IP Library Patent Application 18501952
Patent Application
App. No. 18/501,952

PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PROCESSING UNITS

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Quick Facts
Patent No.
US None
App. No.
18/501,952
Abstract

A portable baking assembly includes a portable housing, a receiving base, and an air flow assembly. The receiving base is disposed in the portable housing. The receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. The air flow assembly is received in the portable housing and in fluid communication with the receiving base. The air flow assembly includes an inlet conduit that is operable to receive heated air and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.

Claims (29)

1 . A portable baking assembly comprising:

a portable housing;

a receiving base disposed in the portable housing, the receiving base operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution; and

an air flow assembly received in the portable housing and in fluid communication with the receiving base, the air flow assembly including an inlet conduit, wherein the inlet conduit is operable to receive heated air and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.

2 . The portable baking assembly of claim 1 , wherein the air flow assembly includes an exhaust in fluid communication with the receiving base.

3 . The portable baking assembly of claim 2 , wherein the receiving base directs the heated air towards the exhaust to flow out of the portable housing.

4 . The portable baking assembly of claim 3 , wherein the exhaust directs the heated air out of the portable housing opposite the inlet.

5 . The portable baking assembly of claim 1 , wherein the receiving base includes a flow adapter, the flow adapter operable to direct the heated air to flow across the processing unit assembly to uniformly heat the processing unit assembly and cure the thermal interface material.

6 . The portable baking assembly of claim 4 , wherein the flow adapter forms an inlet aperture and an exhaust aperture, wherein the inlet aperture is in fluid communication with the inlet to direct the heat to the processing unit assembly, wherein the exhaust aperture is operable to be in fluid communication with an exhaust such that the heated air flows from the inlet through the inlet aperture to the processing unit assembly and from the processing unit assembly through the exhaust aperture to the exhaust and out of the portable housing.

7 . The portable baking assembly of claim 1 , further comprising an insulative layer received in the portable housing, wherein the insulative layer is operable to receive the inlet conduit and the receiving base.

8 . The portable baking assembly of claim 7 , wherein the insulative layer includes a high-density foam.

9 . The portable baking assembly of claim 7 , wherein the insulative layer is anti-static and non-conductive.

10 . The portable baking assembly of claim 1 , further comprising a thermocouple operable to measure the temperature of the thermal interface material.

11 . The portable baking assembly of claim 10 , further comprising a controller communicably coupled with the thermocouple, the controller operable to receive the measured temperature of the thermal interface material.

12 . The portable baking assembly of claim 11 , wherein the controller is operable to determine when the thermal interface material is cured.

13 . The portable baking assembly of claim 12 , wherein the controller is operable to indicate to a user that the thermal interface material is cured.

14 . A portable system comprising:

a heating device operable to deliver heated air;

a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution;

a portable baking assembly including:

a portable housing;

a receiving base disposed in the portable housing, the receiving base operable to receive the processing unit assembly; and

an air flow assembly received in the portable housing and in fluid communication with the receiving base, the air flow assembly including an inlet conduit in fluid communication with the heating device, wherein the inlet conduit is operable to receive heated air from the heating device and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.

15 . The portable system of claim 14 , wherein the air flow assembly includes an exhaust in fluid communication with the receiving base, wherein the receiving base directs the heated air towards the exhaust to flow out of the portable housing opposite the inlet.

16 . The portable system of claim 14 , wherein the receiving base includes a flow adapter, the flow adapter operable to direct the heated air to flow across the processing unit assembly to uniformly heat the processing unit assembly and cure the thermal interface material.

17 . The portable system of claim 14 , further comprising an insulative layer received in the portable housing, wherein the insulative layer is operable to receive the inlet conduit and the receiving base.

18 . The portable system of claim 14 , further comprising a thermocouple operable to measure the temperature of the thermal interface material and a controller communicably coupled with the thermocouple, the controller operable to receive the measured temperature of the thermal interface material.

19 . The portable system of claim 14 , wherein the heating device includes an adjustable temperature heat gun.

20 . The portable system of claim 14 , wherein the heating device is removably coupled with the portable housing.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2025
From: ZT GROUP INT’L, INC. DBA ZT SYSTEMS
To: AMD DESIGN, LLC
Reel/Frame 072625/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2023
From: CHIGULLAPALLI, SRUTI; ANDERSON, PAUL; PINNU, SUNILKUMAR
To: ZT GROUP INT'L, INC. DBA ZT SYSTEMS
Reel/Frame 065488/0559 →