IP Library › Granted Patent US 12,358,283
Granted Patent B2
US 12,358,283 · App. 18/476,368 · Granted Jul 15, 2025

First drive unit, first liquid ejecting head unit, and liquid ejecting apparatus

Inventor: Hirokazu Yanagihara (Nagano, JP)
Assignee: Seiko Epson Corporation
B41J2/04588B41J2/04581B41J2/14201B41J2/155B41J2202/08
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Quick Facts
Patent No.
US 12,358,283
App. No.
18/476,368
Granted
Jul 15, 2025
Kind
B2
Abstract

A first drive unit configured to generate a first drive signal for driving a first liquid ejecting head unit, the first drive unit comprising: a first drive circuit that generates the first drive signal; a first thermal conductive material that is in contact with the first drive circuit; and a first water cooling mechanism that is in contact with the first thermal conductive material on an opposite side in relation to the first drive circuit and causes liquid to flow, wherein the first water cooling mechanism causes liquid sent from a second water cooling mechanism to flow, and discharges liquid to a third water cooling mechanism, the second water cooling mechanism is provided in a second drive unit configured to generate a second drive signal for driving a second liquid ejecting head unit located next to the first liquid ejecting head unit, and the third water cooling mechanism is provided in a third drive unit configured to generate a third drive signal for driving a third liquid ejecting head unit located next to the first liquid ejecting head unit on an opposite side in relation to the second liquid ejecting head unit.

Claims (34)

1. A first drive unit configured to generate a first drive signal for driving a first liquid ejecting head unit, the first drive unit comprising:

a first drive circuit that generates the first drive signal;

a first thermal conductive material that is in contact with the first drive circuit; and

a first water cooling mechanism that is in contact with the first thermal conductive material on an opposite side in relation to the first drive circuit and causes liquid to flow, wherein

the first water cooling mechanism causes liquid sent from a second water cooling mechanism to flow, and discharges liquid to a third water cooling mechanism, the second water cooling mechanism is provided in a second drive unit configured to generate a second drive signal for driving a second liquid ejecting head unit located next to the first liquid ejecting head unit, and the third water cooling mechanism is provided in a third drive unit configured to generate a third drive signal for driving a third liquid ejecting head unit located next to the first liquid ejecting head unit on an opposite side in relation to the second liquid ejecting head unit.

2. The first drive unit according to claim 1 , further comprising:

a second drive circuit that is different from the first drive circuit and generates a fourth drive signal for driving the first liquid ejecting head unit, wherein

the first water cooling mechanism includes

a first box that is in contact with the first thermal conductive material, and

a second box that is in contact with a second thermal conductive material that is in contact with the second drive circuit, and

after causing the liquid sent from the second water cooling mechanism to flow through the first box and the second box in this order, the first water cooling mechanism discharges the liquid to the third water cooling mechanism.

3. The first drive unit according to claim 1 , wherein

the second liquid ejecting head unit, the first liquid ejecting head unit, and the third liquid ejecting head unit eject liquid respectively toward areas arranged next to one another in this order.

4. A first liquid ejecting head unit, comprising:

a first drive unit configured to generate a first drive signal for driving the first liquid ejecting head unit; and

a head,

the head including

an ejecting orifice that, upon receiving a drive signal supplied from the first drive unit, ejects liquid from a nozzle provided in a nozzle surface, and

a collective board that includes a head connector,

the first drive unit including

a first drive circuit that generates the first drive signal;

a first thermal conductive material that is in contact with the first drive circuit; and

a first water cooling mechanism that is in contact with the first thermal conductive material on an opposite side in relation to the first drive circuit and causes liquid to flow, wherein

the first water cooling mechanism causes liquid sent from a second water cooling mechanism to flow, and discharges liquid to a third water cooling mechanism, the second water cooling mechanism is provided in a second drive unit configured to generate a second drive signal for driving a second liquid ejecting head unit located next to the first liquid ejecting head unit, and the third water cooling mechanism is provided in a third drive unit configured to generate a third drive signal for driving a third liquid ejecting head unit located next to the first liquid ejecting head unit on an opposite side in relation to the second liquid ejecting head unit.

5. A liquid ejecting apparatus, comprising:

a plurality of sets each including a plurality of liquid ejecting head units and a transportation unit, the plurality of liquid ejecting head units including a first liquid ejecting head unit, a second liquid ejecting head unit located next to the first liquid ejecting head unit, and a third liquid ejecting head unit located next to the first liquid ejecting head unit on an opposite side in relation to the second liquid ejecting head unit, the first liquid ejecting head unit including a first drive unit and a head, the first drive unit being configured to generate a first drive signal for driving the first liquid ejecting head unit,

the head including

an ejecting orifice that, upon receiving a drive signal supplied from the first drive unit, ejects liquid from a nozzle provided in a nozzle surface, and

a collective board that includes a head connector,

the first drive unit including

a first drive circuit that generates the first drive signal;

a first thermal conductive material that is in contact with the first drive circuit; and

a first water cooling mechanism that is in contact with the first thermal conductive material on an opposite side in relation to the first drive circuit and causes liquid to flow, wherein

the first water cooling mechanism causes liquid sent from a second water cooling mechanism to flow, and discharges liquid to a third water cooling mechanism, the second water cooling mechanism is provided in a second drive unit configured to generate a second drive signal for driving the second liquid ejecting head, and the third water cooling mechanism is provided in a third drive unit configured to generate a third drive signal for driving the third liquid ejecting head unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2023
From: YANAGIHARA, HIROKAZU
To: SEIKO EPSON CORPORATION
Reel/Frame 065056/0952 →
Priority Claims (1)
JP 2022-157652 · Sep 30, 2022 · national
Continuity (1)
Related Publication 20240109315A1 · Apr 4, 2024
References Cited (3)
US 11186083B2 · Kondo · 2021 [cited by applicant]
US 20200269580A1 · Kondo · 2020 [cited by examiner]
JP 2020138356A · 2020 [cited by applicant]