IP Library › Granted Patent US 12,615,486
Granted Patent B2
US 12,615,486 · App. 18/514,688 · Granted Apr 28, 2026

In-ear headphone testing system and method

Inventors: Hui Wu (Suzhou City, CN); Chunyan Hu (Suzhou City, CN); Guoyu Fan (Suzhou City, CN)
Assignee: MERRY ELECTRONICS (SUZHOU) CO., LTD.
H04R29/001H04R1/1016H04R1/1091
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Quick Facts
Patent No.
US 12,615,486
App. No.
18/514,688
Granted
Apr 28, 2026
Kind
B2
Abstract

Provided are an in-ear headphone testing system and method. The system includes a to-be-tested in-ear headphone, a terminal device, and a testing device, the terminal device is configured to control the to-be-tested in-ear headphone to output a preset sound, and the testing device includes a base, a sound collection module, a coupling cavity, and a control chip. The control chip is built into the base, the base is connected to the coupling cavity, the sound collection module is placed between the base and the coupling cavity, and the coupling cavity is used for placing the tested in-ear headphone. The sound collection module is configured to collect a sound signal outputted by the tested in-ear headphone. The control chip is configured to process the sound signal to obtain a test result.

Claims (18)

1 . An in-ear headphone testing system, comprising a to-be-tested in-ear headphone, a terminal device, and a testing device, wherein the terminal device is configured to control the to-be-tested in-ear headphone to output a preset sound, and the testing device comprises a base, a sound collection module, a coupling cavity, and a control chip, wherein the control chip is built into the base, the base is connected to the coupling cavity, the sound collection module is placed between the base and the coupling cavity, and the coupling cavity is used for placing the in-ear headphone;

the sound collection module is configured to collect a sound signal outputted by the in-ear headphone; and

the control chip is configured to process the sound signal to obtain a test result;

wherein the control chip comprises a data acquisition module configured to save the sound signal collected by the sound collection module to obtain audio data and a data processing module configured to process the audio data to obtain the test result; and

wherein the data processing module is further configured to transform the audio data from a time domain to a frequency domain to obtain original frequency response information, intercept frequency response information of a set bandwidth from the original frequency response information to obtain intermediate frequency response information, smooth the intermediate frequency response information to obtain target frequency response information, and determine the test result according to the target frequency response information.

2 . The in-ear headphone testing system of claim 1 , wherein the terminal device sends a set frequency sweep signal to the in-ear headphone, and the in-ear headphone outputs the preset sound according to the frequency sweep signal.

3 . The in-ear headphone testing system of claim 1 , wherein the control chip comprises a communication module, wherein the communication module is configured to establish a communication connection between the testing device and the terminal device and send the test result to the terminal device for presentation.

4 . The in-ear headphone testing system of claim 3 , wherein the test result comprises sound sensitivity information and distortion information.

5 . An in-ear headphone testing method, being performed by an in-ear headphone testing system and comprising:

acquiring a sound signal outputted by an in-ear headphone; and

processing the sound signal to obtain a test result;

wherein the in-ear headphone testing system comprises a to-be-tested in-ear headphone, a terminal device, and a testing device, the terminal device is configured to control the to-be-tested in-ear headphone to output a preset sound, and the testing device comprises a base, a sound collection module, a coupling cavity, and a control chip, wherein the control chip is built into the base, the base is connected to the coupling cavity, the sound collection module is placed between the base and the coupling cavity, and the coupling cavity is used for placing the in-ear headphone; and

wherein processing the sound signal to obtain the test result comprises:

obtaining audio data after the sound signal is saved, transforming the audio data from a time domain to a frequency domain to obtain original frequency response information, intercepting frequency response information of a set bandwidth from the original frequency response information to obtain intermediate frequency response information, smoothing the intermediate frequency response information to obtain target frequency response information, and determining the test result according to the target frequency response information.

6 . The in-ear headphone testing method of claim 5 , wherein the target frequency response information represents correspondence between a sound frequency and a sound intensity, and determining the test result according to the target frequency response information comprises:

determining a sound intensity corresponding to a set frequency in the target frequency response information as sound sensitivity information; and

extracting a sound intensity sequence corresponding to a set frequency interval in the target frequency response information and determining distortion information based on the sound intensity sequence.

7 . The in-ear headphone testing method of claim 5 , wherein after the test result is obtained, the in-ear headphone testing method further comprises: displaying the test result.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2023
From: WU, HUI; HU, CHUNYAN; FAN, GUOYU
To: MERRY ELECTRONICS (SUZHOU) CO., LTD.
Reel/Frame 065659/0795 →
Priority Claims (1)
CN 202311075353.3 · Aug 24, 2023 · national
Continuity (1)
Related Publication 20250071494A1 · Feb 27, 2025
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