Pillars as stops for precise chip-to-chip separation
A stacked device including a first substrate that includes a quantum information processing device, a second substrate bonded to the first substrate, and multiple bump bonds and at least one pillar between the first substrate and the second substrate. Each bump bond of the multiple bump bonds provides an electrical connection between the first substrate and the second substrate. At least one pillar defines a separation distance between a first surface of the first substrate and a first surface of the second substrate. A cross-sectional area of each pillar is greater than a cross-sectional area of each bump bond of the multiple bump bonds, where the cross-sectional area of each pillar and of each bump bond is defined along a plane parallel to the first surface of the first substrate or to the first surface of the second substrate.
1. A device comprising:
a first substrate comprising a quantum information processing device;
a second substrate bonded to the first substrate;
a plurality of bump bonds between the first substrate and the second substrate, each bump bond of the plurality of bump bonds providing an electrical connection between the first substrate and the second substrate; and
at least one pillar between the first substrate and the second substrate, the at least one pillar defining a separation distance between a first surface of the first substrate and a first surface of the second substrate,
wherein a cross-sectional area of each pillar is greater than a cross-sectional area of each bump bond of the plurality of bump bonds, the cross-sectional area of each pillar and of each bump bond being defined along a plane parallel to the first surface of the first substrate or to the first surface of the second substrate, wherein the separation distance between the first surface of the first substrate and the first surface of the second substrate is between approximately 0.5 micron to approximately 1 micron.
2. The device of claim 1 , wherein the plurality of bump bonds are superconducting bump bonds.
3. The device of claim 2 , wherein the plurality of bump bonds are indium bump bonds.
4. The device of claim 1 , wherein a first bump bond of the plurality of bump bonds provides an electrical connection between the quantum information processing device and a circuit element on the second substrate.
5. The device of claim 1 , wherein the at least one pillar between the first and the second substrate is a superconducting pillar.
6. The device of claim 5 , wherein the at least one pillar is indium.
7. The device of claim 1 , wherein the quantum information processing device on the first substrate is a qubit.
8. The device of claim 1 , wherein the at least one pillar is a ring such that when the first substrate and the second substrate are at the separation distance, the ring surrounds the quantum information processing device on the first substrate.
9. The device of claim 1 , wherein the at least one pillar provides an electrical connection between a circuit element on the first substrate and a circuit element on the second substrate.