IP Library › Granted Patent US 12,308,609
Granted Patent B2
US 12,308,609 · App. 18/517,854 · Granted May 20, 2025

Integration of optical gain subassembly with silicon photonics

Inventor: Christopher Doerr (Middletown, NJ)
H01S5/0262H01S5/0265H01S5/146H01S5/50
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Quick Facts
Patent No.
US 12,308,609
App. No.
18/517,854
Granted
May 20, 2025
Kind
B2
Abstract

A system including an optical transceiver, including a first portion of a laser cavity operable to output optical energy; and an optical modulator operable to modulate the optical energy output by the laser; and a temperature-controlled optical gain subassembly optically coupled to the optical transceiver, the optical gain subassembly including a plurality of semiconductor optical amplifiers (SOAs), wherein one SOA of the plurality of SOAs is operable to amplify the optical energy inside a laser cavity.

Claims (22)

1. A system comprising:

an uncooled silicon photonic integrated circuit (PIC) comprising a first portion of a laser cavity operable to output optical energy; and

a temperature-controlled optical subassembly attachable to the uncooled silicon PIC comprising a second portion of a laser cavity; and

the temperature-controlled optical gain subassembly comprising a plurality of semiconductor optical gain elements,

an optical subassembly attachable to the uncooled silicon PIC comprising a second portion of a laser cavity, wherein the optical subassembly is operable to provide cooled optical gain,

wherein the laser cavity comprises the first portion of the laser cavity, wherein a first semiconductor optical gain element of the plurality of semiconductor optical gain elements is operable to amplify the optical energy inside the laser cavity.

2. The system of claim 1 , wherein a laser operable to output via the laser cavity is a tunable laser.

3. The system of claim 1 , wherein a laser operable to output via the laser cavity is a fixed wavelength laser.

4. The system of claim 1 , wherein the plurality of semiconductor optical gain elements comprises:

a second semiconductor optical gain element, wherein the second semiconductor optical gain element is operable to amplify a modulated signal.

5. The system of claim 1 , wherein the plurality of semiconductor optical gain elements comprises:

a second semiconductor optical gain element and a third semiconductor optical gain element, wherein the second semiconductor optical gain element and the third semiconductor optical gain element are operable to amplify a first polarization signal; and

a fourth semiconductor optical gain element and a fifth semiconductor optical gain element, wherein the fourth semiconductor optical gain element and the fifth semiconductor optical gain element are operable to amplify a second polarization signal.

6. The system of claim 1 , wherein the temperature-controlled optical gain subassembly further comprises:

a polarization beam splitter and a waveplate operable to combine the first polarization signal and the second polarization signal into an output optical signal; and

an optical fiber connector operable to output the output optical signal.

7. The system of claim 1 , wherein at least one of the semiconductor optical gain elements comprises a U-shaped optical path geometry.

8. The system of claim 1 further comprising a high-reflective coating disposed on a portion of the optical subassembly.

9. The system of claim 1 , further comprising:

the second portion of the laser cavity within the temperature-controlled optical gain subassembly, wherein the second portion comprises a waveguide coupled to the first semiconductor optical gain element.

10. The system of claim 1 , wherein the temperature-controlled optical gain subassembly is optically coupled to an electro-optical device through a dual lens optical connection.

11. The system of claim 10 , wherein the dual lens optical connection reduces sensitivity to spatial movement between the temperature-controlled optical gain subassembly and the electro-optical device.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2025
From: ACACIA COMMUNICATIONS, INC.
To: ACACIA TECHNOLOGY, INC.
Reel/Frame 070868/0119 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2025
From: DOERR, CHRISTOPHER
To: ACACIA COMMUNICATIONS, INC.
Reel/Frame 070883/0512 →
Continuity (2)
Division 17185472 · Feb 25, 2021
Related Publication 20240088621A1 · Mar 14, 2024
References Cited (1)
US 10038301B1 · Eggleston · 2018 [cited by examiner]