IP Library Granted Patent US 12,166,062
Granted Patent B2
US 12,166,062 · App. 18/486,818 · Granted Dec 10, 2024

Solid-state imaging device, driving method therefor, and electronic apparatus

Inventors: Akira Tanaka (Kanagawa, JP); Shohei Shimada (Tokyo, JP)
Assignee: Sony Group Corporation
H01L27/14643H01L27/146H01L27/14605H01L27/14612H01L27/14641H01L27/14645H01L27/14647H01L27/14667H04N25/134H04N25/136H04N25/17H04N25/57H04N25/583H04N25/702H04N25/704H04N25/76H04N25/778H01L27/14621H01L27/14627
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Quick Facts
Patent No.
US 12,166,062
App. No.
18/486,818
Granted
Dec 10, 2024
Kind
B2
Abstract

The present technology relates to a solid-state imaging device, a driving method therefor, and an electronic apparatus capable of acquiring a signal to detect phase difference and a signal to generate a high dynamic range image at the same time. The solid-state imaging device includes a pixel array unit in which a plurality of pixels that receives light of a same color is arranged under one on-chip lens. The plurality of pixels uses at least one pixel transistor in a sharing manner, some pixels out of the plurality of pixels are set to have a first exposure time, and other pixels are set to have a second exposure time shorter than the first exposure time. The present technology can be applied to, for example, a solid-state imaging device or the like.

Claims (43)

1. An imaging device, comprising:

a floating diffusion region;

a plurality of photoelectric conversion regions coupled to the floating diffusion region, the plurality of photoelectric conversion regions including sixteen photoelectric conversion regions arranged in a matrix;

sixteen transfer transistors, wherein each of the photoelectric conversion regions is associated with a respective transfer transistor;

a reset transistor;

an amplification transistor;

a select transistor; and

four on-chip lenses, wherein each on-chip lens is disposed above a respective four of the photoelectric conversion regions.

2. The imaging device of claim 1 , wherein a first four of the transfer transistors are connected to a first signal line, eight of the transfer transistors are connected to a second signal line, and a second four of the transfer transistors are connected to a third signal line.

3. The imaging device of claim 2 , wherein the first four of the transfer transistors are associated with a first four of the photoelectric conversion region, the eight of the transfer transistors are associated with a first four of the photoelectric conversion region, and the second four of the transfer transistors are associated with a second four of the photoelectric conversion region.

4. The imaging device of claim 3 , wherein each of the first four photoelectric conversion regions are in different rows of the matrix, each of the second four photoelectric conversion regions are in different rows of the matrix, each of the first four photoelectric conversion regions are in one of a first two columns of the matrix, and each of the second four photoelectric conversion regions are in a second two columns of the matrix.

5. The imaging device of claim 1 , wherein the matrix is a four-by-four matrix.

6. The imaging device of claim 1 , wherein a first photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in a first row and a first column, a second photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in the first row and a second column, a third photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in a second row and the first column, a fourth photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in the second row and the second column, and each of the photoelectric conversion regions share the floating diffusion region.

7. The imaging device of claim 1 , wherein the reset transistor, the amplification transistor, and the select transistor are used by each of the photoelectric conversion regions.

8. An electronic apparatus comprising a solid-state imaging device, the solid-state imaging device comprising:

a floating diffusion region;

a plurality of photoelectric conversion regions coupled to the floating diffusion region, the plurality of photoelectric conversion regions including sixteen photoelectric conversion regions arranged in a matrix;

sixteen transfer transistors, wherein each of the photoelectric conversion regions is associated with a respective transfer transistor;

a reset transistor;

an amplification transistor;

a select transistor; and

four on-chip lenses, wherein each on-chip lens is disposed above a respective four of the photoelectric conversion regions.

9. The electronic apparatus of claim 8 , wherein a first four of the transfer transistors are connected to a first signal line, eight of the transfer transistors are connected to a second signal line, and a second four of the transfer transistors are connected to a third signal line.

10. The electronic apparatus of claim 9 , wherein the first four of the transfer transistors are associated with a first four of the photoelectric conversion region, the eight of the transfer transistors are associated with a first four of the photoelectric conversion region, and the second four of the transfer transistors are associated with a second four of the photoelectric conversion region.

11. The electronic apparatus of claim 10 , wherein each of the first four photoelectric conversion regions are in different rows of the matrix, each of the second four photoelectric conversion regions are in different rows of the matrix, each of the first four photoelectric conversion regions are in one of a first two columns of the matrix, and each of the second four photoelectric conversion regions are in a second two columns of the matrix.

12. The electronic apparatus of claim 8 , wherein the matrix is a four-by-four matrix.

13. The electronic apparatus of claim 8 , wherein a first photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in a first row and a first column, a second photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in the first row and a second column, a third photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in a second row and the first column, a fourth photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in the second row and the second column, and each of the photoelectric conversion regions share the floating diffusion region.

14. The electronic apparatus of claim 8 , wherein the reset transistor, the amplification transistor, and the select transistor are used by each of the photoelectric conversion regions.

15. A driving method for a solid-state imaging device, wherein:

the solid-state imaging device comprises:

a floating diffusion region;

a plurality of photoelectric conversion regions coupled to the floating diffusion region, the plurality of photoelectric conversion regions including sixteen photoelectric conversion regions arranged in a matrix;

sixteen transfer transistors, wherein each of the photoelectric conversion regions is associated with a respective transfer transistor;

a reset transistor;

an amplification transistor;

a select transistor; and

four on-chip lenses, wherein each on-chip lens is disposed above a respective four of the photoelectric conversion regions; and

the method comprises using a pixel signal output by each of the photoelectric conversion regions for phase detection and image generation.

16. The method of claim 15 , wherein a first four of the transfer transistors are connected to a first signal line, eight of the transfer transistors are connected to a second signal line, and a second four of the transfer transistors are connected to a third signal line.

17. The method of claim 16 , wherein the first four of the transfer transistors are associated with a first four of the photoelectric conversion region, the eight of the transfer transistors are associated with a first four of the photoelectric conversion region, and the second four of the transfer transistors are associated with a second four of the photoelectric conversion region.

18. The method of claim 17 , wherein each of the first four photoelectric conversion regions are in different rows of the matrix, each of the second four photoelectric conversion regions are in different rows of the matrix, each of the first four photoelectric conversion regions are in one of a first two columns of the matrix, and each of the second four photoelectric conversion regions are in a second two columns of the matrix.

19. The method of claim 15 , wherein the matrix is a four-by-four matrix.

20. The method of claim 15 , wherein a first photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in a first row and a first column, a second photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in the first row and a second column, a third photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in a second row and the first column, a fourth photoelectric conversion region of the plurality of photoelectric conversion regions is disposed in the second row and the second column, and each of the photoelectric conversion regions share the floating diffusion region.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2023
From: TANAKA, AKIRA; SHIMADA, SHOHEI
To: SONY CORPORATION
Reel/Frame 065215/0742 →
CHANGE OF NAME Recorded Oct 13, 2023
From: SONY CORPORATION
To: SONY GROUP CORPORATION
Reel/Frame 065361/0067 →
Priority Claims (1)
JP 2016-008728 · Jan 20, 2016 · national
Continuity (3)
Continuation 17524969 · Nov 12, 2021
Continuation 16069652
Related Publication 20240047502A1 · Feb 8, 2024