IP Library › Granted Patent US 12,418,106
Granted Patent B2
US 12,418,106 · App. 18/525,735 · Granted Sep 16, 2025

Flexible connector with permeability shield to reduce antenna loss

Inventors: Yao Ding (San Jose, CA); Qi Qi (San Jose, CA)
Assignee: Google LLC
H01Q1/526H01Q1/50H05K1/0216H05K2201/0715H05K2201/10098
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Quick Facts
Patent No.
US 12,418,106
App. No.
18/525,735
Granted
Sep 16, 2025
Kind
B2
Abstract

This document describes apparatuses and techniques for providing a flexible connector between a secondary circuit board and a main logic board with a permeability shield to increase impedance of the flexible connector to reduce antenna loss from an antenna via the flexible connector to the main logic board. For example, an apparatus includes a secondary circuit board supporting one or more control pads and an antenna. A flexible connector includes a plurality of conductive traces configured to electrically couple the one or more control pads of the secondary circuit board to a coupling on a main logic board. A permeability shield is configured to be disposed along one or more portions of the flexible connector. The permeability shield is configured to increase impedance of the flexible connector to reduce antenna loss of the antenna via the control pads and the flexible connector to the main logic board.

Claims (10)

1. An apparatus comprising:

a secondary circuit board supporting one or more control pads and an antenna;

a flexible connector including a plurality of conductive traces configured to electrically couple the one or more control pads of the secondary circuit board to a coupling on a main logic board; and

a permeability shield configured to be disposed along one or more portions of the flexible connector, the permeability shield being configured to increase impedance of the flexible connector to reduce antenna loss of the antenna via the control pads and the flexible connector to the main logic board.

2. The apparatus of claim 1 , wherein the permeability shield includes an electromagnetic compatibility (EMC) suppression film.

3. The apparatus of claim 2 , wherein the EMC suppression film includes a polyimide film supporting or incorporating a high permeability material.

4. The apparatus of claim 3 , wherein the EMC suppression film includes a self-adhesive EMC suppression tape.

5. The apparatus of claim 1 , wherein the flexible connector includes a flat body having a first surface and an opposite second surface, and the permeability shield is disposed on one or both of the first surface and the second surface.

6. The apparatus of claim 1 , wherein the secondary circuit board and the main logic board are received within an electronic device and the one or more portions of the flexible connector where the permeability shield is disposed are selected to avoid sections of the flexible connector where the flexible connector is configured to directly impinge upon surfaces of the main logic board or a housing of the electronic device.

7. The apparatus of claim 1 , wherein the antenna includes a Bluetooth® antenna or a Wi-Fi™ antenna.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2023
From: DING, YAO; QI, QI
To: GOOGLE LLC
Reel/Frame 065734/0967 →
Continuity (2)
Provisional Application 63602971 · Nov 27, 2023
Related Publication 20240097321A1 · Mar 21, 2024
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