Granted Patent
B2
US 12,715,373 · App. 18/457,565 · Granted Aug 25, 2026
Resin-molded article
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Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER 18636270 TO APPLICATION NUMBER 18363270 PREVIOUSLY RECORDED ON REEL 71770 FRAME 194. ASSIGNOR(S) HEREBY CONFIRMS THE IN ONE TRANSACTION, MORIROKU TECHNOLOGY COMPANY, LTD., SPUN-OUT A PORTION OF THE COMPANY THAT OWNED THE PATENT APPLICATIONS AND THE SPUN-OUT PORTION, WHICH WAS UNNAMED AFTER JAPANESE LAW, WAS ABSORBED BY MORIROKU CO., LTD..
Recorded Sep 26, 2025
From: MORIROKU TECHNOLOGY COMPANY, LTD.
To: MORIROKU CO., LTD.
Reel/Frame 072874/0645 →
IN ONE TRANSACTION, MORIROKU TECHNOLOGY COMPANY, LTD. SPUN-OUT A PORTION OF THE COMPANY THAT OWNED THE PATENT APPLICATIONS AND THE SPUN-OUT PORTION, WHICH WAS UNNAMED UNDER JAPANESE LAW, WAS ABSORBED BY MORIROKU CO., LTD.
Recorded Jun 17, 2025
From: MORIROKU TECHNOLOGY COMPANY, LTD.
To: MORIROKU CO., LTD.
Reel/Frame 071770/0194 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Sep 26, 2023
From: SUZUKI, MITSURU; TANAKA, TAKASHI
To: MORIROKU TECHNOLOGY COMPANY, LTD.
Reel/Frame 065033/0469 →
Priority Claims (1)
JP 2022-138958
· Sep 1, 2022
· national
Continuity (1)
References Cited (11)
US 8518519B2
· Kubo
· 2013
[cited by examiner]
US 20020139081A1
· Nada
· 2002
[cited by examiner]
JP 2000346018A
· 2000
[cited by examiner]
JP 2008143366A
· 2008
[cited by examiner]
JP 2010241306A
· 2010
[cited by examiner]
JP 2017067115A
· 2017
[cited by applicant]
WO WO2017154177A1
· 2017
[cited by examiner]