Scalable 2.5D interface circuitry for data communication operations
A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.
1 . A multi-chip package comprising:
a substrate comprising signal paths formed in the substrate;
a first die mounted on the substrate; and
a second die mounted on the substrate and coupled to the first die via the signal paths, wherein the second die comprises a universal interface block configurable to communicate with the first die via the signal paths and to support a plurality of communications protocols, the universal interface block comprising:
a phase locked loop circuit configurable to generate a clock signal; and
a plurality of input-output modules configurable to receive the clock signal, the input-output modules comprising programmable buffers, wherein the programmable buffers comprise:
an input configurable to receive data;
transmit circuitry comprising an output driver configurable to generate corresponding output data, the output driver having an adjustable strength; and
de-emphasis control logic configurable to generate a control signal based on the received data to increase switching speed and reduce power consumption at the programmable buffers.
2 . The multi-chip package of claim 1 , wherein the programmable buffers comprise a 2× clock phase generation logic configurable to receive a first clock signal having a first clock rate and a second clock signal having a second clock rate that is greater than the first clock rate and to generate a 2× clock phase signal that controls the output driver.
3 . The multi-chip package of claim 2 , wherein the 2× clock phase signal is deasserted to indicate a low clock phase of the first clock signal and is asserted to indicate a high clock phase of the first clock signal.
4 . The multi-chip package of claim 1 , wherein the second die comprises a programmable logic device (PLD), an application-specific standard product (ASSP), or an application-specific integrated circuit (ASIC).
5 . The multi-chip package of claim 4 , wherein the first die comprises a memory die.
6 . The multi-chip package of claim 1 , wherein the second die comprises programmable logic.
7 . A multi-chip package comprising:
a substrate comprising signal paths formed in the substrate;
a first die mounted on the substrate; and
a second die mounted on the substrate and coupled to the first die via the signal paths, wherein the second die comprises a universal interface block configurable to communicate with the first die via the signal paths and to support a plurality of communications protocols, the universal interface block comprising:
a phase locked loop circuit configurable to generate a clock signal; and
a plurality of input-output modules configurable to receive the clock signal, the input-output modules comprising programmable buffers, wherein the programmable buffers comprise:
an input configurable to receive data;
transmit circuitry comprising an output driver configurable to generate corresponding output data, the output driver having an adjustable strength; and
a 2× clock phase generation logic configurable to receive a first clock signal having a first clock rate and a second clock signal having a second clock rate that is greater than the first clock rate and to generate a 2× clock phase signal that controls the output driver.
8 . The multi-chip package of claim 7 , wherein the 2× clock phase signal is deasserted to indicate a low clock phase of the first clock signal and is asserted to indicate a high clock phase of the first clock signal.
9 . The multi-chip package of claim 7 , further comprising at least one pipeline stage that is interposed between the output driver and the 2× clock phase generation logic and that uses the second clock signal and the 2× clock phase signal to control the output driver.
10 . The multi-chip package of claim 7 , wherein the programmable buffers comprise de-emphasis control logic configurable to generate a control signal based on the received data to increase switching speed and reduce power consumption at the programmable buffers.
11 . The multi-chip package of claim 7 , wherein the second die comprises programmable logic.