Systems and methods for designing a discrete device product
Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.
1 . A system configured for designing a discrete device product, the system comprising:
one or more hardware processors configured by machine-readable instructions to:
receive from a user a selection of at least one discrete device die and a selection of at least one test condition;
generate a product die configuration using the at least one discrete device die and a predictive modeling module;
generate a graphic design system file using a graphic design system module with the product die configuration;
generate a package bonding diagram using a build diagram system module with the graphic design system file;
generate a product SPICE model corresponding with the product die configuration with a product SPICE model generating module;
provide the product SPICE model to a product simulation module;
generate one or more datasheet characteristics of the discrete device product with the product SPICE model using the product simulation module;
provide the one or more datasheet characteristics to a datasheet formation module;
generate product datasheet for the discrete device product using the graphic design system file, the package bonding diagram, and the one or more datasheet characteristics; and
provide access to the graphic design system file, the package bonding diagram, the product SPICE model, and the product datasheet to the user.
2 . The system of claim 1 , wherein the system is further configured to:
receive a selection of a package type, include the package type in the product die configuration, select a die SPICE model corresponding with the at least one discrete device die, and select a package SPICE model corresponding with the package type for generating the product SPICE model with the product SPICE model generating module.
3 . The system of claim 1 , wherein the predictive modeling module comprises a back propagated model and the back propagated model is used to predict one or more electrical performance parameters of the discrete device product.
4 . The system of claim 1 , wherein the graphic design system module uses one of a native parameterized layout cell (PCELL) or a generic parameterized layout cell (PCELL).
5 . The system of claim 1 , wherein the predictive modeling module comprises a back propagated model generated by fitting data from previous discrete device products.
6 . The system of claim 5 , wherein the back propagated model is used to predict a die dimension, gate pad location, or gate runner.
7 . The system of claim 1 , wherein the build diagram system module uses a virtual clip to generate the package bonding diagram.
8 . A system configured for designing a discrete device product, the system comprising:
one or more hardware processors configured by machine-readable instructions to:
receive from a user a selection of at least one discrete device die and a selection of at least one test condition;
generate a product die configuration the at least one discrete device die and a predictive modeling module comprising a back propagated model generated by fitting data from previous discrete device products;
generate a graphic design system file using a graphic design system module with the product die configuration;
generate a package bonding diagram using a build diagram system module with the graphic design system file; and
generate a product SPICE model corresponding with the product die configuration with a product SPICE model generating module.
9 . The system of claim 8 , where the system is further configured to: receive a selection of a package type, include the package type in the product die configuration, select a die SPICE model corresponding with the at least one discrete device die, and select a package SPICE model corresponding with the package type for generating the product SPICE model with the product SPICE model generating module.
10 . The system of claim 8 , wherein the back propagated model is used to predict one or more electrical performance parameters of the discrete device product.
11 . The system of claim 8 , wherein the back propagated model is used to predict a die dimension, gate pad location, or gate runner.
12 . The system of claim 8 , wherein the graphic design system module uses a native parameterized layout cell (PCELL).
13 . The system of claim 8 , wherein the graphic design system module uses a generic parameterized layout cell (PCELL).
14 . A method of designing a discrete device product, the method comprising:
receiving from a user a selection of at least one discrete device die and a selection of at least one test condition;
generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one discrete device die, the predictive modeling module comprising a back propagated model;
generating, using the processor, a graphic design system file using a graphic design system module with the product die configuration;
generating, using the processor, a package bonding diagram using a build diagram system module with the graphic design system file;
generating, using the processor, a product SPICE model corresponding with the product die configuration using a product SPICE model generating module;
providing, using the processor, the product SPICE model to a product simulation module;
generating, using the processor, one or more datasheet characteristics of the discrete device product with the product SPICE model;
providing, using the processor, the one or more datasheet characteristics to a datasheet formation module;
generating, using the processor, a product datasheet for the discrete device product using the graphic design system file, the package bonding diagram, and the one or more datasheet characteristics; and
providing access to the graphic design system file, the package bonding diagram, the product SPICE model, and the product datasheet to the user.
15 . The method of claim 14 , further comprising: receiving a selection of a package type, including the package type in the product die configuration, selecting a die SPICE model corresponding with the at least one discrete device die, and selecting a package SPICE model corresponding with the package type for generating the product SPICE model with the product SPICE model generating module.
16 . The method of claim 14 , wherein the back propagated model is used to predict one or more electrical performance parameters of the discrete device product.
17 . The method of claim 14 , wherein the back propagated model is used to predict a die dimension, gate pad location, or gate runner.
18 . The method of claim 14 , wherein the graphic design system module uses a native parameterized layout cell (PCELL) or a generic parameterized layout cell (PCELL).
19 . The method of claim 14 , wherein the back propagated model is generated by fitting data from previous discrete device products.
20 . The method of claim 14 , wherein the build diagram system module uses a virtual clip to generate the package bonding diagram.