IP Library › Granted Patent US 12,615,029
Granted Patent B2
US 12,615,029 · App. 18/479,969 · Granted Apr 28, 2026

Acoustic wave device, filter, multiplexer, and wafer

Inventor: Shodai Harai (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/02157H03H9/02031H03H9/133H03H9/568H03H9/703
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Quick Facts
Patent No.
US 12,615,029
App. No.
18/479,969
Granted
Apr 28, 2026
Kind
B2
Abstract

An acoustic wave device includes a substrate, a piezoelectric layer provided on the substrate, at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers having an average pitch equal to or greater than 0.5 times a thickness of the piezoelectric layer, a first insulating layer provided between the substrate and the piezoelectric layer, the first insulating layer having an acoustic velocity of a bulk wave higher than an acoustic velocity of a bulk wave in the piezoelectric layer, and a second insulating layer provided between the first insulating layer and the piezoelectric layer, the second insulating layer having an acoustic velocity of a bulk wave higher than the acoustic velocity of the bulk wave in the first insulating layer.

Claims (50)

1 . An acoustic wave device comprising:

a substrate;

a piezoelectric layer provided on the substrate;

at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers having an average pitch equal to or greater than 0.5 times a thickness of the piezoelectric layer;

a first insulating layer provided between the substrate and the piezoelectric layer, the first insulating layer having an acoustic velocity of a bulk wave higher than an acoustic velocity of a bulk wave in the piezoelectric layer;

a second insulating layer provided between the first insulating layer and the piezoelectric layer, the second insulating layer having an acoustic velocity of a bulk wave higher than the acoustic velocity of the bulk wave in the first insulating layer, and

a third insulating layer provided between the piezoelectric layer and the second insulating layer, the third insulating layer being a silicon oxide layer or a silicon oxide layer to which fluorine is added,

wherein an acoustic velocity of a bulk wave in the substrate is higher than the acoustic velocity of the bulk wave in the second insulating layer, and

wherein a distance between an interface between the second insulating layer and the third insulating layer and an interface between the piezoelectric layer and the at least one pair of comb-shaped electrodes is equal to or less than four times the average pitch.

2 . The acoustic wave device according to claim 1 ,

wherein the piezoelectric layer is a rotated Y-cut X-propagation lithium tantalate substrate, and

wherein the acoustic velocity of the bulk wave in the second insulating layer is equal to or less than 1.1 times the acoustic velocity of the bulk wave in the first insulating layer.

3 . The acoustic wave device according to claim 2 , wherein a thickness of the second insulating layer is equal to or less than three times the average pitch.

4 . The acoustic wave device according to claim 2 , wherein the first insulating layer is a polycrystalline or amorphous aluminum oxide layer.

5 . The acoustic wave device according to claim 2 , wherein the first insulating layer is a polycrystalline or amorphous silicon nitride layer, a polycrystalline or amorphous aluminum nitride layer, or a polycrystalline or amorphous silicon carbide layer.

6 . The acoustic wave device according to claim 1 ,

wherein the piezoelectric layer is a rotated Y-cut X-propagation lithium tantalate substrate,

wherein a thickness of the second insulating layer is equal to or less than four times the average pitch, and

wherein the acoustic velocity of the bulk wave in the second insulating layer is equal to or less than two times the acoustic velocity of the bulk wave in the first insulating layer.

7 . The acoustic wave device according to claim 1 ,

wherein the piezoelectric layer is a rotated Y-cut X-propagation lithium tantalate substrate,

wherein a thickness of the second insulating layer is equal to or less than three times the average pitch, and

wherein the acoustic velocity of the bulk wave in the second insulating layer is equal to or less than 1.35 times the acoustic velocity of the bulk wave in the first insulating layer.

