Self aligned grids in BSI image sensor
A method of fabricating self-aligned grids in a BSI image sensor is provided. The method includes depositing a first dielectric layer over a back surface of a substrate that has a plurality of photodiodes formed therein, forming a grid of trenches, and filling in the trenches with dielectric material to create a trench isolation grid. Here, a trench passes through the first dielectric layer and extends into the substrate. The method further includes etching back dielectric material in the trenches to a level that is below an upper surface of the first dielectric layer to form recesses overlaying the trench isolation grid, and filling in the recesses with metallic material to create a metallic grid that is aligned with the trench isolation grid.
1. A device, comprising:
a photodetector in a substrate;
a trench isolation segment extending into the substrate, adject to the photodetector; and
a conductive grid segment overlying and directly contacting the trench isolation segment at an interface, and comprising a barrier layer and a metallic layer, wherein the conductive grid segment and the trench isolation segment have a same width at the interface.
2. The device according to claim 1 , further comprising:
a dielectric layer having a top surface and a bottom surface with individual saw-toothed profiles overlying the photodetector, wherein the interface is closer to the substrate than a neighboring portion of the top surface.
3. The device according to claim 2 , wherein the interface is level with the dielectric layer.
4. The device according to claim 1 , wherein a top surface of the barrier layer is level with a top surface of the metallic layer.
5. The device according to claim 1 , wherein the metallic layer overlies and is recessed into the barrier layer.
6. The device according to claim 1 , wherein the conductive grid segment overlies the substrate, and wherein the device further comprises:
an interconnect structure underlying the substrate.
7. The device according to claim 1 , further comprising:
a trench isolation grid comprising the trench isolation segment and an additional trench isolation segment between which the photodetector is sandwiched in a cross-sectional plane; and
a conductive grid comprising the conductive grid segment and an additional conductive grid segment respectively on the trench isolation segment and the additional trench isolation segment.
8. A device, comprising:
a first photodetector and a second photodetector in a substrate;
a trench isolation grid extending into the substrate, and between and bordering the first and second photodetectors, wherein the trench isolation grid comprises a dielectric liner and a dielectric plug overlying and recessed into the dielectric liner; and
a conductive grid overlying the trench isolation grid, and comprising a barrier layer and a metallic layer overlying and recessed into the barrier layer, wherein the conductive grid contacts a top surface of the dielectric liner.
9. The device according to claim 8 , wherein the dielectric liner and the barrier layer have individual sidewalls vertically stacked and edge to edge.
10. The device according to claim 8 , wherein the top surface of the dielectric liner is level with a top surface of the dielectric plug.
11. The device according to claim 8 , wherein the dielectric liner comprises a high k dielectric material.
12. The device according to claim 8 , further comprising:
a dielectric layer having a top surface and a bottom surface with individual saw-toothed profiles overlying the first photodetector, wherein the top surface of the dielectric liner is elevated relative to the top surface of the dielectric layer.
13. The device according to claim 8 , wherein the conductive grid and the trench isolation grid respectively comprise a conductive grid segment and a trench isolation segment localized between the first and second photodetectors in a cross-sectional plane, and wherein the conductive grid segment completely covers the trench isolation segment in the cross-sectional plane.
14. A device, comprising:
a photodetector in a substrate;
a trench isolation structure extending into the substrate and surrounding the photodetector, wherein the trench isolation structure comprises a dielectric liner and a dielectric plug overlying and recessed into the dielectric liner; and
a metal-containing layer overlying and contacting the trench isolation structure,
wherein the dielectric liner has a first outer sidewall spaced from the dielectric plug, and wherein the metal-containing layer has a second outer sidewall overlying and edge to edge with the first outer sidewall to form a common sidewall.
15. The device according to claim 14 , further comprising:
a metallic layer overlying and recessed into the metal-containing layer, wherein the metal-containing layer is configured as a barrier for material of the metallic layer.
16. The device according to claim 14 , further comprising:
a conductive grid structure overlying the trench isolation structure, wherein the conductive grid structure comprises the metal-containing layer.
17. The device according to claim 14 , wherein the metal-containing layer comprises titanium and/or tantalum.
18. The device according to claim 14 , wherein a separation between a topmost surface of the metal-containing layer and a bottommost surface of the trench isolation structure is equal to a sum of a height of the metal-containing layer and a height of the trench isolation structure.
19. The device according to claim 14 , further comprising:
a dielectric layer having a top surface and a bottom surface with individual saw-toothed profiles overlying the photodetector, wherein a top edge of the first outer sidewall is elevated relative to the top surface of the dielectric layer.
20. The device according to claim 14 , wherein the first outer sidewall contacts the substrate.