Techniques For Shifting Signal Transmission To Compensate For Defects In Pads In Integrated Circuits
An integrated circuit includes first external conductive pads, second external conductive pads, and third external conductive pads. The second external conductive pads are between the first external conductive pads and the third external conductive pads. Repair group circuitry is configurable to shift signal transmission away from one of the first external conductive pads to one of the third external conductive pads if the one of the first external conductive pads has a defect.
1 . An integrated circuit comprising:
first external conductive pads;
second external conductive pads;
third external conductive pads, wherein the second external conductive pads are between the first external conductive pads and the third external conductive pads; and
repair group circuitry configurable to shift first signal transmission away from a first one of the first external conductive pads to a first one of the third external conductive pads.
2 . The integrated circuit of claim 1 further comprising:
fourth external conductive pads, wherein the fourth external conductive pads are between the second external conductive pads and the third external conductive pads.
3 . The integrated circuit of claim 1 , wherein the first external conductive pads and the second external conductive pads are arranged in at least a 2 by 2 array.
4 . The integrated circuit of claim 1 , the repair group circuitry is further configurable to shift second signal transmission away from a second one of the first external conductive pads to a second one of the third external conductive pads.
5 . The integrated circuit of claim 1 , wherein the first external conductive pads, the second external conductive pads, and fourth external conductive pads on a surface of the integrated circuit are arranged in at least a 3 by 3 array.
6 . The integrated circuit of claim 1 , wherein the repair group circuitry is further configurable to shift second and third signal transmission away from second and third ones of the first external conductive pads to second and third ones of the third external conductive pads.
7 . The integrated circuit of claim 1 , wherein the repair group circuitry is further configurable to individually shift any signal transmission away from any of the first external conductive pads to a corresponding one of the third external conductive pads.
8 . The integrated circuit of claim 1 , wherein the repair group circuitry comprises a multiplexer that is configurable to select a signal for transmission through the first one of the third external conductive pads.
9 . The integrated circuit of claim 1 , wherein the repair group circuitry comprises a multiplexer that is configurable to select a signal received from the first one of the third external conductive pads.
10 . The integrated circuit of claim 1 , wherein the first one of the first external conductive pads and the first one of the third external conductive pads are coupled to a first defect repair circuit in the repair group circuitry comprising multiplexers configurable to shift the first signal transmission away from the first one of the first external conductive pads to the first one of the third external conductive pads.
11 . A method for shifting transmission in an integrated circuit, wherein the method comprises:
configuring a first repair group circuit to shift transmission of a first signal from a first one of external pads to a second one of the external pads, wherein a third one of the external pads is between the first and the second ones of the external pads; and
configuring a second repair group circuit to shift transmission of a second signal from a fourth one of the external pads to a fifth one of the external pads, wherein a sixth one of the external pads is between the fourth and the fifth ones of the external pads.
12 . The method of claim 11 , wherein the first, the third, the fourth, and the sixth ones of the external pads are arranged in a 2 by 2 array on a surface of the integrated circuit.
13 . The method of claim 11 further comprising:
configuring a third repair group circuit to shift transmission of a third signal from a seventh one of the external pads to an eighth one of the external pads, wherein a ninth one of the external pads is between the seventh and the eighth ones of the external pads.
14 . The method of claim 13 , wherein the first, the third, the fourth, the sixth, the seventh, and the ninth ones of the external pads and additional ones of the external pads are arranged in a 3 by 3 array on a surface of the integrated circuit.
15 . The method of claim 11 further comprising:
configuring the first repair group circuit to shift transmission of a third signal from the second one of the external pads to a seventh one of the external pads; and
configuring the second repair group circuit to shift transmission of a fourth signal from the fifth one of the external pads to an eighth one of the external pads.
16 . An integrated circuit comprising:
external pads;
a first repair group circuit configurable to shift transmission of a first signal from a first one of the external pads to a second one of the external pads, wherein a third one of the external pads is between the first and the second ones of the external pads; and
a second repair group circuit configurable to shift transmission of a second signal from a fourth one of the external pads to a fifth one of the external pads, wherein a sixth one of the external pads is between the fourth and the fifth ones of the external pads.
17 . The integrated circuit of claim 16 , wherein the first, the third, the fourth, and the sixth ones of the external pads are arranged in a 2 by 2 array on a surface of the integrated circuit.
18 . The integrated circuit of claim 16 further comprising:
a third repair group circuit configurable to shift transmission of a third signal from a seventh one of the external pads to an eighth one of the external pads, wherein a ninth one of the external pads is between the seventh and the eighth ones of the external pads.
19 . The integrated circuit of claim 18 , wherein the first, the third, the fourth, the sixth, the seventh, and the ninth ones of the external pads and additional ones of the external pads are arranged in a 3 by 3 array on a surface of the integrated circuit.
20 . The integrated circuit of claim 16 , wherein the first repair group circuit is configurable to shift transmission of a third signal from the second one of the external pads to a seventh one of the external pads, and wherein the second repair group circuit is configurable to shift transmission of a fourth signal from the fifth one of the external pads to an eighth one of the external pads.