Thin-film surface-acoustic-wave resonator with aluminum nitride layer

1 . A surface acoustic wave (SAW) resonator comprising:

a substrate layer comprising an Aluminum Nitride (AlN) substrate layer,

an electrode structure comprising an interdigital transducer, and

a piezoelectric layer disposed between the electrode structure and the substrate layer,

wherein the AlN substrate layer is a deposited thin film layer and comprises a Scandium doped thin film layer.

2 . The SAW resonator of claim 1 , wherein the piezoelectric layer comprises lithium tantalate (LT), wherein a crystalline structure of the piezoelectric layer is defined by Euler angles lambda (λ), mu (μ), and theta (θ).

3 . The SAW resonator of claim 2 , wherein a thickness of the piezoelectric layer is approximately 0.4 times a pitch value for fingers of the interdigital transducer.

4 . The SAW resonator of claim 3 , wherein a thickness of the AlN substrate layer is less than four times the pitch value.

5 . The SAW resonator of claim 2 , wherein μ is a value in a range from −80 degrees to −30 degrees.

6 . The SAW resonator of claim 2 , wherein the piezoelectric layer is in a configuration selected from LT0 through LT 60.

7 . The SAW resonator of claim 2 , wherein the piezoelectric layer is in a configuration selected from LT25 through LT 50.

8 . The SAW resonator of claim 2 , wherein a thickness of the piezoelectric layer is between 0.2 and 0.8 times a pitch value for fingers of the interdigital transducer.

9 . The SAW resonator of claim 1 , wherein the Scandium doped thin film layer is configured to adjust a velocity (v sh ) value.

10 . The SAW resonator of claim 9 , wherein the substrate layer further comprises a glass support layer wherein the AlN substrate layer is disposed between the piezoelectric layer and the glass support layer.

11 . The SAW resonator of claim 10 , wherein the glass support layer is doped to match a thermal expansion coefficient of the glass support layer to a thermal expansion coefficient of the piezoelectric layer.

12 . The SAW resonator of claim 1 , wherein the substrate layer further comprises a glass support layer, wherein the AlN substrate layer is disposed between the glass support layer and the piezoelectric layer.

13 . The SAW resonator of claim 12 , wherein the glass support layer is formed of amorphous SiO2.

14 . The SAW resonator of claim 12 , wherein the glass support layer is formed of crystalline SiO2.

15 . The SAW resonator of claim 1 , wherein the AlN substrate layer comprises a ceramic AlN layer.

16 . The SAW resonator of claim 15 , wherein the AlN substrate layer is fabricated comprising a non-piezoelectric layer using ceramic material and unordered polycrystalline AlN or amorphous AlN.

17 . The SAW resonator of claim 1 , further comprising an SiO2 compensation layer between the piezoelectric layer and the AlN substrate layer.

18 . The SAW resonator of claim 17 , wherein the SiO2 compensation layer is approximately between 0.2 and 0.8 a pitch value for fingers of the interdigital transducer.

19 . The SAW resonator of claim 1 , wherein the substrate layer and the piezoelectric layer are configured for excitation of surface waves, and wherein the AlN substrate layer is configured as a fast layer to confine wave energy to a top surface of the SAW resonator.

20 . The SAW resonator of claim 1 , wherein the piezoelectric layer comprises lithium tantalate (LT) or lithium niobate (LN).

21 . The SAW resonator of claim 1 , wherein the AlN substrate layer comprises a single crystal AlN layer.

22 . The SAW resonator of claim 1 , wherein the piezoelectric layer comprises of lithium tantalate (LT), and wherein a Euler angle for the LT is selected from a set of LT Euler angles including of LT15, LT20, LT30, LT36, LT39, LT42, LT46.3, and LT50.

23 . The SAW resonator of claim 1 , wherein the substrate layer further comprises a glass support layer, wherein the AlN substrate layer is disposed between the glass support layer and the piezoelectric layer; and

wherein the glass support layer is doped to match a thermal expansion coefficient of the glass support layer to a thermal expansion coefficient of the piezoelectric layer.

24 . A surface acoustic wave (SAW) resonator comprising:

a glass support layer,

a substrate layer disposed on the glass support layer, the substrate layer comprising an Aluminum Nitride (AlN) substrate layer,

a slow layer disposed on the AlN substrate layer,

an electrode structure comprising an interdigital transducer,

a piezoelectric layer disposed between the electrode structure and the slow layer, and a scandium doped Aluminum Nitride layer (AlScN) layer disposed between the substrate layer and the piezoelectric layer.

25 . The SAW resonator of claim 24 , wherein the slow layer is a silicon oxide (SiO 2 ) layer.

26 . The SAW resonator of claim 24 , wherein the AlScN layer is configured to adjust a velocity (v sh ) value.

27 . A surface acoustic wave (SAW) filter apparatus comprising:

a substrate layer comprising an Aluminum Nitride (AlN) substrate layer,

an electrode structure comprising an interdigital transducer, the interdigital transducer having an input, an output, and a central track, and

a piezoelectric layer disposed between the electrode structure and the substrate layer, wherein a crystalline structure of the piezoelectric layer is defined by Euler angles lambda (λ), mu (μ), and theta (θ), wherein the substrate layer and the piezoelectric layer are configured for excitation of selected electroacoustic wave modes confined by the AlN substrate layer to limit excitation spurious wave modes in a stack structure of the SAW filter apparatus,

wherein the AlN substrate layer is a deposited thin film layer and comprises a Scandium doped thin film layer.

28 . The SAW filter apparatus of claim 27 , wherein the piezoelectric layer comprises Lithium Tantalate, and wherein the Euler angles for the piezoelectric layer are selected in a range from LT0 through LT60.