IP Library › Granted Patent US 11,916,531
Granted Patent B2
US 11,916,531 · App. 17/364,462 · Granted Feb 27, 2024

Acoustic wave device, filter, and multiplexer

Inventors: Toshiharu Nakazato (Tokyo, JP); Shinji Yamamoto (Tokyo, JP); Ryouta Iwabuchi (Tokyo, JP); Naoki Takahashi (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/02102H03H9/0211H03H9/02015H03H9/02157H03H9/02543H03H9/145H03H9/6406
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Quick Facts
Patent No.
US 11,916,531
App. No.
17/364,462
Granted
Feb 27, 2024
Kind
B2
Abstract

An acoustic wave device includes a support substrate, a piezoelectric layer provided over the support substrate, comb-shaped electrodes disposed on the piezoelectric layer, each of the comb-shaped electrodes including electrode fingers exciting an acoustic wave, a temperature compensation film interposed between the support substrate and the piezoelectric layer and having a temperature coefficient of an elastic constant opposite in sign to that of the piezoelectric layer, a boundary layer interposed between the support substrate and the temperature compensation film, an acoustic velocity of a bulk wave propagating through the boundary layer being higher than an acoustic velocity of a bulk wave propagating through the temperature compensation film and being lower than an acoustic velocity of a bulk wave propagating through the support substrate, and an intermediate layer interposed between the support substrate and the boundary layer and having a Q factor less than a Q factor of the boundary layer.

Claims (18)

1. An acoustic wave device comprising:

a support substrate:

a piezoelectric layer provided over the support substrate;

a pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the pair of comb-shaped electrodes including electrode fingers that excite an acoustic wave;

a temperature compensation film interposed between the support substrate and the piezoelectric layer and having a temperature coefficient of an elastic constant opposite in sign to a temperature coefficient of an elastic constant of the piezoelectric layer;

a boundary layer interposed between the support substrate and the temperature compensation film, an acoustic velocity of a bulk wave propagating through the boundary layer being higher than an acoustic velocity of a bulk wave propagating through the temperature compensation film and being lower than an acoustic velocity of a bulk wave propagating through the support substrate; and

an intermediate layer interposed between the support substrate and the boundary layer and having a Q factor less than a Q factor of the boundary layer.

2. The acoustic wave device according to claim 1 , wherein a thickness of the intermediate layer is equal to or greater than 0.1 times an average pitch of the electrode fingers of the pair of comb-shaped electrodes, and the Q factor of the intermediate layer is equal to or less than 0.2 times the Q factor of the boundary layer.

3. The acoustic wave device according to claim 1 , wherein a thickness of the boundary layer is equal to or greater than 2.2 times an average pitch of the electrode fingers of the pair of comb-shaped electrodes.

4. The acoustic wave device according to claim 1 , wherein a distance between a first surface, which is closer to the support substrate, of the temperature compensation film and a second surface, which is closer to the pair of comb-shaped electrodes, of the piezoelectric layer is equal to or less than 4 times an average pitch of the electrode fingers of the pair of comb-shaped electrodes.

5. The acoustic wave device according to claim 1 , wherein the boundary layer is in contact with the intermediate layer.

6. The acoustic wave device according to claim 1 , wherein a thickness of the boundary layer is equal to or less than 10 times an average pitch of the electrode fingers of the pair of comb-shaped electrodes.

7. The acoustic wave device according to claim 1 , wherein a main component of the boundary layer is the same as a main component of the intermediate layer.

8. The acoustic wave device according to claim 1 , wherein the piezoelectric layer is mainly composed of lithium tantalite or lithium niobate and is monocrystalline, the temperature compensation film is mainly composed of silicon oxide and is polycrystalline or amorphous, the boundary layer is mainly composed of aluminum oxide and is polycrystalline or amorphous, and the intermediate layer is mainly composed of aluminum oxide and is polycrystalline or amorphous.

9. A filter comprising:

the acoustic wave device according to claim 1 .

10. A multiplexer comprising:

the filter according to claim 9 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2021
From: NAKAZATO, TOSHIHARU; YAMAMOTO, SHINJI; IWABUCHI, RYOUTA; TAKAHASHI, NAOKI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 056724/0849 →
Priority Claims (2)
JP 2020-128156 · Jul 29, 2020 · national
JP 2021-022002 · Feb 15, 2021 · national
Continuity (1)
Related Publication 20220038071A1 · Feb 3, 2022