IP Library › Granted Patent US 12,592,532
Granted Patent B2
US 12,592,532 · App. 18/480,266 · Granted Mar 31, 2026

Contact cleaning for differential communication systems

Inventor: Manuel Hortensia L Meyers (Leuven, BE)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01R43/002B08B13/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,592,532
App. No.
18/480,266
Granted
Mar 31, 2026
Kind
B2
Abstract

A transceiver circuit that includes circuits for cleaning oxidation from input and output pins is disclosed. During a first phase of a cleaning operation, a first cleaner circuit may maintain floating input pins at a voltage level less than a cleaning voltage that is greater than an operating supply voltage. During a second phase of the cleaning operation, the first cleaner circuit may couple the input pins to a ground supply node. A second cleaner circuit may, during the first phase of the cleaning operation, couple the output pins to the cleaning voltage. During the second phase of the cleaning operation, the second cleaner circuit may source respective currents to the output pins.

Claims (45)

1 . An apparatus, comprising:

a logic circuit;

a receiver circuit configured to:

receive data via a plurality of receiver pins; and

send received data to the logic circuit; and

a first cleaner circuit configured, in response to an activation of a cleaning mode, to:

maintain receiver pins of the plurality of receiver pins at respective voltage levels during a first phase of the cleaning mode, wherein the respective voltage levels are less than a cleaning voltage; and

couple the plurality of receiver pins to a ground supply node during a second phase of the cleaning mode.

2 . The apparatus of claim 1 , further comprising:

a transmitter circuit configured to:

receive transmit data from the logic circuit; and

transmit the transmit data via a plurality of transmit pins; and

a second cleaner circuit configured, in response to the activation of the cleaning mode, to:

couple the plurality of transmit pins to the cleaning voltage during the first phase of the cleaning mode; and

source respective currents to the plurality of transmit pins during the second phase of the cleaning mode.

3 . The apparatus of claim 2 , wherein the logic circuit, the receiver circuit, the transmitter circuit, the first cleaner circuit, and the second cleaner circuit are included in a transceiver circuit.

4 . The apparatus of claim 2 , wherein the first cleaner circuit is included in the receiver circuit, and wherein the second cleaner circuit is included in the transmitter circuit.

5 . The apparatus of claim 2 , wherein to couple the plurality of transmit pins to the cleaning voltage during the second phase of the cleaning mode, the second cleaner circuit is further configured to activate, for a predetermined time period, a plurality of transistors coupled between a power supply node and corresponding ones of the plurality of transmit pins, wherein a voltage of the power supply node is the cleaning voltage.

6 . The apparatus of claim 1 , wherein the receiver circuit is configured to receive a plurality of control bits, and wherein the transmitter circuit is configured to relay at least a portion of the plurality of control bits.

7 . The apparatus of claim 1 , wherein to maintain the receiver pins at the respective voltage levels, the receiver circuit is further configured to maintain the receiver pins at their respective voltage levels using corresponding ones of a plurality of diode-connected transistors.

8 . The apparatus of claim 1 , wherein to couple the plurality of receiver pins to the ground supply node during the second phase of the cleaning mode, the first cleaner circuit is further configured, in response to receiving control bits, to activate a plurality of transistors coupled between the ground supply node and corresponding ones of the plurality of receiver pins.

9 . A method, comprising:

activating a cleaning mode for a transceiver circuit;

maintaining, by the transceiver circuit, respective voltage levels of a plurality of receiver pins at corresponding voltage levels less than a cleaning voltage during a first phase of the cleaning mode; and

coupling, by the transceiver circuit, the plurality of receiver pins to a ground supply node during a second phase of the cleaning mode, wherein the second phase of the cleaning mode is subsequent to the first phase of the cleaning mode.

10 . The method of claim 9 , further comprising:

coupling, by the transceiver circuit, a plurality of transmit pins to the cleaning voltage during the first phase of the cleaning mode; and

sourcing, by the transceiver circuit, respective currents to the plurality of transmit pins during the second phase of the cleaning mode.

11 . The method of claim 10 , further comprising, transmitting, via the plurality of transmit pins, at least a portion of a plurality of previously received control bits.

12 . The method of claim 10 , wherein coupling the plurality of transmit pins to the cleaning voltage includes activating, for a predetermined time period, a plurality of transistors coupled between a high-voltage power supply node and corresponding ones of the plurality of transmit pins, wherein a voltage of the high-voltage power supply node is the cleaning voltage.

13 . The method of claim 10 , further comprising, activating, by the transceiver circuit, the second phase in response to determining a predetermined time period has elapsed since activating the first phase.

14 . The method of claim 9 , wherein maintaining the respective voltage levels of the plurality of receiver pins at corresponding voltage levels less than the cleaning voltage during the first phase of the cleaning mode includes coupling, by the transceiver circuit, the plurality of receiver pins to ground via corresponding ones of a plurality of diode-connected transistors.

15 . The method of claim 9 , wherein coupling the plurality of receiver pins to the ground supply node includes, in response to receiving control bits, activating a plurality of transistors coupled between the ground supply node and corresponding ones of the plurality of receiver pins.

16 . An apparatus, comprising:

a logic circuit;

a receiver cleaner circuit configured to:

receive data via a plurality of receiver pins; and

send received data to the logic circuit; and

in response to an activation of a cleaning mode, to:

maintain the receiver pins at respective voltage levels during a first phase of the cleaning mode, wherein the respective voltage levels are less than a cleaning voltage; and

couple the receiver pins to a ground supply node during a second phase of the cleaning mode.

17 . The apparatus of claim 16 , further including a plurality of transmit pins coupled to a transmitter cleaner circuit for transmitting cleaning currents, the logic circuit connected to the transmitter cleaner circuit to send transmit data to the transmitter cleaner circuit.

18 . The apparatus of claim 17 , further including a plurality of diodes connected to the transmit pins in the transmitter cleaner circuit to prevent current flow to a power supply node.

19 . The apparatus of claim 16 , further including a plurality of transistors in the receiver cleaner circuit to maintain voltage node levels when the receiver pins are floating.

20 . The apparatus of claim 19 , wherein the voltage node levels are voltage multiples of the gate-to-source voltages of the transistors.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2023
From: MEYERS, MANUEL HORTENSIA L.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065110/0622 →
Continuity (1)
Related Publication 20250112430A1 · Apr 3, 2025
References Cited (8)
US 5688308A · Voigts · 1997 [cited by examiner]
US 5761463A · Allen · 1998 [cited by examiner]
US 10819382B2 · Kain · 2020 [cited by examiner]
US 20180088067A1 · Gupta · 2018 [cited by examiner]
US 20230182752A1 · Soriano · 2023 [cited by applicant]
DE 102022001818B4 · 2024 [cited by applicant]
Semiconductor Components Industries, LLC, “3.3 V LVDS High Speed Differential Driver/Receiver”, FIN1019/D, Rev. 1, Nov. 2022, 15 pages. [cited by applicant]
Semiconductor Components Industries, LLC, “High Speed Low Power CAN, CAN FD Transceiver”, NCV7344/D, Rev. 4, Aug. 2021, 15 pages. [cited by applicant]