IP Library › Patent Application 18497762
Patent Application
App. No. 18/497,762

ELECTRICALLY CONDUCTIVE COMPOSITIONS CAPABLE OF SINTERING

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Patent No.
US None
App. No.
18/497,762
Abstract

Provided herein is an electrically conductive composition capable of sintering. More particularly, the electrically conductive composition comprises sinterable silver particles dispersed in a binder resin, which binder resin is not yet in a fully cured state when the composition is heated to a temperature at which the silver particles start to sinter.

Claims (15)

1 . A curable or sinterable composition, comprising:

in an amount of about 2 to about 15 percent by weight, a binder resin comprising a thermosetting resin; a silane adhesion promoter; and a curing agent;

in an amount of about 65 to about 93 percent by weight, a silver particle component;

in an amount of about 1 to about 10 percent by weight, one or more fillers having a particle size in a range of about 1 μm to about 20 μm, and selected from the group consisting of polymeric materials, inorganic materials and combinations thereof; and

optionally an organic diluent,

wherein

the composition, when cured or sintered, has a shear strength on 7×7 mm die of at least 25 kg/mm 2 at 260° C.; and

the composition demonstrates a thermal conductivity of 70 W/m·K.

2 . The electrically conductive composition according to claim 1 , wherein the silver particle component comprises silver particles having two different particle size ranges.

3 . The electrically conductive composition according to claim 1 , wherein the silver particle component comprises silver powder having a tap density of between 1 to about 7 g/cm 3 and silver flake having a tap density of between 1 to about 7 g/cm 3 .

4 . The electrically conductive composition according to claim 1 , wherein the silver particle component has a mass median diameter (D50) of from 0.3 to 6.0 um.

5 . The electrically conductive composition according to claim 1 , wherein the specific surface area of the silver particle component is less than 1.5 m 2 /g.

6 . The electrically conductive composition according to claim 1 , wherein the binder resin comprises a hydrogenated aromatic epoxy resin, a cycloaliphatic epoxy resin or a mixture thereof.

7 . The electrically conductive composition according to claim 1 , wherein the binder resin comprises an epoxy resin selected from the group consisting of 1,2-cyclohexanedicarboxylic acid diglycidyl ester; bis(4-hydroxycylohexyl)methanediglycidyl ether; 4-methylhexahydrophthalic acid diglycidyl ester; 2,2-bis(4-hydroxycyclohexyl)propane diglycidyl ether; 3,4-epoxycyclohexylmethyl-3′,4′-epoxycylohexane carboxylate; bis(3,4-epoxycyclohexylmethyl)adipate and mixtures thereof.

8 . The electrically conductive composition according to claim 1 , wherein the binder resin further comprises an epoxy resin selected from the group consisting of urethane-modified epoxy resins; isocyanate-modified epoxy resins; epoxy ester resins; aromatic epoxy resins; and mixtures thereof.