Fingerprint sensor and button combinations and methods of making same
A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.
1. A sensor assembly, comprising:
a flexible circuit substrate; and
an encapsulated sensor package mounted on the flexible circuit substrate;
wherein the encapsulated sensor package comprises multiple layers and multiple types of signal traces;
wherein encapsulation material of the encapsulated sensor package encapsulates the multiple layers and forms an upper sensor surface of a biometric sensor providing an interface for a finger or other input object;
wherein the encapsulated sensor package further comprises a button switch, wherein the button switch is configured to be depressed based on the finger or other input object being pressed against the upper sensor surface formed by the encapsulation material;
wherein the biometric sensor comprises a chip-on-flex fingerprint sensor having sensor tracer elements formed on the flexible circuit substrate;
wherein the sensor assembly comprises a housing having side walls disposed around the encapsulated sensor package and a base disposed below the encapsulated sensor package;
wherein the base of the housing comprises an aperture through which the flexible circuit substrate passes; and
wherein the flexible circuit substrate connects the encapsulated sensor package to an integrated circuit chip of the biometric sensor disposed away and separate from the housing.
2. The sensor assembly according to claim 1 , wherein the sensor assembly is disposed within an opening in a mobile device housing, and the upper sensor surface is flush with an outer surface of the mobile device housing.
3. The sensor assembly according to claim 1 , wherein the flexible circuit substrate is configured to flex based on the finger or other input object being pressed against the upper sensor surface, and wherein the sensor assembly further comprises one or more stops configured to limit flexing of the flexible circuit substrate.
4. The sensor assembly according to claim 1 , wherein the button switch comprises:
a depression member; and
a toggling two position element;
wherein the depression member and the toggling two position element being in contact with one another corresponds to a closed state of the button switch, and the depression member and the toggling two position element not being in contact with one another corresponds to an open state of the button switch.
5. The sensor assembly according to claim 1 , wherein an adhesive or potting material is disposed in the aperture around the flexible circuit substrate.
6. The sensor assembly according to claim 1 , further comprising:
an insert support configured to secure and stabilize the flexible circuit substrate, wherein the flexible circuit substrate is wrapped around the insert support.
7. The sensor assembly according to claim 6 , wherein the insert support is clipped into the housing.
8. The sensor assembly according to claim 6 , wherein a combination of the insert support and the flexible circuit substrate is clipped into the housing.
9. A sensor assembly, comprising:
a flexible circuit substrate; and
an encapsulated sensor package mounted on the flexible circuit substrate;
wherein the encapsulated sensor package comprises multiple layers and multiple types of signal traces;
wherein encapsulation material of the encapsulated sensor package encapsulates the multiple layers and forms an upper sensor surface of a biometric sensor providing an interface for a finger or other input object;
wherein the encapsulated sensor package further comprises a button switch, wherein the button switch is configured to be depressed based on the finger or other input object being pressed against the upper sensor surface formed by the encapsulation material;
wherein the biometric sensor comprises a chip-on-flex fingerprint sensor having sensor tracer elements formed on the flexible circuit substrate;
wherein the sensor assembly comprises a housing having a base disposed below the encapsulated sensor package;
wherein the encapsulation material of the upper sensor surface is over-molded such that it extends over and at least partly surrounds a side of the housing;
wherein the base of the housing comprises an aperture through which the flexible circuit substrate passes; and
wherein the flexible circuit substrate connects the encapsulated sensor package to an integrated circuit chip of the biometric sensor disposed away and separate from the housing.
10. The sensor assembly according to claim 9 , wherein the sensor assembly is disposed within an opening in a mobile device housing, and the upper sensor surface is flush with an outer surface of the mobile device housing.
11. The sensor assembly according to claim 9 , wherein the flexible circuit substrate is configured to flex based on the finger or input object being pressed against the upper sensor surface, and wherein the sensor assembly further comprises one or more stops configured to limit flexing of the flexible circuit substrate.
12. The sensor assembly according to claim 9 , wherein the button switch comprises:
a depression member; and
a toggling two position element;
wherein the depression member and the toggling two position element being in contact with one another corresponds to a closed state of the button switch, and the depression member and the toggling two position element not being in contact with one another corresponds to an open state of the button switch.
13. The sensor assembly according to claim 9 , wherein an adhesive or potting material is disposed in the aperture around the flexible circuit substrate.
14. The sensor assembly according to claim 9 , further comprising:
an insert support configured to secure and stabilize the flexible circuit substrate, wherein the flexible circuit substrate is wrapped around the insert support.
15. The sensor assembly according to claim 14 , wherein the insert support is clipped into the housing.
16. The sensor assembly according to claim 14 , wherein a combination of the insert support and the flexible circuit substrate is clipped into the housing.