Microfluidic device and method of manufacturing the same
A method of manufacturing a laminate microfluidic device is described herein. Also described is the microfluidic device manufactured via the method of the disclosure, as well as use of the device to perform an assay. The laminate device includes a substrate layer, an adhesive layer having a cured adhesive with one or more channels or recesses formed therein, and a top layer.
1. A method of manufacturing a microfluidic device comprising:
providing a substrate layer;
providing an adhesive layer comprising a curable adhesive, the adhesive layer having a first thickness;
providing a top layer;
forming at least one channel or recess feature in the adhesive layer;
laminating the adhesive layer and the top layer together thereby forming an intermediate laminate;
bonding the intermediate laminate to the substrate layer thereby forming a composite laminate, wherein the adhesive layer of the composite laminate has a second thickness; and
curing the composite laminate to form the microfluidic device, wherein curing comprises treating the composite laminate to promote polymerization of a monomer causing transition of the adhesive layer from the second thickness to a stable and uniform third thickness, and wherein the cured adhesive layer has a stable and uniform thickness across an entire width and length of the device, the stable and uniform thickness having a thickness deviation of less than about 5 μm.
2. The method of claim 1 , wherein the adhesive layer has a thickness deviation of less than about 4, 3, 2 or 1 μm.
3. The method of claim 1 , wherein curing comprises heat, light, pressure, ultrasonic, radiation, moisture, chemical activation and/or chemical treatment.
4. The method of claim 1 , wherein the adhesive layer is composed of a silicone, cyanoacrylate, urethane, acrylic, epoxy or thermoplastic adhesive.
5. The method of claim 1 , wherein the adhesive layer is composed of an acrylic pressure-sensitive adhesive having a base acrylic monomer.
6. The method of claim 1 , wherein the substrate layer and/or the top layer comprises an electrically conductive material.
7. The method of claim 1 , wherein the substrate layer and/or the top layer comprises electronic circuitry.
8. The method of claim 7 , wherein the substrate layer and/or the top layer comprises one or more electrodes.
9. The method of claim 7 , wherein the substrate layer and/or the top layer is a printed circuit board.
10. A method of manufacturing a microfluidic device comprising:
providing a substrate layer;
providing an adhesive layer;
providing a top layer;
forming at least one channel or recess feature in the adhesive layer;
laminating the adhesive layer and the top layer together thereby forming an intermediate laminate;
bonding the intermediate laminate to the substrate layer thereby forming a composite laminate; and
curing the composite laminate to form the microfluidic device.
11. The method of claim 10 , wherein the substrate layer and/or the top layer is optically transparent or semi-transparent.
12. The method of claim 10 , wherein a top surface of the substrate layer and/or a bottom surface of the top layer comprises a functionalized coating or is texturized.
13. A laminate microfluidic device manufactured by the method of claim 10 .
14. The laminate microfluidic device of claim 10 , further comprising an inlet formed in the top layer, the inlet being in fluid communication with the at least one channel.
15. The laminate microfluidic device of claim 10 , wherein the device comprises at least 2 channels and/or recess features.
16. The laminate microfluidic device of claim 10 , wherein the at least one channel comprises a first sidewall portion and a second sidewall portion, wherein the first sidewall portion extends from the inlet to the second sidewall portion, and wherein the first sidewall portion and the second sidewall portion are joined at an angle of between about 30 and 60 degrees.
17. A method of manufacturing a microfluidic device comprising:
laminating an adhesive layer having a first thickness and a top layer together thereby forming an intermediate laminate;
bonding the intermediate laminate to the substrate layer thereby forming a composite laminate, wherein the adhesive layer of the composite laminate has a second thickness; and
curing the composite laminate to form the microfluidic device, wherein curing comprises treating the composite laminate to cause transition of the adhesive layer from the second thickness to a stable and uniform third thickness.
18. The method of claim 17 , wherein curing comprises treating the composite laminate to promote polymerization of a monomer.
19. The method of claim 17 , wherein the cured adhesive layer has a stable and uniform thickness across an entire width and length of the device, the stable and uniform thickness having a thickness deviation of less than about 5 μm.
20. The method of claim 17 , wherein the substrate layer and/or the top layer is composed of glass, silicon, ceramic, metal, polymer, or a combination thereof.