IP Library › Granted Patent US 12,495,198
Granted Patent B2
US 12,495,198 · App. 18/504,589 · Granted Dec 9, 2025

Camera module

Inventor: Kangjin Lee (Suwon-si, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
H04N23/55G03B17/02H04N23/51
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Quick Facts
Patent No.
US 12,495,198
App. No.
18/504,589
Granted
Dec 9, 2025
Kind
B2
Abstract

A camera module includes a cover; a housing having an inner space covered by the cover; a folded module including a reflective member reflecting incident light; a lens module including a plurality of lenses transferring, in a direction of an optical axis, light reflected from the reflective member through the inner space of the housing; an image sensor module including an image sensor sensing light transferred through the lens module, and a sensor circuit board having a first surface on which the image sensor is mounted; and an external circuit connection portion configured to connect to a connection edge of the sensor circuit board and extend outside the housing to be connectable to an external circuit. The connection edge includes a first edge portion disposed between imaginary surfaces extending from the opposing outer surfaces of the cover, and a second edge portion protruding farther outward than the first edge portion.

Claims (47)

1 . A camera module comprising:

a cover having opposing outer surfaces;

a housing having an inner space covered by the cover;

a folded module comprising a reflective member reflecting incident light;

a lens module comprising a plurality of lenses transferring, in a direction of an optical axis, light reflected from the reflective member through the inner space of the housing;

an image sensor module comprising an image sensor sensing light transferred through the lens module, and a sensor circuit board having a first surface on which the image sensor is mounted; and

an external circuit connection portion configured to connect to a connection edge at a side edge of the sensor circuit board and extend outside the housing to be connectable to an external circuit,

wherein the connection edge comprises a first edge portion disposed between imaginary surfaces extending from the opposing outer surfaces of the cover, and a second edge portion protruding farther outward than the first edge portion, and

wherein the first edge portion is spaced apart from an imaginary surface of the imaginary surfaces to which one outer surface of the cover extends to an inner side where the optical axis is disposed.

2 . The camera module of claim 1 , wherein the second edge portion is disposed to contact another imaginary surface of the imaginary surfaces to which the one outer surface of the cover extends.

3 . The camera module of claim 1 , further comprising a first reinforcing plate disposed on a second surface, opposing the first surface, of the sensor circuit board,

wherein the first reinforcing plate comprises a third edge portion and a fourth edge portion corresponding to the first edge portion and the second edge portion, respectively, of the sensor circuit board, and the third edge portion is disposed between the imaginary surfaces, and the fourth edge portion protrudes outward farther than the third edge portion.

4 . The camera module of claim 3 , wherein the external circuit connection portion further includes a flexible circuit board having one end connected to the connection edge of the sensor circuit board, and a connection circuit board connected to another end of the flexible circuit board, and

the flexible circuit board is connected and disposed at the first edge portion of the sensor circuit board.

5 . The camera module of claim 4 , wherein the flexible circuit board is bent and disposed between the imaginary surfaces, and the connection circuit board is seated on an outer surface of the first reinforcing plate.

6 . The camera module of claim 5 , wherein the flexible circuit board does not protrude beyond the imaginary surfaces.

7 . The camera module of claim 5 , wherein the connection circuit board does not protrude beyond the imaginary surfaces.

8 . The camera module of claim 5 , further comprising a second reinforcing plate attached to one surface of the connection circuit board,

wherein the second reinforcing plate is disposed between the first reinforcing plate and the connection circuit board.

9 . The camera module of claim 4 , wherein a planar area of the connection circuit board is smaller than a planar area of the sensor circuit board.

10 . The camera module of claim 4 , further comprising a connector portion connected to the external circuit connection portion,

wherein the connector portion includes a connector connection circuit having one end connected to one edge of the connection circuit board, a connector board connected to another end of the connector connection circuit, and a connector disposed on the connector board.

11 . The camera module of claim 10 , wherein the connector portion is disposed between the imaginary surfaces.

12 . The camera module of claim 1 , wherein the first edge portion and the second edge portion are parallel to each other and extend in a light incidence direction.

13 . A camera module comprising:

a cover having opposing outer surfaces;

a housing having an inner space covered by the cover;

a folded module including a reflective member reflecting incident light;

a lens module comprising a plurality of lenses transferring, in a direction of an optical axis, light reflected from the reflective member through the inner space of the housing;

an image sensor module comprising an image sensor sensing light transferred through the lens module, and a sensor circuit board having a first surface on which the image sensor is mounted; and

an external circuit connection portion configured to connect to a connection edge at a side edge of the sensor circuit board and extend outside the housing to be connectable to an external circuit,

wherein the connection edge comprises a first edge portion that is disposed by being retreated inward from an imaginary surface to which one outer surface of the cover extends to an inner side where the optical axis is disposed, and a second edge portion that is disposed to contact the imaginary surface.

14 . The camera module of claim 13 , wherein the external circuit connection portion further includes a flexible circuit board having one end connected to the connection edge of the sensor circuit board, and a connection circuit board connected to another end of the flexible circuit board, and

the flexible circuit board is connected and disposed at the first edge portion of the sensor circuit board.

15 . The camera module of claim 14 , wherein the flexible circuit board does not protrude beyond imaginary surfaces extending from the opposing outer surfaces of the cover.

16 . The camera module of claim 13 , wherein the first edge portion and the second edge portion are parallel to each other and extend in a light incidence direction.

17 . A camera module comprising:

a cover having opposing outer surfaces;

a housing having an inner space covered by the cover;

a folded module including a reflective member reflecting incident light incident;

a lens module comprising a plurality of lenses transferring, in a direction of an optical axis, light reflected from the reflective member through the inner space of the housing;

an image sensor module comprising an image sensor sensing light transferred through the lens module, and a sensor circuit board having a first surface on which the image sensor is mounted; and

an external circuit connection portion configured to connect to a connection edge at a side edge of the sensor circuit board and extend outside the housing to be connectable to an external circuit,

wherein the connection edge of the sensor circuit board is disposed between imaginary surfaces extending from the opposing outer surfaces,

wherein the external circuit connection portion further includes a flexible circuit board having one end connected to the connection edge of the sensor circuit board, and

wherein the flexible circuit board is bent and disposed between the imaginary surfaces.

18 . The camera module of claim 17 , wherein the connection edge of the sensor circuit board and the flexible circuit board are disposed not protrude beyond the imaginary surfaces.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2023
From: LEE, KANGJIN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 065600/0818 →
Priority Claims (2)
KR 10-2023-0002764 · Jan 9, 2023 · national
KR 10-2023-0066401 · May 23, 2023 · national
Continuity (1)
Related Publication 20240236461A1 · Jul 11, 2024
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