8 . The acoustic wave device according to claim 1 ,

wherein the piezoelectric layer is a rotated Y-cut X-propagation lithium tantalate substrate,

wherein a thickness of the second insulating layer is equal to or less than 0.8 times the average pitch, and

wherein the acoustic velocity of the bulk wave in the second insulating layer is equal to or less than two times the acoustic velocity of the bulk wave in the first insulating layer.

9 . A filter comprising the acoustic wave device according to claim 1 .

10 . A multiplexer comprising the filter according to claim 9 .

11 . An acoustic wave device comprising:

a substrate;

a piezoelectric layer provided on the substrate;

at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers having an average pitch equal to or greater than 0.5 times a thickness of the piezoelectric layer;

a first insulating layer provided between the substrate and the piezoelectric layer, the first insulating layer having an acoustic velocity of a bulk wave higher than an acoustic velocity of a bulk wave in the piezoelectric layer; and

a second insulating layer provided between the first insulating layer and the piezoelectric layer, the second insulating layer having an acoustic velocity of a bulk wave higher than the acoustic velocity of the bulk wave in the first insulating layer,

wherein an acoustic velocity of a bulk wave in the substrate is higher than the acoustic velocity of the bulk wave in the second insulating layer,

wherein no other layer having a thickness equal to or greater than 1/16 times the average pitch is provided between the piezoelectric layer and the second insulating layer,

wherein the piezoelectric layer is a rotated Y-cut X-propagation lithium tantalate substrate, and

wherein the acoustic velocity of the bulk wave in the second insulating layer is equal to or less than 1.1 times the acoustic velocity of the bulk wave in the first insulating layer.

12 . A filter comprising the acoustic wave device according to claim 11 .

13 . A multiplexer comprising the filter according to claim 12 .

14 . An acoustic wave device comprising:

a substrate that is a monocrystalline sapphire substrate;

a piezoelectric layer provided on the substrate, the piezoelectric layer being a rotated Y-cut X-propagation lithium tantalate substrate;

at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers having an average pitch equal to or greater than 0.5 times a thickness of the piezoelectric layer;

a first insulating layer provided between the substrate and the piezoelectric layer, the first insulating layer being a polycrystalline or amorphous aluminum oxide layer;

a second insulating layer provided between the first insulating layer and the piezoelectric layer, the second insulating layer having a thickness equal to or less than three times the average pitch, the second insulating layer being a polycrystalline or amorphous aluminum oxynitride layer, a polycrystalline or amorphous aluminum nitride layer, a polycrystalline or amorphous silicon layer, a polycrystalline or amorphous silicon nitride layer, or a polycrystalline or amorphous titanium nitride layer; and

a third insulating layer provided between the piezoelectric layer and the second insulating layer, a distance between an interface between the third insulating layer and the second insulating layer and an interface between the piezoelectric layer and the at least one pair of comb-shaped electrodes being equal to or less than two times the average pitch, the third insulating layer being a silicon oxide layer or a silicon oxide layer to which fluorine is added.

15 . A filter comprising the acoustic wave device according to claim 14 .

16 . A multiplexer comprising the filter according to claim 15 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2023
From: HARAI, SHODAI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 065105/0626 →
Priority Claims (1)
JP 2022-163926 · Oct 12, 2022 · national
Continuity (1)
Related Publication 20240136997A1 · Apr 25, 2024
References Cited (10)
US 10020796B2 · Gilbert et al. · 2018 [cited by applicant]
US 20170033765A1 · Moriya et al. · 2017 [cited by applicant]
US 20180159497A1 · Iwamoto et al. · 2018 [cited by applicant]
US 20210288628A1 · Nishimura · 2021 [cited by examiner]
JP 2015115870A · 2015 [cited by applicant]
JP 2015122566A · 2015 [cited by applicant]
JP 2017034363A · 2017 [cited by applicant]
JP 2019201345A · 2019 [cited by applicant]
JP 2022025374A · 2022 [cited by applicant]
WO WO2017043427A1 · 2017 [cited by applicant]