected with an upper surface of the first magnetic element;

a second magnetic guide element configured to adjust the distribution of the second magnetic field, at least a portion of the second magnetic guide element being configured to surround the first magnetic element and a magnetic gap being configured between the second magnetic guide element and the first magnetic element; and

at least one second magnetic element connected with an upper surface of the first magnetic guide element, wherein the at least one second magnetic element generates a third magnetic field.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2023
From: ZHANG, LEI; LIAO, FENGYUN; QI, XIN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 065429/0582 →
CHANGE OF NAME Recorded Nov 1, 2023
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 065429/0589 →
Priority Claims (1)
WO PCT/CN2018/071751 · Jan 8, 2018 · international
Continuity (5)
Continuation 17453643 · Nov 4, 2021
Continuation 17170897 · Feb 9, 2021
Continuation 16923015 · Jul 7, 2020
Continuation PCTCN2018104934 · Sep 11, 2018
Related Publication 20230396928A1 · Dec 7, 2023
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