Environmentally Friendly Blister Package With Contact Adhesive
The present invention provides environmentally friendly blister package and method of forming the blister package for odd-shaped goods with contact adhesives. The blister package is formed from recyclable or renewable substrates. The contact adhesives form strong cohesive bonds with each other with minimal adhesion to all other surfaces, including the goods packaged therewith.
1 . A blister pack comprising:
(a) a contact adhesive that comprises (i) a metallocene-catalyzed olefin block copolymer; (ii) a mixture of polyethylene wax and Fischer-Tropsch wax, having a penetration hardness value of less than about 5 dmm at 25° C., measured in accordance with ASTM D3954; (iii) a plasticizer; and (iv) a tackifier;
(b) a paperboard substrate having a first substrate and a second substrate, and the contact adhesive is applied on the first surface;
(c) a paper substrate having a first substrate and a second substrate, and the contact adhesive is applied on the second surface; and
(d) an article;
wherein the article is sandwiched and adhered in between the applied contact adhesive of the first surface of the paperboard substrate and the applied contact adhesive of the second surface of the paper substrate.
2 . The blister package of claim 1 , wherein the contact adhesive is essentially free from polypropylene based polymer and/or wax.
3 . The blister package of claim 1 , wherein the metallocene-catalyzed olefin block copolymer which is an ethylene-octene block copolymer.
4 . The blister package of claim 1 , wherein the polyethylene wax and/or Fischer-Tropsch wax have a hardness value of less than or equal to about 3 dmm at measured in accordance with ASTM D1321.
5 . The blister package of claim 1 , further comprising an additive selected from the group consisting of antioxidant, brighteners, fillers, adhesion promoters, pigments and mixtures thereof.
6 . The blister package of claim 1 , wherein the paperboard substrate is selected from the group consisting of boxboard, chipboard or Kraft board, corrugated board, linerboard, and medium.
7 . The blister package of claim 1 , wherein the paper substrate has a thickness of about of about 0.008″ (8 point) to about 0.024″ (24 point).
8 . A blister package comprising:
(a) a first substrate having a pre-applied contact adhesive on one surface;
(b) a second having the same contact adhesive pre-applied on one surface; and
(c) an article,
wherein the article is sandwiched and adhered in between the pre-applied contact adhesive of the first substrate and the pre-applied contact adhesive of the second substrate.
9 . The blister package of claim 8 ,
wherein the first substrate is selected from the group consisting of boxboard, chipboard or Kraft board, corrugated board, linerboard, and medium; and
wherein the second substrate is a mixture of plastic film, foil, paper, and Kraft paper.
10 . The blister package of claim 8 ,
wherein the pre-applied contact adhesive comprises (i) a metallocene-catalyzed olefin block copolymer; (ii) a mixture of polyethylene wax and Fischer-Tropsch wax, having a penetration hardness value of less than about 5 dmm at 25° C., measured in accordance with ASTM D3954; (iii) a plasticizer; and (iv) a tackifier
11 . A method of forming an environmentally friendly blister package comprising:
(1) preparing a paperboard substrate having a first surface and a second surface, wherein a contact adhesive is applied onto the first surface of the paperboard substrate;
(2) preparing a paper substrate having a first surface and a second surface, wherein a contact adhesive is applied onto the second surface of the paper substrate;
(3) placing an article onto the first surface of the paperboard;
(4) applying the applied contact adhesive of the second surface of the paper surface on the applied contact adhesive of the first surface of the paperboard;
whereby the article is secured between the second surface of the paper and the first surface of the paperboard.
12 . The method of forming the environmentally friendly blister package of claim 11 , wherein the paperboard substrate is selected from the group consisting of boxboard, chipboard or Kraft board, corrugated board, linerboard, and medium.
13 . The method of forming the environmentally friendly blister package of claim 11 , wherein the paper substrate has a thickness of about of about 0.008″ (8 point) to about 0.024″ (24 point).
14 . The method of forming the environmentally friendly blister package of claim 11 , wherein the contact adhesive comprises (i) an ethylene-octene block copolymer; (ii) a mixture of polyethylene wax and Fischer-Tropsch wax, having a penetration hardness value of less than about 5 dmm at 25° C., measured in accordance with ASTM D3954; (iii) a plasticizer; and (iv) a tackifier.
15 . The method of forming the environmentally friendly blister package of claim 11 , wherein the contact adhesive is essentially free from polypropylene based polymer and/or wax.